Umatshini wokubeka iipakethe ze-ASM SIPLACE CA2 Advanced Packaging

Iimveliso zanamhlanje zeSystem-in-Package kunye neemveliso zokupakisha eziphambili zihlala zifuna iintlobo ezahlukeneyo zeenxalenye ukuba zidityaniswe kwi-substrate enye. Iinxalenye ezingasebenziyo kunye nee-IC ezipakishiweyo zinokufika kwii-feeders ze-tape-and-reel, ngelixa ii-dies ze-semiconductor ezingenanto kufuneka zikhethwe ngqo kwi-wafer esarken, zihlolwe, zijongiswe kwaye zibekwe ngolawulo lwenkqubo oluqinileyo.

II-ASM SIPLACE CA2yaphuhliswa kule meko yemveliso exutyiweyo. Endaweni yokwahlulahlula ukubekwa kwe-SMT okuqhelekileyo kunye nokulungiswa kwe-die ye-wafer ngqo kwizigaba zezixhobo ezizimeleyo ngokupheleleyo, i-CA2 idibanisa zombini ukuhamba kwezinto ngaphakathi kweqonga elinye lokubekwa eliphambili. Ingacubungula ii-SMD ezibonelelwa nge-feeder, yenze i-die attach kwi-wafer kwaye ibeke i-flip-chip yokuphatha kwiindibano ze-elektroniki ezincinci nezihlanganisiweyo kakhulu.

Oku kwenza i-SIPLACE CA2 ibaluleke ngakumbi kubavelisi abavavanyayoizixhobo ze-semiconductor die bondkwiimodyuli zeSiP, izixhobo ze-elektroniki zamandla, izinto ezifakwe ngaphakathi, ukupakishwa kwinqanaba le-wafer kunye nezinye iinkqubo apho amandla e-SMT aqhelekileyo kuphela awanelanga.

Luhlobo luni lomatshini i-ASM SIPLACE CA2?

I-SIPLACE CA2 ichazwa kakuhle njengeqonga lokubeka i-hybrid elikhawulezayo lokuhlanganisa i-semiconductor kunye ne-SMT. Ayipheleli nje kumthombo omnye wezinto okanye kwinkqubo enye yesiqhelo yokupakisha.

Ngokuxhomekeke kulungiselelo lomatshini ofakiweyo, i-CA2 inokulungelelanisa imisebenzi eliqela yemveliso:

• Khetha izinto eziqhelekileyo ze-SMD kwii-feeders ze-tape-and-reel.

• Susa ii-dies ezaziwayo ngqo kwi-wafer esarhweyo.

• Beka iidayi ezingenanto kwindawo ehambelana nedayi.

• Jika uze ubeke iidayi ukuze kuhlanganiswe iitshiphusi.

• Izixhobo zenkqubo zinikezelwa ngeetreyi okanye ngezithuthi ezikhethekileyo.

• Faka i-flux okanye enye i-dipping media ngaphambi kokuba uyibeke.

• Hlola iidayi kunye nezinto ezisetyenzisiweyo ngexesha lokubekwa kwazo.

• Bhala phantsi ulwalamano phakathi kwendawo yokuqala ye-wafer kunye nendawo yokugqibela ye-substrate.

Isiphumo siqonga lemveliso elinokudibanisa iinkqubo eziqhele ukudityaniswa nomatshini wokubeka i-SMT kunye ne-semiconductor die bonder.

Kutheni iMigca yokuPakisha ePhambili ifuna iQonga lokuBeka eliHlanganisiweyo

Umgca we-SMT oqhelekileyo usebenza kakuhle xa uninzi lwezixhobo lunikezelwa kwii-feeders ezisemgangathweni. Ukupakisha okuphucukileyo kwazisa umngeni owahlukileyo kuba imveliso yokugqibela inokudibanisa ii-passives, ii-semiconductors ezipakishiweyo, ii-sensors, ii-power dies kunye nee-IC ezingapakishwanga kwi-substrate enye.

Xa ezi zinto zicutshungulwa kwizixhobo ezahlukeneyo, imveliso ingafuna ukudluliselwa okongeziweyo, indawo yokugcina izinto ephakathi, iindawo ezahlukeneyo zokucwangcisa kunye nokulandeleka okuntsonkothileyo. Iidayi ezingenanto nazo zingadinga ukuguqulwa zibe yipakethe yeteyiphu ngaphambi kokuba zingene kwinkqubo yokubeka yesiqhelo ye-SMT.

I-SIPLACE CA2 ijongana nalo msantsa wemveliso ngokuzisa ukuphathwa kwe-wafer ngqo kwiqonga elijolise kwi-SMT. Iidayi zinokuthathwa kwi-wafer zize zingeniswe kulandelelwano lokubekwa kunye nezixhobo ezibonelelwa nge-feeder, nto leyo enciphisa inani lezigaba zenkqubo eziqhagamshelweyo.

I-CA2 xa ithelekiswa nendlela yeMveliso yoKwahlulwahlulwa okuQhelekileyo

Indlela efanelekileyo yokuvelisa isaxhomekeke kubungakanani bemveliso, uluhlu lweedayi, ikhemistri yenkqubo, uyilo lwesiseko kunye neziseko zefektri ezikhoyo. I-CA2 ixabiseke kakhulu xa zombini iinxalenye ze-SMT kunye needayi ezibonelelwa nge-wafer kufuneka zicutshungulwe ngokuphindaphindiweyo kusapho olunye lwemveliso.

Iinkcukacha eziphambili ze-ASM SIPLACE CA2

Amaxabiso aphezulu apapashiweyo achaza amandla eqonga. Imveliso yokwenyani ixhomekeke kwintloko efakiweyo, ubukhulu bedi, imeko yewafer, uyilo lwe-substrate, iindlela zenkqubo, iimfuno zokuhlola kunye nomxube wezinto.

Ukucutshungulwa kweWafer ngokuthe ngqo kunye nokuhamba kwezinto

Enye yezona zinto zibalulekileyo ze-CA2 kukukwazi kwayo ukucubungula iidayi ngqo kwi-wafer esarhweyo. Kwindlela yokusebenza yendabuko esekelwe kwi-feeder, iidayi ezingenanto zingadinga kuqala ukudluliselwa kwiteyipu okanye kwenye i-carrier esemgangathweni ngaphambi kokuba zibekwe.

Ukucubungula i-wafer ngqo kunokususa okanye kunciphise elo nyathelo lokuguqula eliphakathi. Oku kunokubonelela ngeenzuzo ezininzi zokusebenza:

• Imisebenzi embalwa yokulungiselela kunye nokuphatha izinto ezinxulumene neteyiphu.

• Iimfuneko zokugcina ezincitshisiweyo zezinto eziguquliweyo.

• Inkunkuma encinci yeteyiphu kunye neyokuthwala enxulumene nokuphinda kupakishwe iidayi.

• Imisebenzi embalwa yokuzalisa nokudibanisa izinto ezisetyenzisiweyo.

• Unxibelelwano olungcono phakathi kwedatha yemephu ye-wafer kunye neerekhodi zokugqibela zokubekwa.

• Ukusetyenziswa okuguquguqukayo ngakumbi kwee-dies ezininzi kwiimveliso ze-SiP ezintsonkothileyo.

I-CA2 isebenzisa imisebenzi yokuphatha iiwafer kunye ne-die-buffering ukwahlula ukulungiswa kweedayi okuthabatha ixesha elide kulandelelwano lokubekwa. Le nkqubo ihambelanayo inceda ukugcina imveliso iphuma ngelixa iidayi zilungiselelwa ukulandwa nokubekwa.

Imveliso yeDie Attach kunye neFlip-Chip

Indawo yokuncamathisela i-Die-Attach

Kwinkqubo yokuncamathisela nge-die-attach, i-semiconductor die isuswa kwi-wafer ize ibekwe kwindawo efunekayo kwi-substrate. Ngokuxhomekeke kwiindlela zemveliso kunye noomatshini, inkqubo ingabandakanya ukudipha kwezinto, ukuhlolwa kwe-die kunye nokubekwa kwamandla aphantsi okulawulwayo.

Ukubekwa kweFlip-Chip

Ukuhlanganiswa kwe-flip-chip kufuna ukuba idayisi ibekwe ngokuchanekileyo ukuze icala layo elisebenzayo kunye nolwakhiwo lonxibelelwano lujongane ne-substrate. Ukuchaneka kokubekwa kwayo, imeko yedayi, ukudluliselwa kwe-flux kunye nemephu ye-substrate kubaluleke kakhulu xa ubukhulu be-bump kunye nesithuba seenxalenye zincinci.

Ukubekwa kwe-SMT kunye neDie Placement

I-CA2 inokudibanisa ii-dies ezibonelelwa nge-wafer kunye nezinto eziqhelekileyo ezikhethwe kwiimveliso ezihambelanayo.Ii-feeders ze-ASM SMTOku kuvumela imveliso enye ukuba iquke ii-resistor, ii-capacitors, ii-IC ezipakishiweyo kunye neentlobo ezahlukeneyo ze-bare die ngaphandle kokuphatha iqela ngalinye lezinto njengeprojekthi yokuhlanganisa eyahlukileyo ngokupheleleyo.

Intloko yokubekwa kunye neenketho zokuchaneka

Lo matshini unokuxhotyiswa ngentloko yokubeka i-CP20 yokuphatha izinto ngesantya esiphezulu nangokuchaneka okuphezulu. I-CP20 yenzelwe izinto ezincinci nezinobuthathaka kwaye ixhasa imisebenzi yokuthathwa ngaphandle kokuchukumisa kunye nemisebenzi yokubeka i-zero-force.

Izixhobo ze-CP20 ezipapashiweyo ziquka:

• Uluhlu lwezinto luqala kwi-0201 metric.

• Ubukhulu becandelo bufikelela kwi-8.2 × 8.2 mm.

• Ukuphakama kwento ukuya kuthi ga kwi-4 mm.

• Ubungakanani bokufakwa bufikelela kwi-38,000 components ngeyure nganye ngokwendlela esetyenziswayo yokuseta intloko.

• Ubuchule bokuchaneka bufikelela kwi-±10 µm kwi-3 sigma.

Udidi lokuchaneka olufunekayo kufuneka lukhethwe ngokwemilinganiselo yedayi, iphimbo lokudibanisa, ubungakanani bebhola okanye i-bump, ukunyamezelana kwe-substrate kunye neemfuno zemveliso. Umatshini olungiselelwe ukubekwa okuqhelekileyo kwe-20 µm akufuneki uthathwe ngokuzenzekelayo njengobonelela ngodidi lwenkqubo olukhethiweyo lwe-10 µm.

Utshintshiselwano lweeWafer kunye neMveliso yeeMulti-Die

Iimveliso zeSiP ezintsonkothileyo zinokuba needayi ezahlukeneyo ezahlukeneyo. Ukutshintsha izinto zewafer ngesandla kuzo zonke iintlobo zedayi kuya kudala ingxaki enkulu kwimveliso. Inkqubo yokutshintshiselana ngewafer ye-CA2 yenzelwe ukugcina iintlobo ezininzi zewafer kunye nokubonisa izinto ezifunekayo kwinkqubo yokubeka njengoko inkqubo yemveliso itshintsha.

Ngoqwalaselo olufanelekileyo, inkqubo ye-wafer ingabamba ukuya kuthi ga kwii-wafers ezingama-50 ezahlukeneyo. Olu buchule bokukwazi ukusebenzisa ii-multi-die buluncedo ngokukodwa kwiimveliso ezidibanisa iiprosesa, imemori, ii-sensors, ii-die zonxibelelwano kunye nezixhobo zamandla kwiphakheji enye encinci.

Xa uvavanya umatshini okhoyo, qinisekisa:

1. Inkqubo yokutshintshiselana nge-wafer efakiweyo kunye nenani leendawo ze-wafer ezixhaswayo.

2. Iidayamitha ze-wafer ezixhaswayo kunye neenkcukacha zefreyimu ye-wafer.

3. I-ejector ye-wafer, i-die-flip kunye noqwalaselo lwe-buffer-module.

4. Ukuhambelana nefomathi yemephu ye-wafer efunekayo.

5. Ubukhulu obukhulu kunye nobuncinci bobukhulu bokufa.

6. Ubukhulu bedayi kunye nemeko yedayi exhaswayo.

7. Ulwazi olufumanekayo malunga nokungafezeki kakuhle kunye nolwazi oluqhelekileyo malunga nokungafezeki kakuhle.

Uqwalaselo lweSubstrate kunye neConveyor

I-CA2 ingalungiselelwa ukuhamba kwe-substrate okwahlukeneyo endaweni yokuba ithintelwe kwifomathi enye ye-PCB eqhelekileyo.

Isithuthi Sokuthutha Esihamba Ngendlela Eyodwa

Uqwalaselo lomgca omnye lunokuxhasa iiphaneli ezinkulu, ii-PCB ezifakwe ngaphakathi kunye nee-substrates ezikhethekileyo. Iifomathi ezipapashiweyo zifikelela kwi-620 × 700 mm kwiiklasi ezikhethiweyo zokuchaneka kunye nokulungiswa koomatshini.

Isithuthi esihamba ngeendlela ezimbini

Uthutho lweendlela ezimbini lufanelekile kwii-PCB eziqhelekileyo kunye nee-substrates ze-SiP apho ukuphathwa kwebhodi ehambelanayo kunokuphucula ukusetyenziswa komgca. Ubukhulu obuxhaswayo buyahluka ngokwemo yokuhambisa ekhethiweyo kunye nemfuneko yokuchaneka.

IiChip-on-Wafer kunye neeCarriers ezikhethekileyo

Iinketho ezikhoyo zinokuxhasa iinkqubo ze-chip-on-wafer, iitreyi ze-JEDEC, ii-J-boats, iibhodi ezixineneyo kunye ne-warped substrates. Le misebenzi kufuneka ijongwe ngokubhekisele kulungiselelo lomatshini olufakelweyo.

Ukuhlolwa, ukuDipha kunye noLawulo lweNkqubo

Isantya esiphezulu sokubekwa asanelanga ekupakisheni okuphucukileyo. Le nkqubo kufuneka iqinisekise imeko yedayi, umgangatho wokuthathwa, ukuqhelaniswa kunye nokusetyenziswa kwezinto.

Ngokuxhomekeke kwiindlela ezikhethiweyo, i-CA2 inokuxhasa:

• Ubukho becandelo kunye nokufunyanwa kwalo.

• Ukuhlolwa kwe-die-crack kunye ne-die-chipping.

• Ukufunyanwa kwezinto ezidityanisiweyo okanye eziphuma kwi-flux.

• Ukuhlolwa kwe-solder-paste ngaphambi okanye emva kokubekwa.

• Imephu ye-substrate kunye nokulungiswa kwendawo kunye nendawo.

• Ukucwangcisa ukutshintshiselana kwedatha neenkqubo zefektri.

• Imveliso evaliweyo isebenza xa kufakwa izixhobo zokuhlola ezihambelanayo.

Iyunithi yokuDipha ngomgca ingasetyenziswa apho iidayi zifuna ukujijeka okanye enye indlela yokudlulisa ngaphambi kokubekwa. Ipleyiti yokudipha ekhethiweyo, iimpawu zezinto, ubude bokudlulisa kunye noseto lokuhlola kufuneka zilungele inkqubo yokwenyani yokudipha kunye neyomphantsi.

Ukulandeleka kweNqanaba elinye

Ukuhlanganiswa kwee-semiconductor kudla ngokufuna iirekhodi zezinto ezineenkcukacha ezingaphezulu kunokulandelela izinto eziqhelekileyo. I-CA2 ixhasa ukulandelela idayisi nganye ukusuka kwindawo yayo yokuqala kwi-wafer ukuya kwindawo yayo yokugqibela kwi-substrate edibeneyo.

Oku kunokunceda amaqela emveliso ukuba aqhagamshelane:

• Ukuchongwa kwe-wafer kunye nolwazi lwemephu ye-wafer.

• Indawo yokuqala yomqolo kunye nekholamu yedayi.

• Iziphumo zokuthathwa kweedayi kunye nokuhlolwa.

• Inombolo yokugqibela yebhodi okanye ye-substrate.

• Izilungelelanisi zokubekwa kwimveliso egqityiweyo.

• Idatha yenkqubo kunye nezixhobo eziqokelelweyo ngexesha lokuhlanganiswa.

Ububanzi bokugqibela bokulandelela buxhomekeke kwisoftware efakiweyo, i-interfaces yefektri, isiseko sedatha sabathengi kunye nokuhlanganiswa kwemveliso kunye nenkqubo.

Ukudibanisa noMgca Wokupakisha Ophambili

I-SIPLACE CA2 ingasetyenziswa njengomatshini wokubeka i-hybrid ephakathi okanye idityaniswe nezixhobo ezongezelelweyo ezikhawulezayo nezichanekileyo. I-ASMPT ichonga i-SIPLACE TX micron njengeqonga elincedisayo lokuvelisa i-SiP apho zombini ezi matshini zicwangciswe ngaphakathi komgca omnye.

Uqwalaselo lomgca lungabandakanya:

1. Ukulayisha kunye nokuchonga i-substrate.

2. Intlama yokuncamathelisa, yokuncamathelisa okanye yokuyixuba.

3. Ukuhlolwa kwezinto ezishicilelweyo okanye ezisasaziweyo.

4. Ukubekwa ngokukhawuleza kwezixhobo ze-SMD eziqhelekileyo.

5. Faka i-die attach okanye i-flip-chip kwi-CA2 ngqo kwi-wafer die attach.

6. Ukuhlolwa emva kokubekwa.

7. Ukujika kwakhona, ukunyanga okanye iinkqubo zokupakisha ezilandelayo.

8. Ukuhlolwa kokugqibela, uvavanyo kunye nokurekhoda ukulandeleka.

Uyilo oluchanekileyo lomgca luxhomekeke kulandelelwano lwenkqubo, ixesha lokuthathwa, ukuphathwa kwesiseko, iimfuno zegumbi lokucoca nokuba i-CA2 yenza onke amanyathelo okubeka okanye imisebenzi ekhethekileyo yokulungisa idayethi kuphela.

Iimveliso eziqhelekileyo kunye nezicelo

• Iimodyuli zeNkqubo-kwiPhakheji:Iindibano ezidibanisa iidayi ezininzi ezingenanto, ii-IC ezipakishiweyo kunye nezinto ezingasebenziyo.

• Iimodyuli zonxibelelwano:Iiphakheji ze-elektroniki ezixineneyo ze-RF, 5G, inethiwekhi kunye neepakeji ze-elektroniki ezingenazingcingo.

• Iimoto zombane:Iimodyuli zenzwa, ulawulo kunye nokuhlanganiswa okuphezulu ezifuna ukulandelelwa okuneenkcukacha.

• Iimveliso ze-Power semiconductor:Izixhobo ze-Power dies kunye nezixhasayo ze-SMD ezihlanganiswe kwi-substrates ezikhethekileyo.

• Ukupakisha kwinqanaba le-wafer:Iinkqubo ezibandakanya ukubekwa kwii-wafers okanye kwi-substrates ezithathwe kwi-wafer.

• Ukupakisha kwinqanaba lephaneli:Ukupakisha okuphucukileyo kwiiphaneli ezinkulu.

• Izixhobo ze-elektroniki ezifakiweyo:Iinxalenye kunye needayi ezifakwe kwizakhiwo zePCB ezifakwe ngaphakathi okanye phezu kwazo.

• Iimodyuli zenzwa kunye nezonyango:Iindibano ezincinci eziqulethe iidayi ezingenanto ezibuthathaka kunye nezixhobo zokulawula izixhobo ze-elektroniki.

• Iimodyuli zekhompyutha kunye nezixhobo ezikrelekrele:Iimveliso ezinoxinano oluphezulu ezifuna iifomathi ezininzi zezinto.

I-SIPLACE CA2 ilukhetho olufanelekileyo nini?

I-CA2 kufuneka iqwalaselwe xa imfuneko yemveliso ibandakanya ezinye zezi meko zilandelayo:

• Le mveliso idibanisa ii-SMD ezibonelelwa ngokutya kunye nee-bare dies.

• Iidayi kufuneka zikhethwe ngqo kwi-wafer enye okanye ezingaphezulu.

• Iinkqubo ze-die attach kunye ne-flip-chip ziyafuneka kusapho olunye lwemveliso.

• Imveliso ifuna iintlobo ezininzi zeedayi ezinotshintsho oluqhelekileyo lwezinto.

• Ukuchaneka kokubekwa kufuneka kufikelele kwiiklasi zenkqubo ze-20 µm, 15 µm okanye 10 µm.

• Kufuneka ukulandelelwa kwedayi enye.

• Umenzi ufuna ukunciphisa ukutheyipha ngomatshini kunye nokuphathwa kwezinto eziphakathi.

• Izixhobo mazinxibelelane neenkqubo zefektri ze-SMT kunye neze-semiconductor.

• Iipaneli ezinkulu, ii-substrates ze-SiP okanye ii-carriers ezikhethekileyo kufuneka zicutshungulwe.

I-die bonder ezinikeleyo isenokufaneleka ngakumbi xa isicelo sifuna amandla okubopha akhethekileyo, ukufudumeza, ukunyanga, ukukhupha okanye ubungakanani be-die ngaphandle koqwalaselo lwe-CA2 olufumanekayo. Ngoko ke uphononongo lwenkqubo kufuneka lugqitywe ngaphambi kokukhetha umatshini.

Izixhobo ze-ASM SIPLACE CA2 ezikhoyo

Oomatshini be-SIPLACE CA2 abasetyenzisiweyo okanye ababesele benabo bangaphambili banokwahluka kakhulu nokuba indlela esetyenziswa ngayo imodeli yangaphandle iyafana. Inkqubo ye-wafer efakiweyo, intloko yokubeka, i-conveyor, udidi lokuchaneka, iindlela zokuhlola kunye nesoftware zimisela oko iyunithi nganye inokukucubungula.

Ngaphambi kokuba kuthengwe isicatshulwa, kufuneka kuqinisekiswe ulwazi olulandelayo lwezixhobo:

Inkxaso yoMatshini, iSondlo kunye neeNdawo eziSimahla

Izixhobo zingalinganiswa nobungakanani obufunekayo be-substrate, ifomathi ye-wafer, uluhlu lwezixhobo, inqanaba lokuchaneka kunye nokusetyenziswa kwenkqubo. Ngokuxhomekeke ekubeni ikhona na, inkxaso ingabandakanya:

• Oomatshini abapheleleyo be-ASM SIPLACE CA2.

• Iintloko zokubeka kunye nezixhobo zentloko ezihambelanayo.

• Ukutshintshiselana nge-wafer kunye nezixhobo zokuphatha i-wafer.

• Izixhobo zokondla ze-ASM SIPLACE kunye nezixhobo zokondla ezingasetyenziswanga.

• Ii-nozzles ezisemgangathweni nezihambelana nesicelo.

• Iikhamera, izinzwa kunye nezixhobo zokuhlola.

• Iimoto, iidrive, iibhodi zokulawula kunye neentambo.

• Izixhobo zokuhambisa kunye nezokuphatha i-substrate.

• Ukufakwa, ukupakisha kunye nenkxaso yokuthunyelwa kwamanye amazwe.

Ulwazi olufunekayo ukuze kufaniswe izixhobo

Ukuze ufumane ingcebiso echanekileyo yomatshini, bonelela:

1. Inkcazo yemveliso kunye nenkqubo.

2. Inkqubo yokuncamathisela idayi, i-flip-chip okanye yokubeka izinto ezixutyiweyo iyimfuneko.

3. Ubukhulu bedayi, ubukhulu kunye nobubanzi be-wafer.

4. Inani leentlobo ezahlukeneyo zeedayi kwimveliso nganye.

5. Iphakheji ye-SMD encinci neyona inkulu.

6. Ubukhulu be-substrate, ubukhulu kunye nezinto eziphathekayo.

7. Ukuchaneka kokubekwa okufunekayo.

8. Umthamo wemveliso olindelekileyo ngeyure okanye ngonyaka.

9. Isixhobo sokutya esifunekayo, itreyi kunye nomthamo we-wafer.

10. Iimfuno zokujonga umbane kunye nokulandeleka kwefektri.

11. Imeko yesixhobo esikhethwayo kunye nelizwe apho siya khona.

Imibuzo Ebuzwa Rhoqo Malunga ne-ASM SIPLACE CA2

Yeyiphi ingxaki yemveliso esonjululwa yi-SIPLACE CA2?

Ijongana neemveliso ezifuna zombini izinto ze-SMT eziqhelekileyo kunye nee-bare semiconductor dies. I-CA2 izisa indawo yokubeka izinto ezisekelwe kwi-feeder kunye ne-direct-wafer die processing kwiqonga lomatshini elidibeneyo.

Ngaba i-CA2 ingayitshintsha yonke i-die bond eqhelekileyo?

Akukho matshini mnye ufanelekileyo kuyo yonke inkqubo ye-semiconductor. I-CA2 yenzelwe ukufakwa kwe-hybrid ekhawulezayo, ukufakelwa kwe-die kunye nokusetyenziswa kwe-flip-chip. Iinkqubo ezifuna ukufudumeza okukhethekileyo, amandla okubopha, ukuphilisa okanye iifomathi ze-die ezingaqhelekanga kufuneka zivavanywe ngokwahlukeneyo.

Ngaba umatshini ufuna ukuba iidayi zifakwe kwiteyiphu?

Hayi. Enye yezona zinto ziphambili ekwaziyo kukukhetha iidayi ngqo kwi-wafer esarhweyo. Ingasebenza nezinto eziqhelekileyo ze-SMD ezinikezelwa ngee-feeders ze-tape-and-reel ezihambelanayo.

Ngaba ii-wafers ezahlukeneyo zingasetyenziswa kwiseti enye yemveliso?

Ewe. Ngenkqubo yokutshintshiselana nge-wafer esebenzayo, umatshini unokuthwala ukuya kuthi ga kwii-wafers ezingama-50 ezahlukeneyo, nto leyo eyenza ukuba ifaneleke kwiimveliso ezisebenzisa ii-multi-die.

Yintoni umahluko phakathi kwe-die attach kunye ne-flip-chip placement kwi-CA2?

I-die attach ibeka i-die kwindawo efunekayo yokujonga phezulu, ngelixa i-flip-chip processing ijika kwaye ibeka i-die icala layo lokunxibelelana lijonge kwi-substrate. Ulandelelwano oluchanekileyo luxhomekeke kwiimodyuli ezifakiweyo kunye nenkqubo yemveliso.

Ngaba i-CA2 ingasebenza kumgca ofanayo ne-SIPLACE TX micron?

Ewe. La maqonga mabini anokuxhasana kwiipakeji eziphambili kunye nemigca yeSiP, kunye ne-TX micron exhasa ukubekwa kwesantya esiphezulu, ukuchaneka okuphezulu kunye neenkqubo zokubekwa kwe-CA2 eziphathwa ngqo kunye neenkqubo zokubekwa kwe-hybrid.

Ngaba i-CA2 iyayixhasa imveliso yegumbi lokucoca?

Iqonga liyafumaneka kunye noqwalaselo oluhambelana negumbi lokucoca kunye nolwe-semiconductor olusemgangathweni. Isiqinisekiso kunye nemeko yomatshini osetyenzisiweyo ngamnye kufuneka ziqinisekiswe ngaphambi kokuba zithengwe.

Ifanele ihlolwe njani i-SIPLACE CA2 esetyenzisiweyo?

Hlaziya ukuchongwa komatshini, iintloko zokubekwa, udidi lokuchaneka, iimodyuli ze-wafer, i-conveyor, isoftware, imisebenzi yokujonga, imeko yokusebenza kunye nezixhobo ezibandakanyiweyo. Igama lemodeli lodwa alichazi amandla enkqubo epheleleyo.

Ngaba izinto zokutyela kunye nezixhobo zewafer zibandakanyiwe?

Ububanzi bobonelelo buyahluka ngokwematshini kunye nexabiso. Izixhobo zokondla, ii-nozzles, iifreyimu ze-wafer, izixhobo zokuphatha kunye neendawo ezingasetyenziswayo kufuneka zidweliswe ngokwahlukeneyo kwisibonelelo sokugqibela sezixhobo.

Loluphi ulwazi olufanele luthunyelwe kunye nophando?

Nika iinkcukacha zedayi kunye ne-wafer, uluhlu lwezakhi, ubungakanani be-substrate, inkqubo efunekayo, injongo yokuchaneka, imveliso, imeko yomatshini owuthandayo kunye nendawo yokuhambisa.

Qhagamshelana nathi ngefomathi yakho ye-wafer, uluhlu lwedayi, ubungakanani be-substrate kunye nenkqubo yokuhlanganisa efunekayo ukuze ujonge ulungelelwaniso olukhoyo lwe-ASM SIPLACE CA2 kunye neendlela zokubonelela.