Imashini yo gushyiramo ibikoresho bya ASM SIPLACE CA2 mu buryo bwa Advanced Packaging Machine

Ibikoresho bigezweho byo gupakira hamwe n'ibicuruzwa bigezweho byo gupakira akenshi bisaba ubwoko butandukanye bw'ibice kugira ngo biteranyirizwe ku gice kimwe. Ibice bidakora na IC zipakiye bishobora kuza mu byuma bitanga kaseti n'uruziga, mu gihe ibisigazwa bya semiconductor bidafite ibara bigomba gutorwa mu buryo butaziguye mu cyuma gisukwa, bigasuzumwa, bigashyirwa mu murongo kandi bigashyirwa mu buryo bunoze cyane.

UwitekaASM SIPLACE CA2yakozwe kubera ubu buryo bwo gukora ibintu bitandukanye. Aho gutandukanya uburyo busanzwe bwo gushyiramo SMT no gutunganya die ya direct-wafer mu byiciro byigenga by'ibikoresho, CA2 ihuza uburyo bwombi bwo gushyiramo ibikoresho mu buryo bugezweho. Ishobora gutunganya SMD zitangwa n'ibikoresho, gukora die attach ivuye muri wafer no gushyiramo flip-chip kugira ngo habeho ibyuma bito kandi bihujwe cyane.

Ibi bituma SIPLACE CA2 irushaho kuba ingenzi ku bakora isuzumaibikoresho bya semiconductor die bondkuri module za SiP, ibikoresho by'ikoranabuhanga bikoresha ingufu, ibice byashyizwemo, gupakira ku rwego rwa wafer n'izindi porogaramu aho ubushobozi busanzwe bwa SMT bwonyine budahagije.

Ni ubuhe bwoko bw'imashini ASM SIPLACE CA2?

SIPLACE CA2 isobanurwa neza nk'urubuga rwo gushyiramo ibintu byihuta cyane byo guteranya ibikoresho bya semiconductor na SMT. Ntabwo rugarukira gusa ku isoko imwe y'ibikoresho cyangwa inzira imwe gakondo yo gupakira.

Bitewe n'imiterere y'imashini yashyizweho, CA2 ishobora guhuza imirimo myinshi yo gukora:

• Hitamo ibice bisanzwe bya SMD bivuye mu byuma bitanga kaseti n'uruziga.

• Kuraho ifu zizwi neza mu icupa ryaciwe.

• Shyira udupfunyika twambaye ubusa mu cyerekezo cy'udupfunyika.

• Hindura ushyireho uduce two guteranya uduce duto (flip-chip).

• Ibice by'imikorere bitangwa binyuze mu dusanduku cyangwa mu byuma byihariye bitwara ibintu.

• Shyiraho flux cyangwa ikindi kintu cyo kwinjizamo mbere yo gushyiramo.

• Reba ibyuma n'ibice byabyo mu gihe cyo gushyiramo.

• Andika isano iri hagati y'aho wafer yari iri mbere n'aho substrate yari iri ya nyuma.

Ibisubizo ni urubuga rw'umusaruro rushobora guhuza ibikorwa bisanzwe bifitanye isano n'imashini ikoresha SMT hamwe n'icyuma gikoresha semiconductor die bonder.

Impamvu imirongo yo gupakira iteye imbere ikeneye urubuga rwo gushyiramo ibintu bitandukanye

Umurongo usanzwe wa SMT ukora neza cyane iyo ibikoresho byinshi bitangwa mu byuma bitanga ibikoresho bisanzwe. Gupakira bigezweho biteza ikibazo gitandukanye kuko ibicuruzwa bya nyuma bishobora guhuza ibintu bidakoreshejwe, semiconductors zipakiye, sensors, power dies na ICs zipakiye kuri substrate imwe.

Iyo ibi bikoresho bitunganyirijwe hamwe ku bikoresho bitandukanye, umusaruro ushobora gusaba ko habaho kwimura ibintu, kubika ibintu mu buryo bwo hagati, ahantu hatandukanye ho gukora porogaramu ndetse no gukurikirana ibintu mu buryo bugoye. Inyamaswa zidafite ibara ry’umukara zishobora no gukenera guhindurwamo kaseti yo gupakira mbere yuko zinjira mu buryo busanzwe bwo gushyiramo SMT.

SIPLACE CA2 ikemura iki kibazo cyo gusohora icyuho mu gushyira uburyo bwo gutunganya ifu mu buryo butaziguye mu buryo bwa SMT. Ifu ishobora gukurwa muri wafer ikajyanwa mu buryo bwo kuyishyira hamwe n'ibice bitangwa n'ibikoresho, bigabanye umubare w'ibyiciro byo kuyitunganya bitarangiye.

CA2 ugereranije n'inzira isanzwe yo gukwirakwiza umusaruro

Uburyo bwiza bwo gukora buracyashingiye ku bunini bw'ibicuruzwa, ingano ya die, chemistry y'imikorere, igishushanyo mbonera cy'ubutaka n'ibikorwa remezo by'uruganda bihari. CA2 igira akamaro cyane iyo ibice bya SMT n'ibikomoka ku bimera bitangwa na wafer bigomba gutunganywa kenshi mu muryango umwe w'ibicuruzwa.

Ibisobanuro by'ingenzi bya ASM SIPLACE CA2

Ingano ntarengwa zasohotse zisobanura ubushobozi bwa platform. Umusaruro nyawo uterwa n'umutwe washyizweho, ingano y'icyuma, imiterere ya wafer, imiterere ya substrate, amahitamo yo gukora, ibisabwa mu igenzura n'uruvange rw'ibice.

Gutunganya Wafer mu buryo butaziguye no gutembera kw'ibikoresho

Bumwe mu bushobozi bw'ingenzi bwa CA2 ni ubushobozi bwayo bwo gutunganya imirambo iturutse ku gitambaro cyaciwe. Mu buryo busanzwe bwo gutunganya imirambo, imirambo idafite ibara ishobora kubanza kwimurirwa mu kaseti cyangwa mu kindi gikoresho gisanzwe mbere yo kuyishyiramo.

Gutunganya wafer mu buryo butaziguye bishobora gukuraho cyangwa kugabanya iyo ntambwe yo guhindura hagati. Ibi bishobora gutanga inyungu nyinshi mu mikorere:

• Ibikorwa bike byo gutegura no gukoresha ibikoresho bijyanye na kaseti.

• Kugabanya ibisabwa byo kubika ibikoresho byahinduwe.

• Imyanda mike ya kaseti n'imyanda ijyanye no kongera gupakira.

• Ibikorwa bike byo kongeramo no guhuza ibikoresho bya die.

• Isano ryiza hagati y'amakuru ya wafer-map n'inyandiko za nyuma zo gushyiramo amakuru.

• Gukoresha neza imiti myinshi mu bikoresho bya SiP bigoye.

CA2 ikoresha uburyo bwo gufata wafer no gukoresha die buffering kugira ngo itandukane gutegura die bifata igihe kinini n'uburyo bwo kuyishyiramo. Ubu buryo bujyanye bufasha mu kubungabunga umusaruro mu gihe die zitegurwa kugira ngo zifatwe kandi zishyirwemo.

Gukora Die Attach na Flip-Chip

Aho bashyira Die-Attach

Mu buryo bwo gufatanya n'icyuma gifata, icyuma gifata n'icyuma gikurwa muri wafer kigashyirwa mu cyerekezo gikenewe kuri substrate. Bitewe n'ibicuruzwa n'amahitamo y'imashini, uburyo bushobora kuba burimo gushongesha ibikoresho, kugenzura icyuma no gushyiramo ingufu nkeya.

Gushyiramo Flip-Chip

Guteranya icyuma gifata amapine bisaba ko icyuma gifata amapine kiba cyubakiye neza kugira ngo uruhande rwacyo rukora n'imiterere yacyo ihuze n'igice cy'amazi. Uburyo bwo gushyiramo amapine neza, imiterere y'icyuma gifata amapine, uburyo gifata amapine, uburyo gifata amapine n'uburyo gifata amapine biba ingenzi cyane iyo ingano y'amapine n'intera y'igice ari nto.

Imiterere ya SMT n'imitako ivanze

CA2 ishobora guhuza ibinyabutabire bitangwa na wafer n'ibice bisanzwe byatoranijwe mu bihuyeASM SMT feedersIbi bituma ikintu kimwe kigira resistor, capacitors, ICs zipakiye hamwe n'ubwoko bwinshi bwa bare die nta gufata buri tsinda ry'ibikoresho nk'umushinga wihariye wo guteranya.

Umutwe w'aho ushyirwa n'amahitamo y'ubuziranenge

Iyi mashini ishobora gushyirwaho umutwe wo gushyiramo CP20 kugira ngo ikoreshwe mu buryo bwihuse kandi bunoze. CP20 igenewe ibice bito kandi byoroheje kandi ishyigikira imikorere yo gufata ibintu nta gukoraho no gushyiramo imbaraga nta ngufu.

Ubushobozi bwa CP20 bwasohotse burimo:

• Intera y'ibice itangirira kuri 0201 metric.

• Ingano ntarengwa y'ibice bigera kuri mm 8.2 × 8.2.

• Uburebure bw'igice kugeza kuri mm 4.

• Gushyiramo ibintu bigera ku 38.000 ku isaha kuri buri shusho y'umutwe ikoreshwa.

• Ubushobozi bwo gukoresha neza bugera kuri ± 10 µm kuri 3 sigma.

Icyiciro cy’ubuziranenge gikenewe kigomba gutoranywa hakurikijwe ingano y’icyuma, aho imashini ihurira, ingano y’umupira cyangwa agace k’umugozi, ubushobozi bwo kwihanganira ibintu n’umusaruro w’ibicuruzwa. Imashini yagenewe gushyirwaho µm 20 isanzwe ntigomba kwitwa ko itanga icyiciro cy’uburyo bwo gukora µm 10 gishoboka.

Guhinduranya Wafer no Gukora Multi-Die

Ibikoresho bya SiP bigoye bishobora kuba birimo ubwoko butandukanye bw'ibicuruzwa. Guhindura ibikoresho bya wafer n'intoki kuri buri bwoko bw'ibicuruzwa byatera ikibazo gikomeye mu gukora. Sisitemu yo guhinduranya wafer ya CA2 yagenewe kubungabunga ubwoko bwinshi bw'ibicuruzwa no kwerekana ibikoresho bikenewe mu buryo bwo gushyiramo uko gahunda yo gukora ihinduka.

Hamwe n'imiterere ikenewe, sisitemu ya wafer ishobora kwakira wafer zitandukanye zigera kuri 50. Ubu bushobozi bwo gukoresha multi-die ni ingirakamaro cyane cyane ku bicuruzwa bihuza poroseseri, memory, sensors, itumanaho n'ibice by'amashanyarazi muri paki imwe nto.

Mu gihe usuzuma imashini ihari, emeza:

1. Sisitemu yo guhanahana wafer yashyizweho hamwe n'umubare w'aho wafer ishyirwa.

2. Uduce twa wafer dushyigikiwe hamwe n'ibipimo bya wafer-frame.

3. Igenamiterere rya Wafer ejector, die-flip na buffer-module.

4. Ihuye n'imiterere ya wafer-map isabwa.

5. Ibipimo ntarengwa n'ibipimo ntarengwa by'imashini.

6. Ubunini bw'icyuma gikozwe mu gikoresho n'imiterere yacyo.

7. Amakuru aboneka ku bantu badafite ubushobozi bwo kumenya ibintu bibi n'amakuru azwi ku bantu badafite ubushobozi bwo kumenya ibintu.

Imiterere y'ibice by'ubutaka n'ibijyana

CA2 ishobora gushyirwaho uburyo butandukanye bwo gukoresha substrate aho kuba igengwa na format imwe isanzwe ya PCB.

Imodoka itwara abantu mu muhanda umwe

Imiterere y'umurongo umwe ishobora gushyigikira paneli nini, PCB zishyizwemo hamwe n'ibikoresho byihariye. Imiterere yasohotse igera kuri mm 620 × 700 kugira ngo habeho ibyiciro byatoranijwe byo gukora neza no gutunganya imashini.

Imodoka itwara imizigo ibiri

Gutwara abantu hakoreshejwe inzira ebyiri bikwiranye na PCB zisanzwe na substrates za SiP aho uburyo bwo gufata imiyoboro y'amazi bushobora kunoza imikoreshereze y'imirongo. Ingano zishyigikiwe ziratandukanye bitewe n'uburyo bwo gutwara ibintu bwatoranijwe n'ibisabwa mu buryo bunoze.

Ibikoresho bya Chip-on-Wafer n'ibindi bikoresho byihariye

Amahitamo aboneka ashobora kandi gushyigikira inzira zo gukoresha chip-on-wafer, amasahani ya JEDEC, ubwato bwa J, imbaho ​​nini n'udupira duto. Iyi mikorere igomba kugenzurwa ukurikije imiterere nyayo y'imashini yashyizweho.

Igenzura, Gucukura no Kugenzura Imikorere

Umuvuduko wo gushyiramo ibintu byinshi ntabwo uhagije mu gupakira ibintu mu buryo bugezweho. Uburyo bwo gukora bugomba kandi kugenzura imiterere y'ibikoresho, ubwiza bwabyo, aho biherereye n'uko ibikoresho bikoreshwa.

Bitewe n'amahitamo yatoranijwe, CA2 ishobora gushyigikira:

• Kumenya aho ibice biherereye no kumenya aho biva.

• Igenzura rya die-crack na die-chip.

• Gusuzuma ibintu bivanze cyangwa bivanze.

• Igenzura rya solder-paste mbere cyangwa nyuma yo kuyishyira.

• Gukosora aho ibintu biherereye n'aho biherereye.

• Gutunganya ihererekanya ry'amakuru na sisitemu z'uruganda.

• Gukora ibintu mu buryo bufunze iyo hashyizweho ibikoresho by'igenzura bihuye.

Igice cyo gucukura gikoresha umurongo ugororotse gishobora gukoreshwa aho imiyoboro ikenera gucukura cyangwa ikindi gikoresho cyo kohereza mbere yo gushyiramo. Igikoresho cyo gucukura cyatoranijwe, imiterere y'ibikoresho, uburebure bw'imiyoboro n'imiterere y'igenzura bigomba kuba byujuje ibisabwa kugira ngo bikoreshwe mu buryo nyabwo bwo gucukura no gucukura imiyoboro.

Uburyo bwo gukurikirana urwego rumwe

Guteranya ibikoresho bya semiconductor akenshi bisaba inyandiko zirambuye z'ibikoresho kuruta gukurikirana ibice bisanzwe. CA2 ishyigikira gukurikirana die imwe kuva aho yari iri mbere kuri wafer kugeza aho yarangije kuri substrate yateranijwe.

Ibi bishobora gufasha amakipe y'abakora imyitozo guhuza:

• Amakuru yerekeye ikarita y'imashini ikoresha wafer n'amakuru yerekeye ikarita y'imashini ikoresha wafer.

• Umurongo n'inkingi by'umwimerere by'aho disi iherereye.

• Ibisubizo byo gutoragura no kugenzura.

• Nimero ya nyuma y'ikibaho cyangwa substrate.

• Imiterere y'ibicuruzwa mu gicuruzwa cyuzuye.

• Amakuru y'imikorere n'ibikoresho yakusanyijwe mu gihe cyo guteranya.

Uburyo bwo gukurikirana amakuru bwa nyuma bushingiye kuri porogaramu zashyizweho, aho ikoranabuhanga rikorera, aho abakiriya bahurira ndetse no guhuza porogaramu n’uburyo bwo kuzikora.

Guhuza n'umurongo wo gupakira ugezweho

SIPLACE CA2 ishobora gukoreshwa nk'imashini yo gushyiramo ibikoresho bivanze cyangwa ikanahuzwa n'ibindi bikoresho byihuta kandi by'ubunyangamugayo. ASMPT igaragaza ko mikoroni ya SIPLACE TX ari urubuga rwuzuzanya rwo gukora SiP aho imashini zombi zishyizwe mu murongo umwe.

Imiterere y'umurongo ishobora kuba ikubiyemo:

1. Gupakira no kumenya aho ibintu biri.

2. Gukoresha kole, kole cyangwa gukurura.

3. Igenzura ry'ibikoresho byacapwe cyangwa byatanzwe.

4. Gushyira ibice bisanzwe bya SMD ku muvuduko mwinshi.

5. Gushyiramo agakoresho ko gushyiramo agakoresho kabigenewe mu buryo butaziguye cyangwa gushyiramo uduce duto kuri CA2.

6. Igenzura nyuma yo gushyira umwana mu mwanya we.

7. Gusubiramo, gutunganya cyangwa gupakira nyuma.

8. Igenzura rya nyuma, isuzuma n'iyandikwa ry'uburyo ibipimo byakurikiranwa.

Imiterere nyayo y'umurongo iterwa n'uruhererekane rw'ibikorwa, igihe cyo gufata, uburyo bwo gufata substrate, ibisabwa mu cyumba cyo gusukura ndetse niba CA2 ikora intambwe zose zo gushyiramo cyangwa ibikorwa byihariye byo gutunganya ibyuma gusa.

Ibicuruzwa n'Imikoreshereze Bisanzwe

• Moduli za sisitemu ziri muri Pakeji:Amateraniro ahuza ibyuma byinshi byambaye ubusa, ibyuma bipakiye hamwe n'ibice bidakora.

• Modules z'itumanaho:Pake nto ya RF, 5G, umuyoboro w'itumanaho n'ibikoresho by'ikoranabuhanga bidafite insinga.

• Ibyuma bya elegitoroniki:Moduli zo kugenzura, kugenzura no gushyira hamwe ibintu byinshi zisaba uburyo bwo gukurikirana ibintu mu buryo burambuye.

• Ibikoresho bya semiconductor bikoresha ingufu:Ingufu zipfa kandi zishyigikira ibice bya SMD bikusanyirijwe ku bikoresho byihariye.

• Udupaki two ku rwego rwa wafer:Uburyo bwo gushyira ku biti bya wafer cyangwa ku biti bikomoka ku biti bya wafer.

• Gupfunyika ku rwego rw'ibice:Gupakira bigezweho ku mabara manini.

• Ikoranabuhanga ryashyizwemo:Ibice n'ibice byashyizwe mu byuma bya PCB cyangwa ku byuma byashyizwemo.

• Moduli zo gupima no gupima ibyuma:Ibikoresho bito birimo ibikoresho by'ikoranabuhanga bidafite ishingiro n'ibikoresho by'ikoranabuhanga bigenzura.

• Modules za mudasobwa n'ibikoresho by'ikoranabuhanga:Ibicuruzwa bifite ubucucike bwinshi bisaba imiterere myinshi y'ibice.

Ni ryari SIPLACE CA2 iba amahitamo akwiye?

CA2 igomba kwitabwaho iyo ibisabwa mu gukora birimo byinshi muri ibi bikurikira:

• Icyo gicuruzwa gihuza SMD zitangwa n'ibikoresho byo kugaburira n'ibikoresho byo kunyweramo.

• Inyama zigomba gutorwa mu ifu imwe cyangwa nyinshi.

• Uburyo bwo gufunga no gufunga ibicanisho (flip-chip) birakenewe mu muryango umwe w’ibicuruzwa.

• Umusaruro usaba ubwoko bwinshi bw'ibishishwa hamwe n'impinduka nyinshi z'ibikoresho.

• Ubuziranenge bw'aho ibintu bishyirwa bugomba kugera ku byiciro bya 20 µm, 15 µm cyangwa 10 µm.

• Gukurikirana igice kimwe cy'umubiri birakenewe.

• Uruganda rukora ibintu rushaka kugabanya uburyo bwo gufata ibikoresho mu buryo bw'ikoranabuhanga no kubikoresha mu buryo bw'ikoranabuhanga.

• Ibikoresho bigomba kuvugana na sisitemu za SMT ndetse n'iz'uruganda rwa semiconductor.

• Ibipande binini, uduce twa SiP cyangwa ibikoresho byihariye bigomba gutunganywa.

Imashini yagenewe gukoresha icyuma gifunga icyuma ishobora kuba ikwiriye kurushaho iyo ikoreshwa rikeneye imbaraga zidasanzwe zo gukoresha icyuma gifunga, gushyushya, gukonjesha, gutanga cyangwa ingano zidafite aho zihuriye na CA2. Bityo rero, isuzuma ry'imikorere rigomba kuba ryuzuye mbere yo guhitamo imashini.

Ibikoresho bya ASM SIPLACE CA2 biboneka

Imashini za SIPLACE CA2 zakoreshejwe cyangwa zakoreshejwe mbere zishobora gutandukana cyane nubwo ishusho y'inyuma ari imwe. Sisitemu ya wafer yashyizweho, umutwe wo gushyiramo, umuyoboro, icyiciro cy'ubuziranenge, amahitamo yo kugenzura na porogaramu ni byo bigena ibyo igikoresho kimwe gishobora gutunganya.

Mbere yo gutanga ibiciro, amakuru akurikira ku bikoresho agomba kwemezwa:

Inkunga y'imashini, icyuma gitanga ibikoresho n'ibice bisigaye

Ibikoresho bishobora guhuzwa n'ingano isabwa ya substrate, imiterere ya wafer, urwego rw'ibice, urwego rw'ubuziranenge n'ikoreshwa ry'ibikorwa. Bitewe n'uko bihari, inkunga ishobora kuba ikubiyemo:

• Imashini zuzuye za ASM SIPLACE CA2.

• Imitwe n'ibice by'umutwe bihuye neza.

• Ibice byo guhererekanya wafer n'ibice bikoresha wafer.

• Ibikoresho byo kongerera ibikoresho bya ASM SIPLACE n'ibice bisigaye byo kongerera ibikoresho.

• Utuzu dusanzwe n'utw'imizingo yihariye.

• Kamera, sensors n'ibice by'igenzura.

• Moteri, moteri ziyobora, imbaho ​​zigenzura n'insinga.

• Ibikoresho byo gutwara ibintu n'ibikoresho byo gufata ibintu biri munsi y'ubutaka.

• Gushyiraho, gupakira no gushyigikira kohereza ibicuruzwa mu mahanga.

Amakuru akenewe kugira ngo ibikoresho bihuzwe

Kugira ngo ubone inama nziza ku imashini, tanga:

1. Ibisobanuro by'ibicuruzwa n'uburyo bikorwamo.

2. Uburyo bwo gushyiramo ibintu mu buryo bwa die-attach, flip-chip cyangwa mixed placement bukenewe.

3. Ingano y'icyuma, ubugari n'umurambararo wa wafer.

4. Umubare w'ubwoko butandukanye bw'ibicuruzwa.

5. Pake ntoya kandi nini ya SMD.

6. Ingano, ubugari n'ibikoresho bya substrate.

7. Ubuziranenge busabwa mu gushyira ahantu.

8. Umubare w'umusaruro witezwe ku isaha cyangwa umwaka.

9. Ubushobozi bwo kugaburira, isahani n'ifunguro rya wafer bukenewe.

10. Ibisabwa ku miterere y'uruganda no gukurikirana amakuru.

11. Imiterere y'ibikoresho wifuza n'igihugu ugiye gukoreramo.

Ibibazo Bikunze Kubazwa Ku Bijyanye na ASM SIPLACE CA2

Ni ikihe kibazo cy'umusaruro SIPLACE CA2 ikemura?

Ivuga ku bicuruzwa bisaba ibice bisanzwe bya SMT na semiconductor dies. CA2 izana ububiko bw'ibice bishingiye ku byuma bitanga umusaruro no gutunganya die ya direct-wafer mu buryo buhuriweho n'imashini.

Ese CA2 ishobora gusimbura buri mashini isanzwe yo gufunga?

Nta mashini imwe ikwiriye buri gikorwa cya semiconductor. CA2 yakozwe neza kugira ngo ikoreshwe mu buryo bwihuse cyane, ikoreshwe mu buryo bwa "die attach" na "flip-chip". Uburyo busaba ubushyuhe bwihariye, imbaraga zo guhuza, "curing" cyangwa "die formats" zidasanzwe bugomba gusuzumwa ukwabwo.

Ese imashini isaba ko ibikoresho bishyirwa muri kaseti?

Oya. Bumwe mu bushobozi bwayo bw'ingenzi ni ugutoragura ibyuma bivuye mu icupa ryaciwe. Ishobora kandi gutunganya ibice bisanzwe bya SMD bitangwa binyuze mu byuma bitanga ibyuma bihuye nabyo.

Ese hari ubwoko butandukanye bw'ibice bya wafer bushobora gukoreshwa mu ikorwa rimwe?

Yego. Hamwe na sisitemu yo guhinduranya wafer ikoreshwa, imashini ishobora kwakira wafer zitandukanye zigera kuri 50, bigatuma ikoreshwa mu bikoresho byinshi.

Ni irihe tandukaniro riri hagati yo gushyiramo die attach no gushyiramo flip-chip kuri CA2?

Agakoresho gashyira agakoresho mu cyerekezo gikenewe cyo kureba hejuru, mu gihe gutunganya uduce duto duto (flip-chip) gahindura agakoresho gashyira uruhande rw'aho gahurira rureba substrate. Urukurikirane nyarwo ruterwa na modules zashyizweho n'uburyo ibicuruzwa bikorerwamo.

Ese CA2 ishobora gukora mu murongo umwe na mikoroni ya SIPLACE TX?

Yego. Izi mbuga zombi zishobora kuzuzanya mu gupakira neza no mu miyoboro ya SiP, aho mikoroni ya TX ishyigikira gushyiramo vuba kandi neza, ndetse no gushyiramo CA2 mu buryo butaziguye no mu buryo buvanze.

Ese CA2 ishyigikira ikorwa ry'ibyumba byo gusukura?

Uru rubuga ruboneka rufite imiterere ijyanye n'icyumba cyo gusukura no gukoresha semiconductor. Icyemezo n'imiterere y'imashini yakoreshejwe bigomba kwemezwa mbere yo kugura.

Ni gute SIPLACE CA2 yakoreshejwe yagombye gupimwa?

Suzuma uburyo imashini imenyekana, imitwe yo gushyiramo, icyiciro cy’ubuziranenge, module za wafer, conveyor, porogaramu, imikorere y’igenzura, imiterere y’imikorere n’ibindi bikoresho birimo. Izina ry’icyitegererezo ryonyine ntirigaragaza ubushobozi bwose bwo gukora.

Ese harimo ibikoresho byo kugaburira no gukoresha wafer?

Ubushobozi bwo gutanga ibikoresho buratandukana bitewe n'imashini n'igiciro. Ibikoresho byo kugaburira, imiyoboro, amakaramu ya wafer, ibikoresho byo gufata ibikoresho n'ibindi bikoresho bigomba kugaragara ukwabyo mu giciro cya nyuma cy'ibikoresho.

Ni ayahe makuru agomba koherezwa hamwe n'ikibazo?

Tanga ibisobanuro bya diye na wafer, urwego rw'ibice, ingano ya substrate, inzira ikenewe, intego yo gukora neza, umusaruro uvamo, imiterere y'imashini wifuza n'aho igezwa.

Twandikire ku bijyanye n'imiterere ya wafer yawe, ingano y'ibice byayo, ingano ya substrate n'uburyo bwo guteranya ibikoresho kugira ngo urebe imiterere ya ASM SIPLACE CA2 ihari n'uburyo bwo kuyitanga.