ASM 00117012 POP Feeder ye feeder ey’obutuufu obw’amaanyi eyakolebwa ku nkola ya Package on Package, ekozesebwa okugabira mu butuufu ebitundu bya package ebya waggulu (nga memory chips ezitumbidde ku processors) mu layini z’okufulumya SMT.
2. Emirimu emikulu
Ategeera okuliisa okukwatagana kw’ebitundu ebirina layeri bbiri (lower layer BGA + upper layer POP)
Awagira 0.35mm ultra-fine pitch n'okuteeka ebitundu mu kifo ekituufu
Nga olina okuzuula obuwanvu bw’ekitundu (0.1mm resolution) .
Enkola ekwataganye ey’obusirusiru (eziyiza ebintu ebikyamu/okusiiga okudda emabega)
II. Ebikwata ku by’ekikugu n’ebipimo
Pulojekiti Ebipimo by’ebyekikugu Enkizo mu kugeraageranya amakolero
Ebitundu ebikozesebwa Ebitundu bya POP (4×4mm okutuuka ku 14×14mm) Ewagira eddoboozi erisinga obutono mu makolero erya 0.3mm
Obutuufu bw’okuliisa ±0.05mm (CPK≥1.67) 50% waggulu okusinga emmere eya bulijjo
Sipiidi y’okuliisa 0.5 seconds/piece (maximum 12,000CPH) Okulongoosa curve ey’amangu, okukendeeza ku kukankana ebitundu 30%
Okukwatagana kwa tape 8mm/12mm/16mm carrier tape Okukyusa otomatiki ku kusika kwa tape (2-5N adjustable)
Okuzuula obuwanvu Okupima obugulumivu bwa layisi (0.01mm resolution) Okuddamu mu kiseera ekituufu eri ekisiki kya Z eky’ekyuma ekiteeka
Empuliziganya interface RS-485 + digital I / O Okuwagira seamless docking ebyuma ASM Siplace
Omutendera gw’obukuumi IP54 (obuziyiza enfuufu n’okufuumuuka) Okukwatagana n’embeera y’omusomo etaliimu nfuufu
III. Ensengeka y’ebyuma n’enkola y’emirimu
1. Ensengeka enkulu
Ekipande
Koodi
2. Enkola y’emirimu
Okutambuza tape: servo motor evuga tape, tension sensor etereeza mu kiseera ekituufu
Okwawula ebitundu: enkola ya ejector efulumya ekitundu okuva mu kisenge ky’omusitula
Okuzuula obuwanvu: laser scanning component coplanarity (okuzuula okuwuguka) .
Okuteeka mu kifo ekituufu: okutereeza okuyambibwako eddirisa okuteekebwa mu kifo ekirabika (±0.01° angle compensation)
IV. Obuyiiya bwa tekinologiya obukulu
Okufuga okusika omuguwa mu ngeri ey’amaanyi
Nga tukozesa buleeki ya butto wa magineeti + enkola ya PID, enkyukakyuka y’okusika ≤±0.2N
Okukwatagana n’obutambi okuva mu bakola eby’enjawulo (nga 3M/Denka)
Enkola ey’amagezi ey’okulwanyisa okutomeragana
Sensulo ya puleesa erondoola obuziyiza bw’okulonda (>3N automatic retraction)
Lemesa entuuyo okutomera ekitundu n’okwonoona
Dizayini y’okukyusa layini mu bwangu
Tape guide Okutereeza nga tolina bikozesebwa (8mm↔12mm switching ewedde mu sikonda 5)
Chip ya NFC ezuula ennamba y’ebintu (ebintu ebiziyiza ebikyamu) .
V. Ensonga eza bulijjo ez’okukozesa
Ennimiro y’okukozesa Enkola eyenjawulo
Ebyuma ebikozesebwa ku ssimu Essimu AP+memory stacking (0.4mm eddoboozi, enjawulo mu buwanvu ≤0.1mm)
Okukola obulungi kompyuta GPU+HBM memory stacking (14×14mm ebitundu ebinene-sayizi)
Ebyuma by’emmotoka Okusiba processor ey’omutindo gw’emmotoka (dizayini egumira okukankana, ekakasibbwa ISO 16750-3)
Ebikozesebwa mu by’obujjanjabi Micro sensor stacking (mode y’ekisenge ekiyonjo, okufulumya obutundutundu <100 obutundutundu/ft3)
VI. Ensobi eza bulijjo n’okugonjoola ebizibu
Fault code Phenomenon Ekikolo ekivaako Ekigonjoola eky’ekikugu
E1701 Okusika omusipi gw’ebintu okutali kwa bulijjo Okukaddiwa kwa buleeki ya butto wa magineeti/okuzibikira kw’omusipi gw’ebintu 1. Kyuusa buleeki (ASM P/N: 00117012-BR)
2. Yoza eggaali y’omukka ekulagirira
E1702 Okulemererwa kw’okusitula ekitundu Okukyama kw’obugulumivu bwa vacuum/lifuti obutamala 1. Kebera layini ya vacuum (≥-80kPa) .
2. Teekateeka stroke y’ekifulumya (0.5±0.05mm) .
E1703 Okuzuula obugulumivu okuva mu kugumiikiriza Laser lens contamination/calibration offset 1. Yoza eddirisa ly’amaaso ne ethanol atalina mazzi
2. Kola laser calibration (standard block yeetaagibwa) .
E1704 Okutaataaganyizibwa kw’empuliziganya RS485 terminal resistor abuze Yongera 120Ω resistor ku nkomerero ya bus
VII. Ebikwata ku ndabirira
1. Okuddaabiriza buli luvannyuma lwa kiseera
Buli lunaku:
Okwoza ekiragiro ky’omusipi gw’ebintu (olugoye olutaliimu nfuufu + IPA) .
Kebera ekyuma ekisengejja empewo (enjawulo ya puleesa <5kPa) .
Buli wiiki:
Siiga ggiya ya transmission (Molykote EM-30L) .
Kalibrate sensa y’okusika (enkola y’obuzito obw’omutindo) .
2. Okuddaabiriza mu buziba
Buli luvannyuma lwa myezi 6:
Kikyuseemu medium ya buleeki ya butto wa magineeti (ASM special magnetic powder)
Okukebera mu bujjuvu enkola y’amaaso (omuwendo gwa MTF ≥ 0.8) .
Buli mwaka:
Ddayo mu kkolero okugezesa bbalansi ey’amaanyi (omuwendo gw’okukankana < 0.8mm/s)
VIII. Okulongoosa n’okukwatagana
1. Enkola z’okulongoosa
Enkyusa ey’amaanyi (00117012-HS):
Sipiidi y’okuliisa yeeyongera okutuuka ku sikonda 0.3/obutundutundu (18,000CPH) .
Upgrade ceramic guide rails (obulamu bwongezeddwayo emirundi 3)
Enkyusa ey’amagezi (00117012-AI):
Okuzuula obulema mu strip ebintu bya AI okugatta (zuula enkwagulo/okukyukakyuka) .
2. Note y’okukwatagana
Ewagira mmotoka za ASM SIPLACE X4 n’okudda waggulu zokka
Yeetaaga firmware version ≥ V5.2.1 (enkyusa enkadde yeetaaga okulongoosebwa)
IX. Obulagirizi bw’enkulaakulana ya tekinologiya
Okugatta IoT:
Okuzuula obulwadde okuva ewala mu ngeri ya 5G kugenda kuwagirwa mu 2025
Okukola ebintu ebirabika obulungi:
Okukola enkyusa y’okukyusakyusa ebintu ebisobola okuvunda