SINTAIKE STK-7080 semiconductor wafer mounter

The SINTAIKE STK-7080 is primarily positioned as a "non-contact" vacuum lamination machine designed specifically for the thin wafer and compound semiconductor markets. Its core value lies in resolving the technical challenge of wafer breakage—a common issue during the lamination process for fragile wafers—through the application of innovative, roller-free vacuum technology.

**Core Features and Operating Principles**

The technical core of the STK-7080 can be summarized by three key concepts: "roller-free," "non-contact," and "vacuum lamination." The entire process is highly automated:

**Loading and Positioning:** The operator manually places the wafer or carrier ring onto a dedicated non-contact stage, where it is automatically positioned by the machine.

**Automated Preparation:** The machine automatically performs pre-processing tasks, including film feeding, separator paper collection, and waste film retrieval.

**Vacuum Lamination:** This is the most critical step. The machine creates a vacuum environment, utilizing differential air pressure to "press" the adhesive film onto the wafer surface. Since the entire process involves no roller contact, it fundamentally eliminates the risk of physical pressure damage and surface scratches.

**Cutting and Unloading:** Once lamination is complete, the machine automatically uses a circular cutter to trim the film, peels away the excess release liner, and collects the waste materials; finally, the operator retrieves the finished product.

**Functions, Advantages, and Key Characteristics**

The unique design of the STK-7080 provides significant advantages across multiple aspects:

**Characteristic** | **Description**

**Exceptional Process Performance** | Wafer yield reaches ≥99.9%; lamination quality is bubble-free (excluding bubbles caused by dust particles); and lamination accuracy is ±0.5 mm. Throughput is ≥60 wafers per hour.

**Unique Application Suitability** | Designed specifically for fragile wafers that require "edge-only contact," its non-contact vacuum technology is particularly well-suited for handling thin wafers as well as compound semiconductor wafers such as Gallium Arsenide (GaAs) and Gallium Nitride (GaN).

**Convenient Operation and Maintenance** | **High Automation:** Automatically executes the entire sequence—including lamination, feeding, cutting, film peeling, and waste collection—requiring the operator only to perform the initial loading and final unloading.

**Simple Maintenance:** The Mean Time to Repair (MTTR) is less than 1 hour, and downtime remains below 3%. Flexible and Versatile Configuration: Supports 4- to 8-inch wafers; compatible with blue film or UV film (230–300 mm in width, 100 m in length); supports 6-inch and 8-inch DISCO-standard carrier rings.

High Safety and Cleanliness: Equipped with light curtain protection and an emergency stop button; utilizes an ionized air fan for static control, making it suitable for use with static-sensitive devices; employs a high-vacuum pump from ULVAC (Japan) to ensure the reliability of the vacuum system. Detailed Specifications

The following detailed specifications have been compiled based on publicly available information:

Parameter Category | Detailed Specifications

Equipment Type | Floor-standing, Semi-automatic, Non-contact Vacuum Wafer Lamination Machine

Applicable Wafer Sizes | 4 to 8 inches (100mm / 200mm)

Wafer Thickness Range | 100 to 750 microns (µm)

Wafer Types | Silicon (Si), Silicon Carbide (SiC), Gallium Arsenide (GaAs)

Film Type | Blue Film or UV Film

Film Width | 230 to 300 mm

Film Thickness | 0.05 to 0.2 mm

Positioning Accuracy | ±0.5 mm

Support Ring Compatibility | 6-inch / 8-inch (DISCO Standard)

Lamination Principle | Roller-less, Non-contact Vacuum Lamination Technology

Automated Steps | Auto-feed, Lamination, Release Liner Take-up, Circular Cutter Dicing, Film Peeling, Waste Film Take-up

Human-Machine Interface (HMI) | PLC Control, equipped with a 10-inch Touchscreen

Safety Protection | Light Curtain Protection, Emergency Stop Button

Anti-Static Control | Ionizing Fan (Ionizer)

Vacuum Pump | ULVAC

Power Requirements | Single-phase AC 220V, 16A

Compressed Air | 0.45 ~ 0.6 MPa, Flow Rate: 70 L/min

Dimensions (WxDxH) | 950 × 1300 × 1800 mm

Equipment Net Weight | 480 kg

Mean Time Between Failures (MTBF) | > 500 hours

Mean Time to Repair (MTTR) | < 1 hour

Downtime | < 3%

Key Application Areas

The STK-7080 is primarily utilized in fields demanding extremely high process precision:

Pre-dicing Lamination for Thin Wafers: Used for the protection of ultra-thin wafers, preventing breakage during the dicing process.

Compound Semiconductor Manufacturing: Specifically designed for the protective film lamination of materials such as Gallium Arsenide (GaAs), Gallium Nitride (GaN), and Silicon Carbide (SiC). MEMS and Sensor Manufacturing: Handling wafers featuring micromechanical structures or those sensitive to pressure.

**Complementary Equipment and Procurement Information**

**Complementary Equipment:** As a "semi-automatic" system, the STK-7080 requires manual loading and unloading; consequently, it is frequently integrated with upstream wafer cleaning equipment and downstream fully automatic grinders and dicing machines.

**Summary**

Overall, the SINTAIKE STK-7080 is a technologically advanced, semi-automatic wafer laminator. Its core competitive advantage lies in its unique non-contact vacuum lamination technology, which specifically addresses—and successfully resolves—the critical challenge of material breakage that frequently occurs during the lamination process for ultra-thin wafers and compound semiconductors. If your production involves these types of high-value, fragile materials, the STK-7080 represents a mature, reliable solution well worth your consideration.