Besi fico trim and form system Compact Line - X

The Besi Fico Compact Line-X (FCL-X) is a fully automated lead-cutting and forming system capable of handling Extreme High Density (EXHD) lead frames (maximum size 125mm × 300mm). Through the integration of 50kN punching force, an intelligent contamination control system, and a modular design, it meets the increasing precision and process capability index (Cpk) requirements of advanced packaging.

Core Technical Parameters

The following are the key technical specifications of the FCL-X system compiled based on official Besi data:

Item Specifications and Indicators

System Model: Fico Compact Line - X (FCL-X)

Lead Frame Dimensions: Width: 25 - 125 mm; Length: 170 - 300 mm

Lead Frame Thickness: 0.1 - 0.4 mm

Product Thickness: 0 - 5 mm

Punching Force: 50 kN (approx. 6.6 joules)

Maximum Punching Speed: 250 punches/minute

Noise Level: Below 73 dB(A)

Equipment Dimensions (WxDxH): 1158 x 950 x 1455 mm

Equipment Weight: Approx. 850 kg

Power Requirements: 208-480VAC, 3~, 50/60 Hz

Power Consumption: 0.9 kVA

Air Consumption: Average 1.32 Nm³/h Key Advantages and Features

The core design philosophy of FCL-X is to provide high performance while also considering intelligence, environmental friendliness, and flexibility.

Extremely High Stamping Force and Machining Precision: The system is equipped with stamping modules capable of up to 50kN, 150% higher than the industry average of 20kN. This enables stable handling of lead frames with extremely high-density pin arrays, ensuring the forming quality and precision of the stamping process.

Advanced Contaminant Control System: Addressing the challenge of debris generation from pre-plated and comb-shaped lead frames, FCL-X features an independent suction system for each stamping unit, coupled with a unique cyclone dust filter, effectively capturing minute particles generated during stamping and ensuring continuous production.

Ultimate Efficiency and Ease of Operation: FCL-X's changeover time is less than 3 minutes, significantly improving the flexibility of multi-variety production. Its integrated RFID tool automatic identification system automatically identifies molds, reducing human error and accelerating changeover processes.

Modular Design and Multifunctional Integration: Utilizing a modular architecture, it allows for flexible configuration with dual-stack hopper processors, vision inspection, laser marking, and other units to achieve one-stop production and easily build a complete fully automated production line.

Intelligent Operation and Management: Equipped with a large touchscreen as the human-machine interface, and with optional SECS/GEM communication protocols, it can be seamlessly integrated into the factory's automation management system.

Diverse Module Configurations: As a highly modular system, FCL-X's core components and expandable modules are shown below. Users can build configurations ranging from basic to fully automated according to production needs.

Application Areas and Product Range: FCL-X is designed for high-volume, high-quality standard applications, and is particularly suitable for the following areas: Ultra-high density leadframe packages: such as DFN, QFN, and other high-density, small-size packages.

System-in-Package and Discrete Devices: such as SiP, SOT, etc.

Power Semiconductors and LEDs: such as Power MOSFETs, IGBTs, High Brightness LEDs, etc.

Automotive Electronic Chips: Automotive-grade chips with extremely high requirements for reliability and consistency.

Other applications include the processing of lead frames for sensors, MEMS, and special coatings such as OSP, CuPdAu PPF, and NiPdAu.

Market Positioning and Summary: In the lead-cutting equipment market, the FCL-X is positioned as a high-performance, ultra-high-density lead frame processing expert. Compared to competitors, its key advantages lie in its high punching pressure of 50kN and advanced contaminant control system, resulting in a balanced performance in terms of batch flexibility, changeover speed, and factory integration capabilities.

In short, the FCL-X is an automated device designed to meet the future demands of high-density, high-precision, and high-reliability packaging, representing a concentrated embodiment of Besi's technological strength in the lead-cutting field