Gacan-qabaha tijaabada ISMECA NY32

ISMECA NY32 waa nidaam tijaabo/kala-soocid/baaritaan semiconductor wareeg ah oo 32-xagal ah oo ka socda ISMECA (oo hadda qayb ka ah Cohu), Switzerland. Waxaa loogu talagalay isku-dhafka sare, mugga sare, iyo xaaladaha baaritaanka ugu dambeeya ee isku-dhafka sare, waana qalab asaasi ah oo loogu talagalay soo saarista ballaaran ee RF, analog, aaladaha korontada, iyo baakadaha horumarsan.

I. Mabda'a Shaqada (Hab-u-habaynta Isbarbardhigga Wareegga ah)

NY32 waxay isticmaashaa miis wareeg ah oo sax ah oo 32-saldhig ah si ay otomaatig ugu noqoto dhammaan habka tijaabada, kormeerka, iyo kala soocidda iyada oo loo marayo "saldhigyada is barbar socda + wareegga isku-dhafan":

Quudinta: Quudinta baaldiga/tuubada/guluubka, oo leh meelaynta muuqaalka iyo sixitaanka qaab-dhismeedka.

Wareegga Wareegga: 32 saldhig ayaa si isku mid ah u wareega, iyagoo si isdaba joog ah u dhammaystiraya kormeerka indhaha ee 6-geesoodka ah → ogaanshaha cilladaha infrared-ka → Cabbirka qaab-dhismeedka 3D → tijaabada korantada → calaamadaynta → kala-soocidda.

Ficillada Muhiimka ah:

Aragga: Kamarad xawaare sare leh + gelitaanka infrared-ka, oo ogaanaysa muuqaalka/cabbirka/dillaaca.

Tijaabinta: Xiriirka kaarka baaritaanka, dhammaystirka tijaabada DC/RF/parameter.

Kala-soocidda: Qaybaha waxaa loo kala saaraa tayo (Wanaagsan/Cillad/Darajada) waxaana loo soo saaraa duubabka/tuubooyinka/baakadaha.

Loop Data: Kormeerayaasha madal mataanaha dhijitaalka ah ee PAICEe waqtiga dhabta ah, algorithms-ka AI-na si toos ah ayuu u saxaa xuduudaha.

II. Tilmaamaha Aasaasiga ah (Qaab-dhismeedka Caadiga ah ee 2026)

1. Awoodda iyo Goobaha Shaqada

Tirada Xarumaha Shaqada: 32 xarumo shaqo oo is barbar socda

Awoodda ugu badan: 30,000 UPH (cutub/saacaddii)

Saldhigyada Tijaabada: Ilaa 16 (tijaabooyin is barbar socda)

MTBA (Waqtiga Celceliska ah ee u dhexeeya Dayactirka): > 120 daqiiqo, xasillooni sare

2. U-hoggaansanaanta Xirmada

Cabbirka: 0.3 × 0.6 mm ～ 17 × 17 mm

Nooca: QFN/DFN, SOIC, SOT, SC, LED, MEMS, WLCSP, Bare Die

Habaynta aadka u khafiifsan: Waxay taageertaa 50 μm oo ah dhidid khafiif ah (nooca NY32W)

3. Awoodaha Kormeerka iyo Tijaabada

Nidaamka Aragga: Madal NV-Core ah, kormeer indho-indhayn ah oo 6-geesood ah + infrared ah

Kormeerka 3D: Tiknoolajiyadda 3D Flex®, cabbirka muuqaalka dhulka ee 3D ee dhinacyada/burburka

Ogaanshaha Cilladaha Infrared-ka: Wuxuu dhex galaa silicon si uu u ogaado dildilaaca gudaha/dillaaca qarsoon

Tijaabada Korontada: Tijaabada DC/RF/ Awoodda, ilaa 3,500 V (nooca awoodda)

4. Isku-xirka farsamada iyo is-dhexgalka

Cabbirka (B×D×H): Qiyaastii 1,800×1,500×1,800 mm

Miisaanka: Qiyaastii 1,200 kg

Isgaarsiinta: SECS/GEM, KISS, PAICEe mataanaha dijitaalka ah (Heerka Warshadaha 4.0)

Waqtiga beddelka: 20-60 daqiiqo, oo la qabsan kara khadadka wax soo saarka isku dhafan

III. Hawlaha Aasaasiga ah (Xaaladaha Codsiga)

NY32 waxay diiradda saartaa tijaabinta kama dambaysta ah ee baakadaha semiconductor-ka ee dambe. Shaqadeeda ugu muhiimsan waa inay dhammaystirto tijaabinta korontada, kormeerka muuqaalka, kala soocidda darajada, iyo baakadaynta jajabyada/qalabka. Codsiyada caadiga ah waxaa ka mid ah:

Aaladaha RF: Taleefanka gacanta/jajabyada IoT RF, modules-yada Bluetooth/Wi-Fi

ICs-yada Analog/Isku-dhafka ah: PMIC, dareemayaal, cod-weyneeyayaal hawlgal, ADC/DAC

Aaladaha korontada: Aaladaha MOSFET, IGBT, SiC/GaN ee ballaaran (nooca NY32W)

Qalabka elektiroonigga ah: LED, Nalalka yaryar, Laydhka Diodes, Modules-ka indhaha

Baakad Horumarsan: WLCSP, Bare Die, FC (Flip Chip), MEMS

Elektarooniyada Gawaarida: Chips-yada Gawaarida (AEC-Q100), Dareemayaasha, Modules-yada Korontada

IV. Hawlaha ugu Muhiimsan

1. Is-dhexgalka Dhammaadka-ilaa-Dhamaadka (Barta Iibinta Aasaasiga ah)

Adeeg Hal-Joogsi ah: Rarista → Kormeerka 6-Dhinac → Ogaanshaha Cilladaha Infrared-ka → Cabbiraadda 3D → Tijaabada Korontada → Calaamadaynta → Kala-soocidda → Baakad

Habaynta Isbarbardhigga ah: Hawlgal isku-dhafan oo 32-saldhig ah, hufnaan aad uga badan qalabka taxanaha ah

2. Kormeerka Aragga Sare ee NV-Core

Dabool buuxa oo 6-dhinac ah: Muuqaalka Dhinaca Sare/Hoos/4, Cabbirka, Kormeerka Cilladaha

Gelitaanka Infrared-ka: Waxay ogaataa dildilaacyada gudaha, godadka, iyo dildilaacyada qarsoon ee ku jira walxaha silikoon, iyadoo hagaajinaysa wax soo saarka

3D Flex®: Cabbiraadda saxda ah ee dhererka kubbadda BGA, isku-xidhnaanta, iyo qaab-dhismeedka garaaca (saxnaanta ± 5 μm)

OCR/Barcode: Aqoonsiga calaamadaynta laysarka, raadraaca koodhka 2D

3. Tijaabada Korontada ee Qaababka Badan leh

Tijaabada Isbarbardhigga ah: Ilaa 16 goobood oo tijaabo ah, taasoo si weyn u yareyneysa waqtiga tijaabada

Daboolida Halbeegga: DC (IV), AC (CV), RF (S-parameters), awoodda, sifooyinka heerkulka

Tijaabada Saddex-Heerkulka: Heerkulka qolka / Heerkulka Sare / Heerkulka hoose (-40℃ ilaa +150℃), oo buuxinaya shuruudaha heerka baabuurta

4. Kala soocidda Caqliga leh iyo Baakaynta

Kala soocidda meelo badan oo qashin ah: Ilaa 16 heer, oo lagu kala saaray xuduudaha/dhammaystirka

La qabsiga Wax Soo Saarka: Cajalad & Giraangir, Tuubo, Saxan, Baaxadda

Isbeddelka Taayirada Tooska ah: Isbeddelka taayirada otomaatiga ah ee ARC, oo yareynaya waqtiga shaqada oo yaraada

5. Warshadaha 4.0 iyo Sirdoonka

PAICEe Digital Twin: La socodka waqtiga-dhabta ah, ogaanshaha meelaha fog, dayactirka saadaalinta

Sirdoonka Xogta DI-Core: Falanqaynta wax soo saarka, hagaajinta habka, digniinta cilladda

Algorithm-ka AI: Aqoonsiga nooca cilladaha otomaatiga ah, sixitaanka qulqulka xuduudaha, isbeddelka is-barashada

V. Faa'iidooyinka Muhiimka ah (Isbarbardhigga NY20 / Tartamayaasha)

1. **Boqorka Kartida, Waxtar aan la barbar dhigi karin:**

30,000 UPH, 30% ka sarreeya bedka cutub kasta marka loo eego NY20 (50,000 UPH, laakiin goobo shaqo oo yar).

Tijaabada is barbar socota + kormeerka is barbar socda, hal cutub wuxuu u dhigmaa 2-3 qalab oo taxane ah.

2. Saxnaanta Kormeerka Heerka Sare, Wax-soo-saarka La Dammaanad Qaaday:

Kormeer buuxa oo 6-dhinac ah + infrared + 3D ah, heerka cilladda oo lumay <0.01%. Ogaanshaha gelitaanka infrared-ka ee microcracks-ka gudaha, oo aan macquul ahayn iyadoo la adeegsanayo qalabka dhaqameed.

Saxnaanta cabbirka 3D ±5 μm, iyadoo la buuxinayo shuruudaha adag ee baakadaha horumarsan.

3. La qabsi dabacsan, Isbeddel degdeg ah:

Daboolida laga bilaabo 0.3×0.6 mm aad u yar ilaa 17×17 mm baakado aad u weyn.

20-60 daqiiqo oo isbeddel degdeg ah, doorashada koowaad ee khadadka isku dhafan ee kala duwan, oo leh dufcad yar.

Waxay taageertaa xaalado gaar ah sida fiilooyinka dahabka/naxaasta/lacagga ah, qalabka khafiifka ah, iyo aaladaha korontada.

4. Xasilloonida Sare, Kharashyada Dayactirka oo Yar:

MTBA > 120 daqiiqo, hawlgal joogto ah > 720 Hawlgal aan dhib lahayn 24-saacadood

Naqshad moodeel ah, dayactir fudud, qaybo caalami ah, iyo kharash yar oo muddo dheer ah

5. Wax soo saar caqli badan oo xog ku salaysan

Algorithm-ka mataanaha dhijitaalka ah + AI wuxuu suurtageliyaa dayactirka saadaalinta iyo is-hagaajinta habka

Raadinta xogta habka buuxa waxay buuxisaa shahaadooyinka tayada baabuurta/warshadaha (sida AEC-Q100, ISO 26262)

VI. Talooyinka Xulashada

NY32 ee la doorbiday: RF/analog ICs, aaladaha korontada, LED-yada, baakadaha horumarsan, mugga sare, shuruudaha wax soo saarka sare

NY32W ee la doorbiday: WLCSP, diish qaawan, jajabyo aad u khafiif ah (50 μm), aaladaha bandgap ballaaran (SiC/GaN)

NY20 ee la doorbiday: Waqtiga tijaabada ee xawaaraha sare leh (<100 ms), aaladaha kala duwan, wax soo saarka LED-ka ee aadka u culus