Ekyuma ekiyonja plasma ekya Panasonic PSX307

Panasonic PSX307 nkola ya otomatiki ey’okwoza plasma mu layini eyakolebwa ku substrates ne wafers, naddala eya yinginiya okutuukiriza obwetaavu obw’amaanyi obw’okukola semiconductor ez’omulembe. Nga ekozesa tekinologiya ow’omulembe ow’ebyuma ebiyitibwa parallel-plate electrode, enkola eno etumbudde obulungi bw’okufulumya emirundi 1.5 ate mu kiseera kye kimu n’ekakasa omutindo gw’enkola; etuwa eky’okugonjoola eky’omutindo ogwa waggulu ekitegekeddwa okukola ku kusoomoozebwa okw’okulongoosa kungulu okweyongera okuzibu okusangibwa mu kisaawe ky’okupakinga eby’omulembe.

**Omusingi gw'emirimu**

PSX307 ekozesa ensibuko y’amaanyi ga 13.56 MHz Radio Frequency (RF) okukola ekifo kya pulasima ekifaanagana ng’eyita mu nsengeka ya parallel-plate electrode. Gaasi z’enkola —nga argon — bwe zifuuka ionized, obutundutundu obw’amasoboza amangi obuvaamu butuuka ku kwoza kwa nanoscale n’okukola kungulu okuyita mu nkolagana ey’okukwatagana ey’okukuba bbomu ez’omubiri n’ensengekera z’eddagala. Mu nsonga z’obulungi n’obumu, dizayini eno etuwa enkizo enkulu okusinga enkola za pulasima ez’ekika kya batch ez’ennono. **Ebikozesebwa ebikulu n'okuteeka ebintu mu kifo**

PSX307 series erimu ebika ebitali bimu, ebikoleddwa okutuukiriza ebyetaago eby’enjawulo ebya layini ez’enjawulo ezikola. Okugeraageranya ebikulu ebikwata ku buli mulembe kuweereddwa wansi:

**Ekifaananyi** | **Ekika kya S-E** | **Ekika kya M** | **PSX307A** Omuntu w'abantu.

**Okuteeka Ebikozesebwa mu kifo** | Esaanira ebitundu ebitono oba ebya wakati | Esaanira ku substrates eza sayizi eya wakati okutuuka ku nnene | Esaanira okupakinga ku ddaala lya Wafer (WLP) .

**Ekigendererwa ky'okukola** | Ebisengejjero (okugeza, PCBs) | Ebisengejjero (okugeza, PCBs) | Wafers ezituuka ku mm 300 (nga zirina fuleemu oba nga tezirina) .

**Ekigerageranyo ky'obunene bwa Substrate** | L 50 x Obugazi 20 okutuuka ku L 250 x Obugazi mm 75 | L 50 x Obugazi 20 okutuuka ku L 330 x Obugazi mm 120 | Asobola okulongoosa omulundi gumu substrates nnya nga obugazi bwa mm 77.5

**Ebipimo by'ebweru (nga mw'otwalidde n'Ekitambuza)** | Obugazi 2113 × Obugazi 1100 × Obugulumivu mm 1450 | Obugazi 2266 × Obugazi 1100 × Obugulumivu mm 1450 | Nsaba otunule mu lupapula lw’ebikwata ku by’ekikugu okumanya ebisingawo

**Obuzito bw'ebyuma** | Nga. Kkiro 850 | Nga. Kkiro 725 | -

**Obugumu bwa Substrate** | 0.5 mm okutuuka ku 2.0 mm (okujuliza kwokka) | mm 0.5 okutuuka ku mm 2.0 | -

**Ebikwata ku nsonga eno mu bujjuvu (PSX307 Base Model)**

**Ekika kya Parameter** | **Ebikwata ku nsonga eno mu bujjuvu**

**Omulembe gw'Ebyuma** | NM-EFP1A

**Enkola y'okuyonja** | Parallel-plate RF Okufuuwa emabega

**Okufulumya Gaasi** | Argon (Ar) [Oksijeni (O2) bw’osobola okusalawo].

**Ebipimo by'ebweru (Ekitundu Ekikulu)** | Obugazi 930 × Obugazi 1100 × Obugulumivu mm 1450

**Obuzito bw'ebyuma (Main Unit)** | Nga. kkiro 555

**Ebikwata ku masannyalaze** | AC ya phase emu 200 V, 2.00 kVA (Entuuko 5.00 kVA)

**Ebyetaagisa mu kugaba ggaasi** | 0.49 MPa ...oba okusingawo; 6.5 L/eddakiika (ANR) .

**Emirimu emikulu n'ebintu eby'ekikugu**

Emanyiddwa olw’okukola otoma n’amagezi amangi, PSX307 eraga obusukkulumu bwayo mu by’ekikugu okusinga ng’eyita mu bintu bino wammanga:

**Chamber Design Balancing Uniformity and Etch Rate:** Ekakasa nti buli kibinja ky’okulongoosa kivaamu ebiva mu etching ebikwatagana ennyo-ensonga enkulu ennyo mu kutebenkera kw’enkola n’amakungula.

**Panasonic's Proprietary Plasma Monitoring Function:** Okulondoola mu kiseera ekituufu n'okuziyiza anomalies ezifuluma mu plasma okuziyiza Electrostatic Discharge (ESD) okwonooneka, bwe kityo okukakasa "okulongoosebwa okutaliimu kwonooneka" kw'ebintu.

**Traceability Function:** Ewa obusobozi obujjuvu obw'okulondoola data ku nkola y'okufulumya, okutuukiriza ebisaanyizo ebikakali eby'okulondoola omutindo eby'ekitongole ekikola semiconductor.

**Entambula mu layini ne mu ngeri ey’obwengula:** Ewagira ensengeka z’omutikka/okutikkula n’ebiragiro mu layini, okusobozesa okugatta obutereevu mu layini z’okufulumya mu ngeri ey’obwengula nga tekyetaagisa kuyingira mu nsonga mu ngalo.

**Ebirungi Ebikulu n'Ennimiro z'Okukozesa**

Nga ekozesa tekinologiya omukulu ayogeddwako waggulu, PSX307 eraga ebirungi ebinene mu kwongera omutindo gw’okufulumya n’okukendeeza ku nsaasaanya, naddala mu bintu bino wammanga:

**Breakthrough Cost-Effectiveness:** Nga tukozesa tekinologiya wa Argon (Ar) plasma processing okuggyawo ebirungo bya nickel eby'okungulu, kisobozesa okwettanira enkola ya "Flash Gold" plating ey'ebbeeyi entono. Mu kiseera kye kimu, kikendeeza bulungi ensonga nga delamination, voids, n’enjatika eziyinza okuva mu nkola y’okupakinga. **Okulongoosa mu bulungibwansi okw’amaanyi:** Olw’engeri gye kyakolebwamu mu layini nga kigatta wamu n’enkola y’entambula ey’obwengula, ebyuma bino bituuka ku sipiidi y’okulongoosa okutuuka ku 360 substrates/strips buli ssaawa—ekitegeeza okweyongera kwa 50% mu bulungibwansi bw’ogeraageranya n’ebyuma ebya bulijjo.

Okukyusa ku ngulu okusobola okutuukiriza ebyetaago by’enkola ez’enjawulo:

**Improved Metal Bondability:** Nga tonnaba kusiba waya oba okukuŋŋaanya flip-chip, okuggyawo obucaafu obw’obutonde kyongera nnyo amaanyi g’okusala n’okwesigamizibwa kw’okusiba.

**Enhanced Resin Adhesion:** Okukyusa kungulu nga tukozesa oxygen plasma (O2) kubisaamu emirundi ebiri amaanyi g’okunyweza ag’ebirungo ebibumba epoxy n’ebintu ebijjuza wansi, okuziyiza obulungi okukutuka.

**Enkola z’okujjuza wansi ezirongooseddwa:** Elongoosa engeri y’okutambula kw’emisuwa, okukendeeza ku budde bw’okujjuza wansi ebitundu ebisukka mu 40%—omugaso ogw’omuwendo naddala eri chips ez’omutindo omunene n’ezo ezirina densities za I/O enkulu.

**Ebitundu Ebikulu eby'Okusaba**

Olw’obusobozi bwayo obw’okukola obulungi, PSX307 ekozesebwa nnyo mu nkola z’okukola semikondokita ez’omulembe:

**Wafer-Level Packaging:** Okukyusa wafer kungulu nga tebannaba kusiba die; okuyonja ebiwujjo bya solder nga tonnaba kusiba flip-chip; n’okuggyawo ebisigadde (okusalako) munda mu bizimbe bya TSV (Through-Silicon Via).

**Okupakinga okw’omulembe:** Okwoza n’okukola ku ngulu kwa PCB substrates nga tebannaba kukola waya okusiba, okujjuza wansi, n’okubumba.

**Enkola & Ebikozesebwa Entongole:** Okuggya ebisigalira bya resin okuva mu biwujjo bya wafer solder; okulongoosa mu ngeri ya solderability ya layers za zaabu ezisiigibwa ku ssente entono; n’okukozesebwa okufaananako bwe kutyo.

**Ebyuma Ebijjuliza**

Ng’ekitundu ekikulu mu portfolio ya Panasonic ekola ku by’okugonjoola ebizibu bya semiconductor, PSX307 etera okukola nga ekwatagana ne Panasonic’s high-precision MD-P series flip-chip bonders. Enkolagana eno ekakasa enkyukakyuka etaliimu buzibu okuva mu kuyonja okudda mu kuteeka, ekivaamu okulongoosa ennyo mu bwesigwa bw’ebintu okutwalira awamu.

**Okubumbako**

Mu kumaliriza, Panasonic PSX307 nkola ya tekinologiya ey’omulembe ey’okwoza pulasima eyakolebwa yinginiya mu ngeri ey’enjawulo mu mbeera ezikolebwa mu bungi. Okuyita mu kugatta tekinologiya omuyiiya ow’ekika kya parallel-plate n’enkola ey’okulondoola ey’obwannannyini, etuuka ku magoba amanene mu kukola obulungi n’okukendeeza obulungi ku nsaasaanya y’okukola, byonna nga bikakasa enkola etali ya kusaanyaawo ng’erina obumu obw’enjawulo. Ku nkola ezirimu substrates ennene oba wafers za mm 300-era nga enkola enkulu nga okusiba waya n’okujjuza obutono ze zeetaaga emitendera egy’oku ntikko egy’obwesigwa-PSX307 eyimiridde ng’eky’okugonjoola ekisaanira okulowoozebwako ennyo.