SAKI smt 3D X imashini BF-3AXiM110

SAKI BF-3AXiM110 ni sisitemu yo mu rwego rwo hejuru ya 3D X-ray yo kugenzura mu buryo bwikora (AXI), yagenewe guteranya ibikoresho bya elegitoroniki byinshi (nka BGA, CSP, PoP) hamwe n'ibikoresho bipfunyitse (nka SiP, Flip Chip). Ikoresha micro-yibanze ya X-ray yerekana amashusho + CT yo gusikana kugirango igere ku igeragezwa ridasenya imiterere yimbere ya PCBs, ikemura ingingo zagurishijwe zihishe, icyuho cyimbere, gusudira hamwe nizindi nenge gakondo AOI / SPI idashobora kugeraho, kandi ikoreshwa cyane mubikorwa byo murwego rwohejuru nko gukora ibinyabiziga bya elegitoroniki, ikirere, nibikoresho byubuvuzi.

2. Ibyiza byingenzi byo guhatanira

✅ Ultra-high resolution 3D imashusho

Nano-yibanze X-ray tube: ingano ntoya yibanze ≤1μm, irashobora kumenya neza micropores 0.1mm hamwe na 01005 yibigize kugurisha.

CT tomografiya (itabishaka): ishyigikira iyubakwa rya 3D inguni nyinshi, ikamenya neza imirongo itatu yuburinganire nubunini bwinenge.

Moteri yo gusesengura inenge

AI yimbitse yiga algorithm: ihita itandukanya inenge zigoye nkubusa, abagurisha imbeho, hamwe nikiraro, hamwe nigipimo cyibinyoma cya <1%.

Kugaragaza Multimodal: ishyigikira uburyo bwa 2D / 3D guhinduranya kugirango uhuze nibikenewe bitandukanye (nko kugenzura byihuse + CT gusikana ahantu h'ingenzi).

Ection Kumenya neza no kwikora

Gusikana byihuta cyane: Umuvuduko ntarengwa wo gutahura ugera kuri 200mm / s (uburyo bwa 2D), ushyigikira guhuza ibice bibiri.

3. Imikorere yibanze

Ubushobozi busanzwe bwo kumenya inenge

Ubwoko bwuzuye Gutahura Ihame ryimanza

Ubusa mubagurisha bahuza 3D-CT isesengura ryikwirakwizwa ryinshi imbere yugurisha Automotive BGA igurisha hamwe kwizerwa kugenzura

Ubukonje bukonje X-ray ibara ryerekana ibara ryerekana ibicuruzwa bitashongeshejwe Kumenya ingingo zingenzi zagurishijwe mubikoresho byubuvuzi

Kwubaka moderi ya 3D yongeye kwiyubaka kubagurisha bahujwe hamwe guhuza Umuyoboro mwinshi wa CSP kububiko bwa terefone igendanwa

Guhuza ibice 2D / 3D kugereranya ibice hamwe na padiri Umwanya wa Aerosmace PCB igenzura neza neza

Porogaramu idasanzwe yo gusaba

Kugaragaza inkingi y'umuringa: gupima uburebure bwa micro bumpe (ikoreshwa kuri Flip Chip).

Binyuze mu gusesengura igipimo cy’imyobo: gereranya uburinganire bwa metallisation ya PCB umuringa usizwe umuringa (PTH).

Isesengura ryananiwe (FA): shakisha amakosa yihishe nkumuzunguruko mugufi hamwe nuduce mubice byimbere bya PCB.

4. Ibikoresho byuma nibikoresho byihariye

📌 Ibyingenzi byingenzi

Imashini itanga X-ray:

Umuvuduko w'amashanyarazi: 30kV-110kV (irashobora guhinduka), imbaraga ≥90W.

Ingano yibanze: 1μm (ntarengwa), ubuzima ≥ 20.000.

Detector:

Ikibaho cya Flat-paneli ikemura: 2048 × 2048 pigiseli, intera ikora 16bit.

Sisitemu ya mashini:

Icyitegererezo cyicyiciro: ≤5kg, ingendo 500mm × 500mm × 200mm (XYZ).

Uburyo bwo kugoreka: ± 60 ° (guhitamo 360 ° kuzunguruka CT uburyo).

Amet Ibipimo bya tekinike Incamake Imbonerahamwe

Ibipimo BF-3AXiM110 Ibisobanuro

Imirasire ya X ≤1μm (uburyo bwa 2D), 5 mm (3D-CT)

Ingano ntarengwa ya PCB 510mm × 460mm

Umuvuduko wo gutahura ≤200mm / s (2D), min30min / ikibaho (CT yuzuye)

Kumenyekanisha ubusa ≥5μm (diameter)

Umutekano wimirasire Igipimo cyinshi <1μSv / h, bijyanye na GBZ 117-2022

Imigaragarire y'itumanaho SECS / GEM, TCP / IP, OPC UA

5. Imanza zisaba inganda

Ibyuma bya elegitoroniki

ECU igenzura module: Menya abagurisha BGA igipimo cyu gihombo (bisabwa <15%) kugirango wizere ko ubushyuhe bwihuse hamwe nibidukikije bihindagurika.

Automotive radar PCB: Kugenzura ubuziranenge bwanyuze mu mwobo wuzuza inzira ndende yerekana ibimenyetso.

Ikirere

Module y'itumanaho rya satelite: CT isikana urwego rwimbere rwuzuzanya rwibibaho byinshi kugirango bikureho ingaruka zumuzunguruko muto.

Sisitemu yo kugenzura indege: Menya ubunyangamugayo bwibicuruzwa bidafite aho bihurira nibice byinshi-bipima QFN.

Devices Ibikoresho byubuvuzi

Ibikoresho bya elegitoroniki bidashoboka: Menya neza ko ingingo zigurisha zidafite ibyuma byangiza byangiza (nkibisigisigi bya gurş).

Ibikoresho byerekana amashusho PCB: Kugenzura intera iringaniye yumuzunguruko mwinshi.

6. Gutandukanya abanywanyi

Igipimo SAKI BF-3AXiM110 Ibikoresho bisanzwe X-Ray

Umwanzuro ≤1μm (micro yibanze) Mubisanzwe 3 ~ 5μm (umuyoboro ufunze)

Uburyo bwo gutahura 2D + 3D-CT Kwishyira hamwe Benshi bashyigikira gusa 2D cyangwa tomografi yoroshye

Ubwenge AI ikora inenge itondekanya + Isesengura ryibikorwa bya SPC Wishingikirize kubisobanuro byintoki

Kwaguka Isesengura ryingufu zidasanzwe (EDS) module Igikorwa gihamye

8. Incamake n'ibyifuzo

SAKI BF-3AXiM110 yabaye umurinzi mwiza wogukora ibikoresho bya elegitoroniki byizewe cyane binyuze mumashusho ya X-ray yerekana amashusho, kwiyubaka kwa 3D byubwenge hamwe ninganda 4.0. Agaciro kayo yibanze muri:

Kwirinda neza: guhagarika amakosa ashobora gutangira hakiri kare no kugabanya ibiciro byo gusana nyuma yo kugurisha.

Gutezimbere inzira: ibitekerezo byo guhinduranya ibipimo byo gusudira binyuze mumibare yuzuye (nkigipimo cyubusa).

Ingwate yo kubahiriza: yujuje amahame akomeye nk'amabwiriza agenga ibinyabiziga, ubuvuzi, n'ikirere.