asm siplace smt umatshini wokubekwa x4s

I-SIPLACE X4S ngumatshini wokubekwa kwemodyuli we-ultra-high-speed owasungulwa yi-ASM Assembly Systems (eyayisakuba yi-Siemens Electronics Assembly Division). Yenye yeemodeli zeflagship yothotho lwe-SIPLACE X. Igxininisa kwisantya esiphezulu, ukuchaneka okuphezulu kunye nemveliso ehlakaniphile. Ifanelekile kwiinkalo ezinkulu kunye ne-high-complexity electronic production fields, ezifana nonxibelelwano lwe-5G, i-automotive electronics, i-electronics high-end, njl.

2. Ukuma kwemarike kunye neenzuzo eziphambili

1. Ukuma kwemarike

Imizi-mveliso ekujoliswe kuyo:

Iindibano ezinkulu zePCB (ezifana neebhodi ze-server, ii-smart phones).

Iindawo ezifuna ukuchaneka okuphezulu (ezifana neerada zemoto, izixhobo zonyango).

Iimeko ezisebenzayo:

Imveliso enkulu (> 1 million amanqaku / ngosuku).

Imveliso exubeneyo ephezulu (ukubekwa okuxutyiweyo kwe-01005 ukuya kumacandelo amakhulu anemilo ekhethekileyo).

2. Iinzuzo eziphambili

Ukubekwa kwe-Ultra-high-speed: isantya sethiyori>150,000 CPH (ixhomekeke kubumbeko).

Ukuchaneka okugqithisileyo: ukuphindaphinda ± 15μm @ 3σ, ukuxhasa 01005, 0.25mm pitch QFN.

Imveliso ehlakaniphile: ihlanganiswe ne-ASM OMS (i-Optimized Manufacturing Suite), exhasa i-Industry 4.0.

Ukwandiswa kwemodyuli: inokudityaniswa neecantilever ezininzi kunye neengoma ezimbini ukufezekisa ukubekwa okufanayo.

III. Ubumbeko lwe-Hardware kunye neempawu zobugcisa

1. Inkqubo yokubeka

Intloko yokubeka:

Intloko ye-SpeedStar: eyenzelwe ngokukodwa amacandelo amancinci amancinci (njenge-0402, 01005).

Intloko ye-MultiStar: ixhasa amacandelo akhethekileyo (njengezikhuselo zokukhusela, izihlanganisi).

Intloko yeForceStar: ngempendulo yoxinzelelo ukuthintela umonakalo wecandelo.

Uqwalaselo lwe-Cantilever: ukhetho lwe-4 cantilevers (uqwalaselo lwe-4D), ukubekwa okuhambelanayo ukuphucula ukusebenza kakuhle.

2. Inkqubo yokunyakaza

I-Linear motor drive: isantya>5 m/s², nciphisa ukungcangcazela.

Isakhiwo se-gantry esiphezulu: qinisekisa ukuzinza kwexesha elide (MTBF> iiyure ze-10,000).

3. Inkqubo yombono

Ikhamera ye-HD ye-12MP: ixhasa ukukhanya kwe-spectral emininzi (obomvu, oluhlaza okwesibhakabhaka, i-infrared).

Ukufunyanwa kwe-laser ye-3D: isetyenziselwa ukulinganisa i-coplanarity yecandelo (njenge-BGA, i-QFN).

Umbono we-on-the-fly: ukulungiswa okuguquguqukayo, akukho mfuneko yokumisa ibhodi.

4. Inkqubo yokutya

I-Smart feeder:

Uyilo lwetrack ezimbini, akukho kumisa utshintsho lwempahla.

I-RFID ichonga ngokuzenzekelayo ulwazi lwetreyi.

Umthamo wesikhululo seMathiriyeli: ixhasa ukuya kuthi ga kwi-300+ 8mm iibhanti zebhanti.

5. Ukulungiswa kweSubstrate

PCB ubukhulu uluhlu: 50mm × 50mm ~ 510mm × 460mm.

Inketho ye-track-track: ixhasa i-double-board synchronous transmission, ukwandisa umthamo wemveliso ngama-30%.

4. Isoftware kunye nemisebenzi ekrelekrele

1. Lawula isoftware

SIPLACE Pro:

Iprogram yegraphical, inkxaso ye-CAD yokungenisa (njengeGerber, Excel).

Ukubeka iliso ngexesha lokwenyani lomgangatho wokubekwa (ienkcukacha-manani ze-SPC).

2. I-ASM OMS (i-Optimized Manufacturing Suite)

Ukulungiswa kweSmart: yabela ngokuzenzekelayo imisebenzi yokubeka kunye nokunciphisa ixesha lokulinda le-cantilever.

Ulondolozo oluqikelelweyo: Hlalutya imeko yesixhobo ngokufunda koomatshini kwaye ulumkise ngeempazamo kwangaphambili.

iwele leDijithali: Ukugunyaziswa okubonakalayo ukunciphisa ixesha lokuphumla komgca wemveliso.

3. Ishishini 4.0 indibaniselwano

Iprotocol ye-SECS/GEM: Uqhagamshelwano olungenamthungo kunye nenkqubo ye-MES/ERP.

Ukuxilongwa okude: I-ASM Cloud Support ngexesha langempela lokusombulula ingxaki.

5. Iiparamitha zokusebenza (itheyibhile yenkcazo)

IiParameters X4S Iinkcukacha

Esona santya sibekiweyo sokubekwa >150,000 CPH (uqwalaselo lwe-4-cantilever)

Ukuchaneka kokubekwa ±15μm @3σ

Uluhlu lwecandelo 01005 ~ 150mm × 50mm

Umthamo wesondlo 300+ (8mm tape)

Ubungakanani beSubstrate 50mm × 50mm ~ 510mm × 460mm

Inkqubo yombono 12MP + 3D laser

Iimfuno zamandla Isigaba sesithathu se-AC 400V, 15kVA

6. Iimeko zesicelo eziqhelekileyo

Imodyuli yonxibelelwano ye-5G: i-PCB ephezulu kakhulu (i-0.3mm pitch BGA).

I-Automotive electronics: ibhodi ye-radar (i-3D coplanarity kufunyaniswe iyafuneka).

I-smartphone: ukubekwa ngesantya esiphezulu kwamacandelo e-01005.

I-motherboard yomncedisi: ukufakwa okuxubileyo kwe-BGA enkulu kunye nee-capacitors ezincinci.

VII. Iimpazamo eziqhelekileyo kunye neengcamango zokulondoloza

1. Ukunyuka kwe-offset

Isizathu: ukutenxa kwindlela yokujonga ulungelelwaniso, ukunxitywa kwe-nozzle, indawo engachanekanga yePCB.

Isisombululo:

Coca ilensi yekhamera kwaye uhlengahlengise.

Qwalasela ixabiso lombhobho wokufunxa (umgangatho>90kPa).

2. Izinga eliphezulu lokuphosa

Isizathu: Impazamo yenyathelo le-Feder, ukuvuza kwevacuum, ukusilela kokuqondwa kwecandelo.

Isisombululo:

Coca igiya yokutya kwaye ulungelelanise i-motor stepper.

Lungiselela iiparamitha zokukhanyisa (ezifana nokongeza ukukhanya kwe-infrared).

3. I-alam ye-Servo (Impazamo ye-Axis)

Isizathu: Ukugcwala kwemoto, ukusilela kwi-encoder, ukuxinana koomatshini.

Isisombululo:

Jonga ukuthanjiswa kwesiporo sikaloliwe.

Qala kwakhona i-drive kwaye ugcine ikhowudi yempazamo.

4. Umxhasi akatyisi

Isizathu: Ibhanti lezinto eziphathekayo linamathele, inzwa ingcolile, kunye nempazamo yombane.

Isisombululo:

Tsala ngesandla izinto ukuphelisa i-jam.

Buyisela umgca wesignali we feeder.

8. Isicwangciso sogcino kunye nenkathalo

1. Ulondolozo lwemihla ngemihla

Mihla le: coca umbhobho kwaye ujonge isihluzo sokucoca.

Ngeveki: thambisa isikhokelo somgca kwaye ulungelelanise i-feeder.

2. Ukulinganisa rhoqo

Ngenyanga:

Ulungelelwaniso lwenkqubo ebonwayo (usebenzisa ibhodi yolungelelwaniso oluqhelekileyo).

Khangela uxinzelelo lwe-Z-axis yentloko yokubeka.

3. Amalungu angundoqo asecaleni

Umbhobho (owodwa ku-01005/0402).

Vacuum generator.

Injini yesondlo.

9. Isishwankathelo

I-ASM SIPLACE X4S ngumatshini wokubekwa okwisantya esiphezulu sokwenza izinto zombane ezikumgangatho ophezulu. Ngesantya se-150,000 CPH, ukuchaneka kwe-± 15μm kunye ne-software ehlakaniphile, ibe sisixhobo sokulinganisa imveliso yobuninzi. Uyilo lwayo lweemodyuli lunokuphendula ngokuguquguqukayo kwiimfuno ezahlukeneyo zemveliso, kwaye ukudityaniswa kweShishini 4.0 kunceda amashishini afezekise ukuphuculwa kwedijithali.

Iingcebiso:

Qhagamshelana nenkxaso yethu yobugcisa kuqala kwiimpazamo ezinzima.

Rhoqo gcina iiparamitha zoomatshini ukunqanda ukulahleka kwedatha.

Ngolwazi oluthe vetshe, jonga kwi-SIPLACE X4S Manual yoBuchule okanye ufumane inkxaso ekude nge-ASM Live Expert.