SAKI smt ekyuma kya X ray ekya 3D BF-3AXiM110

SAKI BF-3AXiM110 nkola ya mutindo gwa waggulu eya 3D X-ray automatic inspection system (AXI), eyakolebwa okukuŋŋaanya ebyuma eby’amaanyi (nga BGA, CSP, PoP) n’ebyuma ebizibu ebipakiddwa (nga SiP, Flip Chip). Ekozesa tekinologiya wa micro-focus X-ray imaging + CT scanning okutuuka ku kukebera okutali kwa kusaanyaawo kw’ensengekera y’omunda eya PCBs, okugonjoola ebiyungo bya solder ebikwese, ebituli eby’omunda, enjatika z’okuweta n’obulema obulala AOI/SPI ey’ekinnansi gy’etasobola kutuukako, era ekozesebwa nnyo mu bintu eby’omulembe eby’okukola ebintu ng’ebyuma by’emmotoka, eby’omu bwengula, n’ebyuma eby’obujjanjabi.

2. Enkizo enkulu mu kuvuganya

✅ Okukuba ebifaananyi mu ngeri ya 3D ey’obulungi obw’amaanyi ennyo

Nano-focus X-ray tube: obunene obutono obw’okussa essira ≤1μm, esobola okuzuula obulungi 0.1mm micropores ne 01005 component solder joints.

CT tomography (optional): ewagira multi-angle 3D reconstruction, okuzuula obulungi coordinates ez’ebitundu bisatu n’obunene bw’obulema.

✅ Yingini entegefu okwekenneenya obulema

AI deep learning algorithm: egabanya mu ngeri ey’otoma ebikyamu ebizibu nga voids, cold solders, ne bridge, nga erimu alamu ey’obulimba <1%.

Multimodal detection: ewagira 2D/3D mode switching okutuukagana n’ebyetaago eby’enjawulo okuzuula (nga fast full inspection + CT scanning of key areas).

✅ Okuzuula obulungi n'okukola mu ngeri ey'obwengula

Sikaani ey’amaanyi: Sipiidi esinga obunene ey’okuzuula etuuka ku mm/s 200 (2D mode), nga ewagira okuzuula okw’emirongooti ebiri mu ngeri ey’okukwatagana.

3. Emirimu gy’okuzuula emisingi

🔹 Obusobozi obwa bulijjo obw'okuzuula obulema

Ekika ky’obulema Enkola y’okuzuula Emisango gy’okukozesa

Void mu biyungo bya solder 3D-CT okwekenneenya okusaasaana kwa bubble munda mu solder Automotive BGA solder joint okwesigika okukakasa

Cold solder X-ray grayscale contrast okuzuula ebitundu bya solder ebitasaanuuse Okuzuula ebiyungo bya solder ebikulu mu byuma by’obujjanjabi

Bridging 3D model reconstruction of adjacent solder joint connectivity Okupakinga kwa CSP okwa density enkulu ku motherboards z’amasimu

Okugeraageranya ebitundu ebitali bituufu 2D/3D okugeraageranya ekitundu n’ekifo kya paadi Aerospace PCB assembly precision control

🔹 Ensonga ez'enjawulo ez'okusaba

Okuzuula ebikonde by’empagi y’ekikomo: pima obutakyukakyuka bw’obugulumivu bw’ebikonde ebitonotono (ebikozesebwa ku Flip Chip).

Okuyita mu kwekenneenya omutindo gw’okujjuza ebinnya: omuwendo gw’obulungi bw’ebyuma ebiyitibwa PCB copper-plated holes (PTH).

Okwekenenya okulemererwa (FA): funa ensobi ezikwese nga short circuits n’enjatika mu layeri ey’omunda eya PCB.

4. Ensengeka ya Hardware n’ebikwata ku nsonga eno

📌 Ebitundu ebikulu ebikozesebwa mu byuma

Jenereta ya X-ray:

Voltage range: 30kV-110kV (etereezebwa), amaanyi ≥90W.

Enkula y’okussa essira: 1μm (ekitono ennyo), obulamu ≥20,000 essaawa.

Ekizuula:

Obulung’amu bw’ekintu ekizuula ekipande ekipapajjo: 2048×2048 pixels, dynamic range 16bit.

Enkola y’ebyuma:

Omugugu gw’omutendera ogw’ekyokulabirako: ≤5kg, okutambula 500mm × 500mm × 200mm (XYZ).

Enkola y’okulengejja: ±60° (enkola ya CT ey’okukyusakyusa 360° ey’okwesalirawo).

📌 Omulongooti gw’okufunza ebipimo by’ebyekikugu

Ebipimo BF-3AXiM110 Ebikwata ku

Okusalawo kwa X-ray ≤1μm (engeri ya 2D), 5μm (3D-CT) .

Sayizi ya PCB esinga obunene 510mm × 460mm

Sipiidi y’okuzuula ≤200mm/s (2D), ≤30min/board (CT scan enzijuvu)

Obuwulize bw’okuzuula obuziba ≥5μm (diameter) .

Obukuumi bw’obusannyalazo Dozi y’okukulukuta <1μSv/h, nga ekwatagana ne GBZ 117-2022

Enkolagana y’empuliziganya SECS/GEM, TCP/IP, OPC UA

5. Emisango gy’okusaba mu makolero

🚗 Ebyuma ebikozesebwa mu mmotoka

ECU control module: Zuula BGA solder joint void rate (ekyetaagisa <15%) okukakasa okwesigika mu bbugumu erya waggulu n’embeera z’okukankana okungi.

Rada y’emmotoka PCB: Kakasa omutindo gw’okujjuza okuyita mu binnya eby’amakubo ga siginiini eza frequency enkulu.

🛰️ Eby'omu bwengula

Module y’empuliziganya ya setilayiti: CT esika okuyungibwa kwa layeri ey’omunda eya bboodi ezirina layeri nnyingi okumalawo obulabe bwa micro short circuits.

Enkola y’okufuga ennyonyi: Zuula obulungi bw’ebiyungo bya solder ebitaliiko lead eby’ebipapula bya QFN ebirina ppini ennene.

🏥 Ebyuma ebikozesebwa mu by'obujjanjabi

Ebyuma ebiteekebwa mu mubiri: Kakasa nti ebiyungo bya solder tebiriimu bucaafu bwa kyuma bwa butwa (nga ebisigalira by’omusulo).

Ebyuma ebikuba ebifaananyi PCB: Kakasa ebanga ly’okuziyiza (insulation spacing) mu circuit za vvulovumenti enkulu.

6. Okwawukana ku bavuganya

Dimension SAKI BF-3AXiM110 Ebyuma ebya bulijjo ebya X-Ray

Okusalawo ≤1μm (micro focus) Ebiseera ebisinga 3 ~ 5μm (closed tube)

Enkola y’okuzuula Okugatta 2D+3D-CT Ebisinga biwagira 2D oba tomography ennyangu yokka

Intelligence AI automatic defect classification + SPC trend analysis Weesigamye ku kutaputa mu ngalo

Okugaziwa Module y’okwekenneenya ensengekera y’amasoboza ey’okwesalirawo (EDS) Omulimu ogutakyukakyuka

8. Mu bufunze n’okuteesa

SAKI BF-3AXiM110 efuuse omukuumi w’omutindo gw’okukola ebyuma ebyesigika ennyo okuyita mu kukuba ebifaananyi bya X-ray ku nano-scale, okuddamu okuzimba mu ngeri ey’amagezi mu 3D n’obusobozi bw’okugatta Industry 4.0. Omugaso gwayo omukulu guli mu:

Okuziyiza obulema: okukwata ensobi eziyinza okubaawo nga bukyali n’okukendeeza ku ssente z’okuddaabiriza oluvannyuma lw’okutunda.

Enkola okulongoosa: okuddamu ku welding parameter adjustment okuyita mu quantitative data (nga void rate).

Omusingo gw’okugoberera: okutuukiriza omutindo omukakali nga amateeka g’emmotoka, eby’obujjanjabi, n’eby’omu bwengula.