Woyang'anira mayeso a ISMECA NY32

ISMECA NY32 ndi makina oyesera/kusanja/kuyang'anira a rotary semiconductor okhala ndi masiteshoni 32 ochokera ku ISMECA (yomwe tsopano ili mbali ya Cohu), Switzerland. Yapangidwa kuti igwirizane bwino, ikhale ndi voliyumu yambiri, komanso yolondola kwambiri komanso yoyesera komaliza, ndipo ndi chida chofunikira kwambiri popanga ma RF ambiri, analog, zida zamagetsi, ndi ma phukusi apamwamba.

I. Mfundo Yogwirira Ntchito (Kukonza Kofanana kwa Rotary)

NY32 imagwiritsa ntchito tebulo lozungulira lolondola la masiteshoni 32 kuti liziyendetsa njira yonse yoyesera, kuyang'anira, ndi kusanja kudzera mu "malo ofananira + kuzungulira kogwirizana":

Kudyetsa: Kudyetsa pallet/chubu/reel, ndi mawonekedwe owoneka bwino komanso kukonza kaimidwe.

Kuzungulira kwa Rotary: Malo 32 amazungulira motsatizana, motsatizana akumaliza kuyang'anira kuwala kwa mbali 6 → kuzindikira zolakwika za infrared → muyeso wa mawonekedwe a 3D → kuyesa kwamagetsi → kulemba chizindikiro → kusanja.

Zochita Zazikulu:

Masomphenya: Kamera yothamanga kwambiri + kulowa kwa infrared, kuzindikira mawonekedwe/kukula/ming'alu.

Kuyesa: Kulumikizana ndi khadi la probe, kumaliza kuyesa kwa DC/RF/parameter.

Kusankha: Magulu amasankhidwa malinga ndi mtundu (Wabwino/Wosalongosoka/Giredi) ndipo amatuluka ku ma reel/machubu/ma pallet.

Deta Yozungulira: Pulogalamu ya PAICe ya digito iwiri imayang'anira nthawi yeniyeni, ndipo ma algorithms a AI amakonza zokha magawo.

II. Mafotokozedwe a Pakati (Makonzedwe Okhazikika a 2026)

1. Malo Ogwirira Ntchito ndi Malo Ogwirira Ntchito

Chiwerengero cha Malo Ogwirira Ntchito: Malo 32 Ogwirira Ntchito Ofanana

Mphamvu Yokwanira: 30,000 UPH (mayunitsi/ola)

Malo Oyesera: Mpaka 16 (kuyesa kofanana)

MTBA (Nthawi Yapakati Pakati pa Kukonza): > Mphindi 120, kukhazikika kwakukulu

2. Kugwirizana kwa Phukusi

Kukula: 0.3×0.6 mm ～ 17×17 mm

Mtundu: QFN/DFN, SOIC, SOT, SC, LED, MEMS, WLCSP, Bare Die

Kukonza Koonda Kwambiri: Kumathandizira ma 50 μm thin dies (NY32W version)

3. Kuyang'anira ndi Kuyesa Mphamvu

Dongosolo Lowonera: Pulatifomu ya NV-Core, kuyang'anira kwa kuwala kwa mbali 6 + infrared

Kuyang'anira 3D: Ukadaulo wa 3D Flex®, muyeso wa 3D wa malo ozungulira/mabampu

Kuzindikira Zolakwika za Infrared: Kulowa mu silicon kuti kuzindikire ming'alu yamkati/ming'alu yobisika

Kuyesa kwa Magetsi: DC/RF/ Kuyesa kwa mphamvu, mpaka 3,500 V (mtundu wamagetsi)

4. Kulumikizana kwa makina ndi kulumikizana

Miyeso (W×D×H): Pafupifupi 1,800×1,500×1,800 mm

Kulemera: Pafupifupi 1,200 kg

Kulankhulana: SECS/GEM, KISS, mapasa a digito a PAICe (muyezo wa Makampani 4.0)

Nthawi yosinthira: Mphindi 20-60, yosinthika ku mizere yosakanikirana yopanga

III. Ntchito Zazikulu (Zitsanzo Zogwiritsira Ntchito)

NY32 imayang'ana kwambiri pa kuyesa komaliza kwa ma semiconductor back-end packaging. Ntchito yake yayikulu ndikumaliza kuyesa kwamagetsi, kuyang'ana mawonekedwe, kusanja magiredi, ndi kulongedza ma tchipisi/zipangizo. Ntchito zodziwika bwino zimaphatikizapo:

Zipangizo za RF: Mafoni am'manja/IoT RF chips, ma module a Bluetooth/Wi-Fi

Ma IC a Analog/Mixed-signal: PMIC, masensa, ma amplifiers operational, ADC/DAC

Zipangizo zamagetsi: MOSFET, IGBT, zipangizo za SiC/GaN wide bandgap (NY32W version)

Zipangizo zamagetsi: LED, Ma LED Ang'onoang'ono, Ma Diode a Laser, Ma Module Optical

Kupaka Kwapamwamba: WLCSP, Bare Die, FC (Flip Chip), MEMS

Zipangizo Zamagetsi Zamagalimoto: Ma Chips Amagalimoto (AEC-Q100), Masensa, Ma Module Amagetsi

IV. Ntchito Zazikulu

1. Kuphatikizana kwa Mapeto (Malo Ogulitsira Akuluakulu)

Utumiki Woyimilira Pamodzi: Kutsegula → Kuyang'anira Mbali 6 → Kuzindikira Zolakwika za Infrared → Kuyeza kwa 3D → Kuyesa Kwamagetsi → Kulemba → Kusanja → Kupaka

Kukonza Pamodzi: Kugwira ntchito kogwirizana kwa masiteshoni 32, kugwira ntchito bwino kuposa zida zotsatizana

2. Kuyang'anira Masomphenya Otsogola a NV-Core

Kuphimba Konse kwa Mbali 6: Kumwamba/Pansi/Mawonekedwe Ambali 4, Miyeso, Kuyang'anira Zilema

Kulowa kwa infrared: Kuzindikira ming'alu yamkati, mabowo, ndi ming'alu yobisika muzinthu za silicon, zomwe zimapangitsa kuti pakhale phindu lalikulu.

3D Flex®: Kuyeza molondola kutalika kwa mpira wa BGA, kufanana kwake, ndi mawonekedwe ake (kulondola ± 5 μm)

OCR/Barcode: Kuzindikira chizindikiro cha laser, kutsata ma code a 2D

3. Kuyesa Magetsi kwa Mitundu Yambiri

Kuyesa Kofanana: Malo oyesera okwana 16, zomwe zimachepetsa kwambiri nthawi yoyesera

Kuphimba kwa Ma Parameter: DC (IV), AC (CV), RF (S-parameters), mphamvu, mawonekedwe a kutentha

Kuyesa kwa Kutentha Katatu: Kutentha kwa chipinda / Kutentha Kwambiri / Kutentha Kochepa (-40℃ mpaka +150℃), kukwaniritsa zofunikira zamagalimoto

4. Kusanja ndi Kuyika Zinthu Mwanzeru

Kusanja Mabokosi Ambiri: Mpaka milingo 16, yogawidwa m'magulu malinga ndi magawo / phindu

Kusintha kwa Zotulutsa: Tepi & Reel, Chubu, Thireyi, Bulk

Kusintha kwa Chingwe Chokha: Kusintha kwa chingwe chokha cha ARC, kuchepetsa nthawi yogwira ntchito

5. Makampani 4.0 ndi Kukhazikitsa Zinthu Mwanzeru

PAICe Digital Twin: Kuwunika nthawi yeniyeni, kuzindikira matenda akutali, kukonza zinthu zodziwikiratu

DI-Core Data Intelligence: Kusanthula kwa zokolola, kukonza njira, chenjezo la zolakwika

Algorithm ya AI: Kuzindikira mtundu wa chilema chokha, kukonza ma parameter drift, kuphunzira kudzisintha

V. Ubwino Wapakati (Kuyerekeza ndi NY20 / Opikisana)

1. **Mfumu ya Mphamvu, Kuchita Bwino Kosayerekezeka:**

30,000 UPH, 30% kuposa NY20 (50,000 UPH, koma malo ogwirira ntchito ochepa).

Kuyesa kofanana + kuyang'anira kofanana, gawo limodzi ndi lofanana ndi zida ziwiri kapena zitatu zotsatizana.

2. Kulondola kwa Kuyang'anira kwa Top-Tier, Zokolola Zotsimikizika:

Kuyang'ana kwa mbali 6 + infrared + 3D konsekonse, chilema chosowa <0.01%. Kuzindikira kulowera kwa infrared kwa ming'alu yamkati, sizingatheke ndi zida zachikhalidwe.

Kulondola kwa muyeso wa 3D ± 5 μm, kukwaniritsa zofunikira zolimba za phukusi lapamwamba.

3. Kusinthasintha Kosinthika, Kusintha Mwachangu:

Kuphimba kuyambira 0.3×0.6 mm yaying'ono kwambiri mpaka 17×17 mm yayikulu kwambiri.

Kusintha kwachangu kwa mphindi 20-60, chisankho choyamba cha mizere yosakanikirana yamitundu yosiyanasiyana, yaying'ono.

Imathandizira zochitika zapadera monga mawaya agolide/mkuwa/siliva, ma die opyapyala, ndi zida zamagetsi.

4. Kukhazikika Kwambiri, Ndalama Zochepa Zokonzera:

MTBA > mphindi 120, ntchito yopitilira > 720 Ntchito yopanda mavuto ya maola 24

Kapangidwe ka modular, kukonza kosavuta, zida zonse, komanso mtengo wotsika wa nthawi yayitali

5. Kupanga zinthu mwanzeru komanso motsogozedwa ndi deta

Ma algorithm a mapasa a digito + AI amalola kukonza kolosera komanso kudzikonza bwino

Kutsata deta yonse m'njira zosiyanasiyana kumakwaniritsa ziphaso zamagalimoto/mafakitale (monga AEC-Q100, ISO 26262)

VI. Malangizo Osankha

NY32 Yokondedwa: Ma RF/analog IC, zida zamagetsi, ma LED, ma phukusi apamwamba, zofunikira zapamwamba, komanso zokolola zambiri

NY32W yomwe mumakonda: WLCSP, bare die, tchipisi topyapyala kwambiri (50 μm), zida zolumikizirana ndi bandgap (SiC/GaN)

NY20 Yokondedwa: Nthawi yochepa yoyesera yachangu kwambiri (<100 ms), zipangizo zosiyana, kupanga ma LED ochuluka kwambiri