SAKI smt 3D X ray machine BF-3AXiM110

I-SAKI BF-3AXiM110 yinkqubo yokuhlola ezenzekelayo ye-X-ray ye-3D ye-X-ray (i-AXI), eyenzelwe i-high-density ye-electronic assembly (efana ne-BGA, i-CSP, i-PoP) kunye nezixhobo ezihlanganisiweyo eziyinkimbinkimbi (ezifana ne-SiP, i-Flip Chip). Isebenzisa i-micro-focus X-ray imaging + CT scanning technology ukuphumeza uvavanyo olungonakaliyo lwesakhiwo sangaphakathi se-PCB, ukucombulula i-solder joints efihliweyo, i-voids yangaphakathi, ii-welding cracks kunye nezinye iziphene ezingenakufikelela kuzo i-AOI / SPI yendabuko, kwaye isetyenziswa ngokubanzi kwiinkalo zokuvelisa eziphezulu ezifana ne-automotive electronics, i-aerospace, kunye nezixhobo zonyango.

2. Iinzuzo ezingundoqo zokhuphiswano

✅Umfanekiso we-3D onesisombululo esiphezulu kakhulu

I-Nano-focus X-ray ityhubhu: ubungakanani obuncinci bokugxila ≤1μm, inokuchonga ngokucacileyo i-micropores ye-0.1mm kunye ne-01005 yecandelo le-solder joints.

I-CT tomography (ukhetho): ixhasa i-multi-angle 3D reconstruction, ibeka ngokuchanekileyo i-coordinates ezintathu-dimensional kunye nomthamo weziphene.

✅ Injini yokuhlalutya isiphene esikrelekrele

I-algorithm yokufunda enzulu ye-AI: ihlela ngokuzenzekelayo iziphene ezinzima ezifana ne-voids, ii-solder ezibandayo, kunye ne-bridging, kunye nesantya se-alarm yobuxoki <1%.

Ukufunyanwa kwe-Multimodal: isekela i-2D / 3D imodi yokutshintsha ukulungelelanisa iimfuno ezahlukeneyo zokubona (njengokuhlola ngokukhawuleza okugcweleyo + ukuskena kwe-CT yeendawo eziphambili).

✅ Ukufunyaniswa okusebenzayo kunye nokuzenzekelayo

Isantya esiphezulu sokuskena: Isantya esiphezulu sokufumanisa sifikelela kwi-200mm / s (imodi ye-2D), exhasa ukufunyanwa kweendlela ezimbini ezifanayo.

3. Imisebenzi yokufumanisa ingundoqo

🔹 Ukukwazi ukubona isiphene

Uhlobo lwesiphene Umgaqo wokufumanisa iimeko zesicelo

I-Void kumalungu e-solder Uhlalutyo lwe-3D-CT lokusasazwa kweqamza ngaphakathi kwe-solder I-Automotive BGA solder yokuqinisekisa ukuthembeka okudibeneyo

I-solder ebandayo ye-X-ray ye-grayscale umahluko ukuchonga iindawo ze-solder ezinganyibilikiyo Ukufunyanwa kweendawo eziphambili ze-solder kwizixhobo zonyango

Ukuvala imodeli ye-3D yokwakhiwa kwakhona koqhagamshelo oludibeneyo lwe-solder ekufutshane Ukupakishwa kwe-CSP yoxinaniso oluphezulu lweebhodi zefowuni eziphathwayo

Ulungelelwaniso olungalunganga lwe-2D/3D uthelekiso lwecandelo kunye nesikhundla sepadi Ulawulo oluchanekileyo lwendibano ye-Aerospace PCB

🔹 Iimeko ezikhethekileyo zesicelo

Ukubona iqhuma lentsika yobhedu: linganisa ubude bokuhambelana kwamaqhuqhuva amancinci (asebenza kwiFlip Chip).

Ngokuhlalutya izinga lokuzaliswa komngxuma: ukulinganisa ukunyaniseka kwe-metallization ye-PCB imingxuma yobhedu (PTH).

Uhlalutyo lokungaphumeleli (FA): fumana iimpazamo ezifihliweyo ezifana neesekethe ezimfutshane kunye neentanda kwi-maleko yangaphakathi ye-PCB.

4. Ubumbeko lwe-Hardware kunye neenkcukacha

📌 Izinto eziphambili zehardware

Ijenereyitha yeX-reyi:

Uluhlu lwe-voltage: 30kV-110kV (i-adjustable), amandla ≥90W.

Ubungakanani bogxininiso: 1μm (ubuncinci), ubomi ≥20,000 iiyure.

Isikhangeli:

Isisombululo sesixhobo se-flat-panel: 2048×2048 pixels, uluhlu oluguquguqukayo lwe-16bit.

Inkqubo yoomatshini:

Umthwalo wesigaba sesampuli: ≤5kg, ukuhamba 500mm×500mm×200mm (XYZ).

Indlela yokutyeka: ±60 ° (ukhetho lwe-360 ° ukujikeleza imo ye-CT).

📌 Itheyibhile yesiShwankathelo seeParameters zobuGcisa

IiParameters BF-3AXiM110 Iinkcukacha

Isisombululo seX-reyi ≤1μm (imo ye-2D), 5μm (3D-CT)

Ubungakanani obukhulu bePCB 510mm × 460mm

Isantya sokubona ≤200mm/s (2D), ≤30min/ibhodi (i-CT scan epheleleyo)

Uvakalelo olungekhoyo ≥5μm (ubukhulu)

Ukhuseleko kwimitha Idosi yokuvuza <1μSv/h, ngokuhambelana ne-GBZ 117-2022

Unxibelelwano lonxibelelwano lwe-SECS/GEM, TCP/IP, OPC UA

5. Amatyala ezicelo zeshishini

🚗 Iimoto ze-elektroniki

Imodyuli yokulawula ye-ECU: Khangela i-BGA solder joint void rate (efunekayo <15%) ukuqinisekisa ukuthembeka kwiqondo lokushisa eliphezulu kunye neendawo eziphezulu ze-vibration.

I-PCB yerada yeemoto: Qinisekisa umgangatho wokuzaliswa komngxuma wokuzaliswa kweendlela zomqondiso we-frequency ephezulu.

🛰️ I-Aerospace

Imodyuli yonxibelelwano lweSatellite: I-CT ihlola uqhagamshelo lwangaphakathi lweebhodi ezinomaleko amaninzi ukuphelisa umngcipheko weesekethe ezimfutshane ezincinci.

Inkqubo yokulawula i-Flight: Khangela ingqibelelo yamalungu e-solder angenayo i-lead yeepakethe eziphezulu ze-QFN.

🏥 Izixhobo zonyango

Ii-electronics ezifakelwayo: Qinisekisa ukuba amalungu e-solder awanazo izingcolisi zesinyithi eziyityhefu (ezifana neentsalela zelothe).

Isixhobo sokubonisa i-PCB: Qinisekisa isithuba se-insulation kwiisekethe ezinombane ophezulu.

6. Umahluko kubantu okhuphisana nabo

Dimension SAKI BF-3AXiM110 Izixhobo eziqhelekileyo zeX-Ray

Isisombululo ≤1μm (i-micro focus) Ngokuqhelekileyo yi-3~5μm (ityhubhu evaliweyo)

Imowudi yokubona I-2D + 3D-CT indibaniselwano Uninzi luxhasa kuphela i-2D okanye i-tomography elula

I-Intelligence AI yokuhlelwa kwesiphene ngokuzenzekelayo + Uhlalutyo lwentsingiselo ye-SPC Thembela ekutolikweni ngesandla

Ukwandiswa Uphononongo lwamandla okuzikhethelayo (EDS) imodyuli esisigxina

8. Isishwankathelo kunye neengcebiso

I-SAKI BF-3AXiM110 ibe ngumgcini womgangatho wokuthembeka okuphezulu kwemveliso ye-elektroniki nge-nano-scale X-ray imaging, ukwakhiwa kwakhona kwe-3D ehlakaniphile kunye ne-Industry 4.0 yokuhlanganisa amandla. Ixabiso layo eliphambili liku:

Uthintelo lwesiphene: ukunqanda iimpazamo ezinokwenzeka kwangethuba kwaye unciphise iindleko zokulungisa emva kokuthengisa.

Ukulungiswa kwenkqubo: impendulo kwi-welding parameter uhlengahlengiso ngokusebenzisa idatha yobuninzi (njengezinga elingenanto).

Isiqinisekiso sokuthobela: ukuhlangabezana nemigangatho engqongqo efana nemigaqo yeemoto, ezonyango, kunye ne-aerospace.