Umatshini wokucoca iplasma wePanasonic PSX307

I-Panasonic PSX307 yinkqubo yokucoca i-plasma ezenzekelayo eyenzelwe ii-substrates kunye nee-wafers, eyenzelwe ngokukodwa ukuhlangabezana neemfuno eziphezulu zokwenziwa kwe-semiconductor yanamhlanje. Isebenzisa ubuchwepheshe be-electrode ye-parallel-plate yanamhlanje, le nkqubo inyusa ukusebenza kakuhle kwemveliso ngokuphindwe kayi-1.5 ngelixa ngaxeshanye iqinisekisa umgangatho wenkqubo; inikezela ngesisombululo esisebenza kakuhle esenzelwe ukujongana nemingeni yonyango lomphezulu eyandayo edibene nayo kwicandelo lokupakisha okuphucukileyo.

**Umgaqo Wokusebenza**

I-PSX307 isebenzisa umthombo wamandla we-13.56 MHz Radio Frequency (RF) ukuvelisa intsimi yeplasma efanayo ngokusebenzisa ulungiselelo lwe-electrode yepleyiti ehambelanayo. Xa iigesi zenkqubo—ezifana ne-argon—zifakwa kwi-ionized, amasuntswana anamandla aphezulu aphumayo afumana ukucoca i-nanoscale kunye nokusebenza komphezulu ngokusebenzisana kwe-bombardment ebonakalayo kunye neempendulo zeekhemikhali. Ngokuphathelele ukusebenza kakuhle kunye nokufana, olu yilo lubonelela ngeenzuzo ezisisiseko kuneenkqubo zeplasma zendabuko zohlobo lwe-batch. **Iimodeli eziphambili kunye nokuBekwa kweMveliso**

Uthotho lwePSX307 luqulathe uluhlu lweemodeli, ezenzelwe ukuhlangabezana neemfuno ezahlukeneyo zemigca eyahlukeneyo yemveliso. Uthelekiso lweempawu eziphambili zemodeli nganye lubonelelwe ngezantsi:

**Isici** | **Uhlobo-S** | **Uhlobo-M** | **PSX307A**

**Ukubekwa kwezixhobo** | Ifanelekile kwi-substrates ezincinci ukuya kweziphakathi | Ifanelekile kwi-substrates eziphakathi ukuya kwezinkulu | Ifanelekile kwi-Wafer-Level Packaging (WLP)

**Ithagethi Yokucubungula** | Ii-substrates (umz., ii-PCB) | Ii-substrates (umz., ii-PCB) | Ii-wafers ukuya kuthi ga kwi-300 mm (ezineefreyimu okanye ezingenazo)

**Uluhlu lobungakanani beSubstrate** | L 50 x W 20 ukuya ku-L 250 x W 75 mm | L 50 x W 20 ukuya ku-L 330 x W 120 mm | Iyakwazi ukucubungula ngaxeshanye ii-substrates ezine ezinobubanzi obuyi-77.5 mm

**Ubukhulu Bangaphandle (kuquka iConveyor)** | W 2113 × D 1100 × H 1450 mm | W 2266 × D 1100 × H 1450 mm | Nceda ujonge iphepha leenkcukacha zobugcisa ukuze ufumane iinkcukacha

**Ubunzima bezixhobo** | Malunga nama-850 kg | Malunga nama-725 kg | -

**Ubukhulu beSubstrate** | 0.5 mm ukuya kwi-2.0 mm (ngokwereferensi kuphela) | 0.5 mm ukuya kwi-2.0 mm | -

**Iinkcukacha ezineenkcukacha (iModeli yeSiseko sePSX307)**

**Udidi lweParamitha** | **Iinkcukacha ezineenkcukacha**

**Imodeli yezixhobo** | NM-EFP1A

**Indlela yokucoca** | I-RF Back-sputtering enepleyiti ehambelanayo

**Igesi yokukhupha** | I-Argon (Ar) [I-Oxygen (O₂) ayinyanzelekanga]

**Ubukhulu Bangaphandle (Iyunithi Ephambili)** | W 930 × D 1100 × H 1450 mm

**Ubunzima bezixhobo (Iyunithi ephambili)** | Malunga ne-555 kg

**Iinkcukacha zoMbane** | I-AC yesigaba esinye 200 V, 2.00 kVA (Incopho 5.00 kVA)

**Iimfuneko zoNikezelo lweGesi** | 0.49 MPa ...okanye ngaphezulu; 6.5 L/min (ANR)

**Imisebenzi Ephambili kunye Neempawu Zobuchwephesha**

Iphawulwa zizinga eliphezulu lokuzenzekelayo kunye nobukrelekrele, i-PSX307 ibonisa ukongama kwayo kwezobugcisa ngokuyintloko ngezi zinto zilandelayo:

**Ukulingana koYilo lweChamber kunye neNqanaba lokuQokelela:** Iqinisekisa ukuba yonke ibhetshi yokucubungula ivelisa iziphumo zokuqhokelela ezihambelanayo kakhulu—into ebalulekileyo ekuzinzeni kwenkqubo kunye nemveliso.

**Umsebenzi wokubeka iliso kwiPlasma yoBunini bePanasonic:** Ukubeka iliso ngexesha langempela kunye nokuthintela ukungaqheleki kokukhutshwa kweplasma ukuthintela umonakalo we-Electrostatic Discharge (ESD), ngaloo ndlela kuqinisekiswa "ukusetyenzwa okungenamonakalo" kweemveliso.

**Umsebenzi Wokulandelela:** Ibonelela ngezakhono zokulandelela idatha ezipheleleyo kwinkqubo yemveliso, ihlangabezana neemfuno zolawulo lomgangatho oluqinileyo lwecandelo lokuvelisa le-semiconductor.

**Uthutho olusemgceni noluzenzekelayo:** Ixhasa uqwalaselo lwe-loader/unloader kunye neenkcukacha ezikwi-intanethi, ivumela ukuhlanganiswa ngokuthe ngqo kwimigca yemveliso ezenzekelayo ngaphandle kwesidingo sokungenelela ngesandla.

**Iingenelo eziphambili kunye neeNdawo zoSetyenziso**

Isebenzisa ubuchwepheshe obuphambili obukhankanyiweyo apha ngasentla, i-PSX307 ibonisa iingenelo ezibalulekileyo ekuphuculeni umgangatho wemveliso nasekunciphiseni iindleko, ngakumbi kwezi ndawo zilandelayo:

**Ukusebenza kakuhle kweendleko:** Ngokusebenzisa itekhnoloji yokucubungula i-plasma ye-Argon (Ar) ukususa iikhompawundi ze-nickel ezingaphezulu, ivumela ukwamkelwa kwenkqubo yokubeka i-"Flash Gold" engabizi kakhulu. Kwangaxeshanye, inciphisa ngempumelelo imiba efana nokwahlulwahlulwa, imingxunya, kunye nemingxunya enokuvela ngexesha lenkqubo yokupakisha. **Ukuphuculwa Okubalulekileyo Kokusebenza:** Ngenxa yoyilo lwayo oluhambelanayo kunye nenkqubo yokuthutha ezenzekelayo, izixhobo zifikelela kwisantya sokucubungula ukuya kuthi ga kwi-360 substrates/strips ngeyure—okubonisa ukonyuka kwe-50% ekusebenzeni xa kuthelekiswa nezixhobo eziqhelekileyo.

Ukuguqulwa komphezulu ukuze kuhlangatyezwane neemfuno ezahlukeneyo zenkqubo:

**Ukuqina Kokubopha Ngentsimbi Okuphuculweyo:** Ngaphambi kokuba kuhlanganiswe ngentambo okanye kuhlanganiswe i-flip-chip, ukususwa kwezinto ezingcolisayo eziphilayo kuphucula kakhulu amandla okucheba kunye nokuthembeka kokubopha.

**Ukuncamathelisa iResin okuPhuculweyo:** Ukuguqulwa komphezulu kusetyenziswa i-oxygen plasma (O₂) kuphinda kabini amandla okunamathela kweekhompawundi zokubumba ze-epoxy kunye nezinto ezizalisa ngaphantsi, okuthintela ngempumelelo ukuqhekeka.

**Iinkqubo zokuzalisa ngaphantsi kwe-Underfill eziSebenzisiweyo:** Iphucula iimpawu zokuhamba kwe-capillary, inciphisa ixesha lokuzalisa ngaphantsi kwe-40%—inzuzo ebaluleke kakhulu kwiitships ezinkulu kunye nezo zinobunzima obuphezulu be-I/O.

**Iindawo eziphambili zokusetyenziswa**

Ngenxa yezakhono zayo zokusebenza okuphezulu, i-PSX307 isetyenziswa kakhulu kwiinkqubo zokuvelisa ii-semiconductor eziphezulu:

**Ukupakisha Okukwinqanaba Le-Wafer:** Ukulungiswa komphezulu we-wafer ngaphambi kokuba i-die bonding; ukucocwa kwamaqhuma e-solder ngaphambi kokuba i-flip-chip bonding; kunye nokususwa kwentsalela (ukuncitshiswa) ngaphakathi kwezakhiwo ze-TSV (Through-Silicon Via).

**Ukupakisha Okuphambili:** Ukucoca kunye nokusebenza komphezulu we-PCB substrates ngaphambi kokuba kudityaniswe ucingo, kufakwe underfilling, kunye neenkqubo zokubumba.

**Iinkqubo kunye nezinto ezithile:** Ukususwa kweentsalela ze-resin kwi-wafer solder bumps; ukuphuculwa kokunyibilikisa kwee-layers zegolide ezixabisa kancinci; kunye nokusetyenziswa okufanayo.

**Izixhobo ezongezelelweyo**

Njengenxalenye ebalulekileyo yepotifoliyo yezisombululo ze-semiconductor zePanasonic, i-PSX307 isebenza ngaxeshanye neebhondi ze-MD-P flip-chip zePanasonic ezichanekileyo kakhulu. Olu manyano luqinisekisa utshintsho olungenamthungo ukusuka ekucoceni ukuya ekubekweni, nto leyo ekhokelela ekuphucukeni okukhulu ekuthembekeni kwemveliso iyonke.

**Isishwankathelo**

Ukuqukumbela, iPanasonic PSX307 yinkqubo yokucoca iplasma ephucukileyo ngobuchwepheshe eyenzelwe ngokukodwa iindawo zokuvelisa ngobuninzi. Ngokudityaniswa kwetekhnoloji entsha yepleyiti ehambelanayo kunye nenkqubo yokubeka esweni eyiyo, ifumana impumelelo enkulu ekusebenzeni kakuhle kwemveliso kunye nokunciphisa ngempumelelo iindleko zokuvelisa, konke oku ngelixa iqinisekisa inkqubo engonakalisiyo enobunye obukhethekileyo. Kwizicelo ezibandakanya ii-substrates ezinkulu okanye ii-wafers ezingama-300mm—kwaye apho iinkqubo ezibalulekileyo ezifana nokubopha ucingo kunye nokuzalisa ngaphantsi zifuna amanqanaba aphezulu okuthembeka—i-PSX307 ivelele njengesisombululo esifanele ukuqwalaselwa nzulu.