SAKI smt 3D X ray makina BF-3AXiM110

SAKI BF-3AXiM110 ndi apamwamba-mapeto 3D X-ray basi anayendera dongosolo (AXI), opangidwa kuti mkulu kachulukidwe pakompyuta msonkhano (monga BGA, CSP, PoP) ndi zovuta mmatumba zipangizo (monga SiP, Flip Chip). Amagwiritsa ntchito luso laling'ono la X-ray imaging + CT scanning kuti akwaniritse kuyesa kosawonongeka kwa kapangidwe ka mkati mwa PCBs, kuthetsa zolumikizira zobisika, zotchingira mkati, ming'alu yowotcherera ndi zolakwika zina zomwe AOI/SPI yachikhalidwe sichingafikire, ndipo imagwiritsidwa ntchito kwambiri m'magawo opanga zinthu zapamwamba kwambiri monga zamagetsi zamagalimoto, zakuthambo, ndi zida zamankhwala.

2. Ubwino wampikisano wapakati

✅ Kujambula kwapamwamba kwambiri kwa 3D

Nano-focus X-ray chubu: kukula kocheperako ≤1μm, kumatha kuzindikira bwino ma micropores a 0.1mm ndi 01005 chigawo cha solder.

CT tomography (posankha): imathandizira kumangidwanso kwamitundu yambiri ya 3D, imayika molondola magawo atatu azithunzi ndi kuchuluka kwa zolakwika.

✅ Injini yowunikira zolakwika zanzeru

AI yozama kuphunzira algorithm: imadziyika yokha zolakwika zovuta monga voids, ma solders ozizira, ndi mlatho, ndi ma alarm abodza a <1%.

Kuzindikira kwa Multimodal: kumathandizira kusintha kwa 2D / 3D kuti igwirizane ndi zosowa zosiyanasiyana zodziwikiratu (monga kuyang'ana mwachangu + CT kusanthula madera ofunikira).

✅ Kuzindikira bwino komanso kudzipangira zokha

Kusanthula kothamanga kwambiri: Kuthamanga kwambiri kozindikira kumafika 200mm/s (2D mode), kumathandizira kuzindikira kwanjira ziwiri zofanana.

3. Ntchito zodziwika bwino

🔹 Kutha kuzindikira zolakwika

Defect Type Detection principle Application Milandu

Zopanda m'malo olumikizirana 3D-CT kusanthula kugawika kwa thovu mkati mwa solder Magalimoto a BGA solder olumikizana odalirika kutsimikizika

Cold solder X-ray grayscale kusiyana kuti azindikire madera osasungunuka a solder

Kumanganso kwachitsanzo cha 3D cholumikizira cholumikizira cholumikizana ndi solder chokwera kwambiri cha CSP pama board a mafoni am'manja

Kusalinganiza kolakwika kwa 2D/3D kuyerekeza kwa chigawo ndi pad malo a Azamlengalenga PCB msonkhano wolondola

🔹 Zochitika zapadera zogwiritsira ntchito

Kuzindikira kugunda kwa zipilala zamkuwa: kuyeza kutalika kwa minyewa yaying'ono (yogwirizana ndi Flip Chip).

Kupyolera mu kusanthula kwa mabowo odzaza mabowo: tsimikizirani kukhulupirika kwazitsulo zamabowo a PCB amkuwa (PTH).

Kulephera kusanthula (FA): pezani zolakwika zobisika monga mabwalo amfupi ndi ming'alu yamkati mwa PCB.

4. Kukonzekera kwa hardware ndi ndondomeko

📌 Zida zazikulu za hardware

Jenereta ya X-ray:

Voltage osiyanasiyana: 30kV-110kV (chosinthika), mphamvu ≥90W.

Kuyikira Kwambiri: 1μm (osachepera), moyo ≥20,000 maola.

Chodziwira:

Chojambulira chojambulira chalathyathyathya: mapikiselo a 2048 × 2048, osiyanasiyana 16bit.

Makina amakina:

Zitsanzo siteji katundu: ≤5kg, kuyenda 500mm×500mm×200mm (XYZ).

Makina opendekeka: ± 60° (posankha 360° kuzungulira CT mode).

📌Technical Parameters Summary Table

Zithunzi za BF-3AXiM110

X-ray kusamvana ≤1μm (2D mode), 5μm (3D-CT)

Kukula kwakukulu kwa PCB 510mm × 460mm

Liwiro lozindikira ≤200mm/s (2D), ≤30min/board (CT scan yathunthu)

Kuzindikira kuti palibe kanthu ≥5μm (m'mimba mwake)

Chitetezo cha radiation Kutayikira mlingo <1μSv/h, mogwirizana ndi GBZ 117-2022

Kuyankhulana kwa SECS/GEM, TCP/IP, OPC UA

5. Milandu yogwiritsira ntchito mafakitale

🚗 Zamagetsi zamagalimoto

ECU control module: Dziwani kuchuluka kwa void void ya BGA solder (yofunikira <15%) kuti muwonetsetse kudalirika pakutentha komanso kugwedezeka kwakukulu.

PCB yamagalimoto a radar: Tsimikizirani mtundu wamabowo odzaza njira zama siginecha zapamwamba kwambiri.

🛰️ Zamlengalenga

Satellite communication module: CT imayang'ana kulumikiza kwamkati kwa ma board amitundu yambiri kuti athetse chiwopsezo cha mabwalo ang'onoang'ono.

Dongosolo lowongolera ndege: Dziwani kukhulupirika kwa zolumikizira zopanda lead za mapaketi a QFN owerengeka kwambiri.

🏥 Zipangizo zamankhwala

Zipangizo zamagetsi zoyika: Onetsetsani kuti zolumikizira zogulitsira zilibe zowononga zitsulo zapoizoni (monga zotsalira zamtovu).

Zipangizo zojambulira PCB: Tsimikizirani malo otsekera a ma circuit high-voltage.

6. Kusiyanitsa ndi opikisana nawo

Dimension SAKI BF-3AXiM110 Zida Zamakono za X-Ray

Kusamvana ≤1μm (micro focus) Nthawi zambiri 3~5μm (chubu chotsekedwa)

Njira yodziwira 2D + 3D-CT kuphatikiza Zambiri zimangothandizira 2D kapena tomography yosavuta

Intelligence AI automatic defect classification + SPC kusanthula mayendedwe Dalirani kutanthauzira pamanja

Extensibility Optional energy spectrum analysis (EDS) module Fixed function

8. Chidule ndi malingaliro

SAKI BF-3AXiM110 yakhala mlonda wabwino kwambiri wodalirika wopanga zamagetsi kudzera pazithunzi za X-ray za nano, kukonzanso kwanzeru kwa 3D ndi kuthekera kophatikiza kwa Viwanda 4.0. Phindu lake lalikulu lagona mu:

Kupewa kuwonongeka: chepetsani zolakwika zomwe zingachitike mutangoyamba ndikuchepetsa mtengo wokonzanso pambuyo pogulitsa.

Kukhathamiritsa kwa njira: mayankho pakusintha magawo awotcherera kudzera mu kuchuluka kwa data (monga void rate).

Chitsimikizo chotsatira: kwaniritsani miyezo yokhazikika monga malamulo amagalimoto, azachipatala, ndi ndege.