SAKI smt 3D X ray machine BF-3AXiM110

SAKI BF-3AXiM110 is a high-end 3D X-ray automatic inspection system (AXI), designed for high-density electronic assembly (such as BGA, CSP, PoP) and complex packaged devices (such as SiP, Flip Chip). It uses micro-focus X-ray imaging + CT scanning technology to achieve non-destructive testing of the internal structure of PCBs, solve hidden solder joints, internal voids, welding cracks and other defects that traditional AOI/SPI cannot reach, and is widely used in high-end manufacturing fields such as automotive electronics, aerospace, and medical equipment.

2. Core competitive advantages

✅ Ultra-high resolution 3D imaging

Nano-focus X-ray tube: minimum focus size ≤1μm, can clearly identify 0.1mm micropores and 01005 component solder joints.

CT tomography (optional): supports multi-angle 3D reconstruction, accurately locates the three-dimensional coordinates and volume of defects.

✅ Intelligent defect analysis engine

AI deep learning algorithm: automatically classifies complex defects such as voids, cold solders, and bridging, with a false alarm rate of <1%.

Multimodal detection: supports 2D/3D mode switching to adapt to different detection needs (such as fast full inspection + CT scanning of key areas).

✅ Efficient detection and automation

High-speed scanning: The maximum detection speed reaches 200mm/s (2D mode), supporting dual-lane parallel detection.

3. Core detection functions

🔹 Typical defect detection capabilities

Defect type Detection principle Application cases

Void in solder joints 3D-CT analysis of bubble distribution inside solder Automotive BGA solder joint reliability verification

Cold solder X-ray grayscale contrast to identify unmelted solder areas Detection of key solder joints in medical equipment

Bridging 3D model reconstruction of adjacent solder joint connectivity High-density CSP packaging for mobile phone motherboards

Component misalignment 2D/3D comparison of component and pad position Aerospace PCB assembly precision control

🔹 Special application scenarios

Copper pillar bump detection: measure the height consistency of micro bumps (applicable to Flip Chip).

Through hole filling rate analysis: quantify the metallization integrity of PCB copper-plated holes (PTH).

Failure analysis (FA): locate hidden faults such as short circuits and cracks in the inner layer of PCB.

4. Hardware configuration and specifications

📌 Key hardware components

X-ray generator:

Voltage range: 30kV-110kV (adjustable), power ≥90W.

Focus size: 1μm (minimum), life ≥20,000 hours.

Detector:

Flat-panel detector resolution: 2048×2048 pixels, dynamic range 16bit.

Mechanical system:

Sample stage load: ≤5kg, travel 500mm×500mm×200mm (XYZ).

Tilt mechanism: ±60° (optional 360° rotation CT mode).

📌 Technical Parameters Summary Table

Parameters BF-3AXiM110 Specifications

X-ray resolution ≤1μm (2D mode), 5μm (3D-CT)

Maximum PCB size 510mm × 460mm

Detection speed ≤200mm/s (2D), ≤30min/board (full CT scan)

Void detection sensitivity ≥5μm (diameter)

Radiation safety Leakage dose <1μSv/h, in line with GBZ 117-2022

Communication interface SECS/GEM, TCP/IP, OPC UA

5. Industry application cases

🚗 Automotive electronics

ECU control module: Detect BGA solder joint void rate (required <15%) to ensure reliability in high temperature and high vibration environments.

Automotive radar PCB: Verify the quality of through-hole filling of high-frequency signal paths.

🛰️ Aerospace

Satellite communication module: CT scans the inner layer interconnection of multi-layer boards to eliminate the risk of micro short circuits.

Flight control system: Detect the integrity of leadless solder joints of high-pin-count QFN packages.

🏥 Medical devices

Implantable electronics: Ensure that solder joints are free of toxic metal contaminants (such as lead residues).

Imaging equipment PCB: Verify the insulation spacing of high-voltage circuits.

6. Differentiation from competitors

Dimension SAKI BF-3AXiM110 Conventional X-Ray equipment

Resolution ≤1μm (micro focus) Usually 3~5μm (closed tube)

Detection mode 2D+3D-CT integration Most only support 2D or simple tomography

Intelligence AI automatic defect classification + SPC trend analysis Rely on manual interpretation

Extensibility Optional energy spectrum analysis (EDS) module Fixed function

8. Summary and recommendation

SAKI BF-3AXiM110 has become a quality guardian of high-reliability electronic manufacturing through nano-scale X-ray imaging, intelligent 3D reconstruction and Industry 4.0 integration capabilities. Its core value lies in:

Defect prevention: intercept potential faults at an early stage and reduce after-sales repair costs.

Process optimization: feedback to welding parameter adjustment through quantitative data (such as void rate).

Compliance guarantee: meet strict standards such as automotive regulations, medical, and aerospace.