Umphathi wovavanyo lwe-ISMECA NY32

I-ISMECA NY32 yinkqubo yovavanyo/uhluzo/uvavanyo lwe-semiconductor ejikelezayo enezikhululo ezingama-32 evela kwi-ISMECA (ngoku iyinxalenye yeCohu), eSwitzerland. Yenzelwe ukupakisha okuhlanganisiweyo okuphezulu, okuphezulu, kunye nokuchaneka okuphezulu kunye neemeko zovavanyo lokugqibela, kwaye sisixhobo esiphambili sokwenza imveliso enkulu ye-RF, i-analog, izixhobo zamandla, kunye nokupakisha okuphambili.

I. Umgaqo Wokusebenza (Ukucubungula okuHlangeneyo kweRotary)

I-NY32 isebenzisa itheyibhile ejikelezayo echanekileyo enezikhululo ezingama-32 ukuze yenze yonke inkqubo yovavanyo, yokuhlola, kunye nokuhlela ibe ngokuzenzekelayo "ngezikhululo ezihambelanayo + ukujikeleza okuhambelanayo":

Ukondla: Ukondla ngepalethi/ngetyhubhu/ngereyile, kunye nokubekwa kwindawo ebonakalayo kunye nokulungiswa kwendlela yokuma.

Ukujikeleza okujikelezayo: Izitishi ezingama-32 zijikeleza ngokulandelelana, zigqibezela ngokulandelelana ukuhlolwa kwe-optical okumacala ama-6 → ukufunyanwa kwe-infrared flaw → ukulinganiswa kwe-3D morphology → uvavanyo lombane → ukumakisha → ukuhlelwa.

Izenzo Eziphambili:

Umbono: Ikhamera ekhawulezayo + ukungena kwe-infrared, ukubona imbonakalo/ubukhulu/iintanda.

Uvavanyo: Uqhagamshelwano lwekhadi le-probe, olugqibezela uvavanyo lwe-DC/RF/parameter.

Ukuhlela: Iindidi zihlelwa ngokomgangatho (Olungileyo/Oneengxaki/Owonakeleyo) kwaye imveliso iphuma kwiireyile/iityhubhu/iipalethi.

I-Data Loop: Iimonitha zeqonga le-PAICe zedijithali ezimbini ngexesha langempela, kwaye ii-algorithms ze-AI zilungisa iiparameter ngokuzenzekelayo.

II. Iinkcukacha zeCore (Uqwalaselo oluQhelekileyo luka-2026)

1. Umthamo kunye neendawo zokusebenzela

Inani leendawo zokusebenzela: iindawo zokusebenzela ezingama-32 ezihambelanayo

Ubungakanani obukhulu: 30,000 UPH (iiyunithi/iyure)

Izikhululo zovavanyo: Ukuya kuthi ga kwi-16 (uvavanyo oluhambelanayo)

I-MTBA (Ixesha Eliphakathi Phakathi Kokugcinwa): >120 min, uzinzo oluphezulu

2. Ukuhambelana kwephakheji

Ubungakanani: 0.3×0.6 mm ～ 17×17 mm

Uhlobo: QFN/DFN, SOIC, SOT, SC, LED, MEMS, WLCSP, Bare Die

Ukucubungula okuncinci kakhulu: Ixhasa ii-50 μm ezibhityileyo ezifileyo (inguqulelo ye-NY32W)

3. Uvavanyo kunye neZakhono zoVavanyo

Inkqubo yoMbono: Iqonga le-NV-Core, ukuhlolwa kwe-optical + infrared enamacala ama-6

Uhlolo lwe-3D: Itekhnoloji ye-3D Flex®, umlinganiselo we-3D we-topography yee-spheres/amaqhuma

Ukufunyanwa kweziphene ze-Infrared: Ingena kwi-silicon ukuze ibone imifantu yangaphakathi/imifantu efihliweyo

Uvavanyo loMbane: DC/RF/ Uvavanyo lombane, ukuya kuthi ga kwi-3,500 V (uhlobo lombane)

4. Ukunxibelelana koomatshini kunye nokunxibelelana

Ubukhulu (W×D×H): Malunga ne-1,800×1,500×1,800 mm

Ubunzima: Malunga ne-1,200 kg

Unxibelelwano: SECS/GEM, KISS, PAICe digital twin (umgangatho we-Industry 4.0)

Ixesha lokutshintsha: imizuzu engama-20-60, elungelelaniswe nemigca yemveliso exutyiweyo

III. Imisebenzi Engundoqo (Iimeko Zokusetyenziswa)

I-NY32 igxile kuvavanyo lokugqibela lokupakisha i-semiconductor back-end. Umsebenzi wayo ophambili kukugqiba uvavanyo lombane, ukuhlolwa kwembonakalo, ukuhlelwa kwamanqanaba, kunye nokupakisha iitships/izixhobo. Izicelo eziqhelekileyo ziquka:

Izixhobo zeRF: Iitships zefowuni ephathwayo/IoT RF, iimodyuli zeBluetooth/Wi-Fi

Ii-IC ze-Analog/Mixed-signal: I-PMIC, ii-sensors, ii-amplifiers zokusebenza, i-ADC/DAC

Izixhobo zamandla: MOSFET, IGBT, izixhobo ze-SiC/GaN wide bandgap (uhlobo lwe-NY32W)

Ii-Optoelectronics: ii-LED, ii-Mini LEDs, iiLaser Diodes, iiModules zeOptical

Ukupakisha Okuphambili: WLCSP, Bare Die, FC (Flip Chip), MEMS

Ii-Elektroniki zeMoto: Iitships zeMoto (AEC-Q100), iiSensors, iiModules zamandla

IV. Imisebenzi ephambili

1. Ukudibanisa isiphelo nesiphelo (Indawo yokuthengisa ephambili)

Inkonzo Yokuma Kanye: Ukulayisha → Ukuhlolwa Kwamacala Amathandathu → Ukufunyanwa Kweziphene Ze-Infrared → Ukulinganisa kwe-3D → Uvavanyo Lombane → Ukuphawula → Ukuhlelwa → Ukupakisha

Ukucubungula ngaxeshanye: Ukusebenza ngokuhambelana kwezikhululo ezingama-32, ukusebenza kakuhle kudlula kakhulu izixhobo ezilandelelanayo

2. Uhlolo lwe-NV-Core Advanced Vision

Ugutyungelwe ngokupheleleyo ngamacala ama-6: Phezulu/Ezantsi/Inkangeleko emacaleni ama-4, Ubukhulu, Ukuhlolwa kweziphene

Ukungena kwe-Infrared: Ifumanisa imifantu yangaphakathi, imingxuma, kunye nemifantu efihliweyo kwizinto ze-silicon, iphucula imveliso

I-3D Flex®: Umlinganiselo ochanekileyo wokuphakama kwebhola ye-BGA, ukulingana, kunye nemo ye-bump (ukuchaneka ±5 μm)

I-OCR/iBhakhowudi: Ukuqatshelwa kokumakishwa kweLaser, ukulandeleka kwekhowudi ye-2D

3. Uvavanyo loMbane oluneendlela ezininzi

Uvavanyo oluhambelanayo: Ukuya kuthi ga kwizikhululo zovavanyo ezili-16, okunciphisa kakhulu ixesha lovavanyo

Ugubungela iiParameter: DC (IV), AC (CV), RF (S-parameters), amandla, iimpawu zobushushu

Uvavanyo lweZishushu ezintathu: Ubushushu begumbi / Ubushushu obuphezulu / Ubushushu obuphantsi (-40℃ ukuya ku-+150℃), buhlangabezana neemfuno zomgangatho weemoto

4. Ukuhlela kunye nokuPakisha ngoBukrelekrele

Ukuhlela iibhini ezininzi: Ukuya kuthi ga kumanqanaba ali-16, ahlelwe ngokweeparameters / yield

Uhlengahlengiso lweziphumo: Iteyiphu kunye neReel, ityhubhu, itreyi, ubuninzi

Utshintsho lweReel oluzenzekelayo: Utshintsho lweReel oluzenzekelayo lwe-ARC, olunciphisa ixesha lokungasebenzi

5. I-Industry 4.0 kunye ne-Intelligentization

I-PAICe Digital Twin: Ukubeka esweni ngexesha langempela, ukuxilongwa okukude, ukugcinwa kwangaphambili

Ubukrelekrele beDatha ye-DI-Core: Uhlalutyo lwemveliso, ukulungiswa kwenkqubo, isilumkiso esingaqhelekanga

I-Algorithm ye-AI: Ukuchongwa kohlobo lwesiphene ngokuzenzekelayo, ukulungiswa kokushukuma kweparameter, ukufunda ngokwakho ngokutshintsha

V. Iingenelo eziPhambili (Ukuthelekisa ne-NY20 / Abakhuphisana nabo)

1. **Ukumkani wobuchule, Ukusebenza kakuhle okungenakuthelekiswa nanto:**

I-30,000 UPH, iphezulu nge-30% ngeyunithi nganye kune-NY20 (50,000 UPH, kodwa zimbalwa iindawo zokusebenza).

Uvavanyo oluhambelanayo + uvavanyo oluhambelanayo, iyunithi enye ilingana nezixhobo ezi-2-3 ezilandelelanayo.

2. Ukuchaneka kokuhlolwa kwe-Top-Tier, isivuno esiqinisekisiweyo:

Ukuhlolwa okunecala eli-6 + i-infrared + i-3D epheleleyo, izinga lokuphoswa kwesiphene <0.01%. Ukufunyanwa kokungena kwe-infrared kwi-microcracks zangaphakathi, akunakwenzeka ngezixhobo zemveli.

Ukuchaneka komlinganiselo we-3D ±5 μm, ukuhlangabezana neemfuno ezingqongqo zokupakisha okuphucukileyo.

3. Ukuguquguquka kokuguquguquka, utshintsho olukhawulezileyo:

Ugutyungelwe ukusuka kwi-0.3×0.6 mm encinci kakhulu ukuya kwi-17×17 mm enkulu kakhulu.

Utshintsho olukhawulezileyo lwemizuzu engama-20-60, ukhetho lokuqala lwemigca exutyiweyo eyahlukeneyo, emincinci.

Ixhasa iimeko ezikhethekileyo ezifana neengcingo ze-alloy zegolide/zobhedu/zesilivere, ii-dies ezincinci, kunye nezixhobo zamandla.

4. Uzinzo Oluphezulu, Iindleko Zokulungisa Eziphantsi:

I-MTBA > 120 min, ukusebenza okuqhubekayo > 720 Ukusebenza iiyure ezingama-24 ngaphandle kweengxaki

Uyilo lweModular, ulondolozo olulula, iindawo ezisetyenziswa kwihlabathi liphela, kunye neendleko eziphantsi zexesha elide

5. Ukwenziwa kwemveliso okuqhutywa yidatha, okukrelekrele

I-algorithm ye-digital twin + AI ivumela ukugcinwa kwangaphambili kunye nokuzilungiselela kwenkqubo

Ukulandeleka kwedatha yenkqubo epheleleyo kuhambelana neziqinisekiso zomgangatho weemoto/imizi-mveliso (ezifana ne-AEC-Q100, ISO 26262)

VI. Iingcebiso zoKhetho

I-NY32 ekhethwayo: ii-IC ze-RF/analog, izixhobo zamandla, ii-LED, ukupakisha okuphucukileyo, iimfuneko eziphezulu, kunye nemveliso ephezulu

I-NY32W ekhethwayo: I-WLCSP, idayi engenanto, iitships ezibhityileyo kakhulu (50 μm), izixhobo ze-bandgap ezibanzi (i-SiC/GaN)

I-NY20 ekhethwayo: Ixesha elifutshane lovavanyo olukhawulezayo kakhulu (<100 ms), izixhobo ezizimeleyo, imveliso ye-LED enobunzima obukhulu kakhulu