Umukozi ushinzwe ibizamini bya ISMECA NY32

ISMECA NY32 ni sisitemu yo gupima/gutondeka/gusuzuma ya semiconductor ikora kuri sitasiyo 32 ituruka muri ISMECA (ubu ni igice cya Cohu), mu Busuwisi. Yagenewe gupakira inyuma mu buryo bworoshye, bugezweho, kandi bunoze cyane ndetse no gupima bwa nyuma, kandi ni igikoresho cy'ingenzi cyo gukora RF, analog, ibikoresho by'amashanyarazi, n'ibipaki bigezweho.

I. Ihame ry'imikorere (Gutunganya ibintu mu buryo buhoranye)

NY32 ikoresha imbonerahamwe izunguruka ifite imiterere y’ubuziranenge ya sitasiyo 32 kugira ngo ikore mu buryo bwikora uburyo bwose bwo gupima, kugenzura no gutondekanya binyuze muri "sitasiyo zihuza + guzunguruka bihuza":

Kugaburira: Kugaburira umuntu mu gikoni/mu muyoboro/mu gikoni, hamwe n'uburyo ahagaze neza kandi agakosora imiterere ye.

Kuzenguruka kwa Rotary: Sitasiyo 32 zizenguruka mu buryo bumwe, zirangiza igenzura ry’impande 6 → Gupima inenge za infrared → Gupima imiterere ya 3D → Gupima amashanyarazi → Gushushanya → Gutondeka.

Ibikorwa by'ingenzi:

Iyerekwa: Kamera yihuta cyane + kwinjira muri infrared, kumenya uko isa/ingano/imivune igaragara.

Isuzuma: Gukoresha ikarita y'isuzuma, kurangiza isuzuma rya DC/RF/parameter.

Gutondekanya: Ibyiciro bitondekwa hakurikijwe ubwiza (Byiza/Byifite inenge/Icyiciro) kandi umusaruro uva kuri reels/tubes/pallets.

Umuyoboro w'amakuru: Uburyo bwa PAICe bwo kugenzura ikoranabuhanga mu gihe nyacyo, kandi uburyo bwa AI bukosora ibipimo mu buryo bwikora.

II. Ibisobanuro by'ingenzi (Imiterere Isanzwe ya 2026)

1. Ubushobozi n'aho gukorera

Umubare w'aho gukorera: Ahantu 32 ho gukorera hamwe

Ubushobozi ntarengwa: 30.000 UPH (ibipimo/isaha)

Ahantu ho gupimira: Kugeza kuri 16 (gupimira hamwe)

MTBA (Igihe cy'uburinganire hagati yo kubungabunga): >iminota 120, ituze ryinshi

2. Guhuza ipaki

Ingano: 0.3×0.6 mm ～ 17×17 mm

Ubwoko: QFN/DFN, SOIC, SOT, SC, LED, MEMS, WLCSP, Bare Die

Gutunganya ibintu bito cyane: Bishyigikira 50 μm thin dies (verisiyo ya NY32W)

3. Ubushobozi bwo kugenzura no gupima

Sisitemu yo Kureba: Platifomu ya NV-Core, igenzura ry'urumuri rw'impande 6 + infrared

Igenzura rya 3D: Ikoranabuhanga rya 3D Flex®, gupima imiterere y'ibice/utubumbe mu buryo bwa 3D

Gupima amakosa ya infrared: Injira muri silicon kugira ngo imenye imiyoboro y'imbere/imiyoboro yihishe

Isuzuma ry'amashanyarazi: Isuzuma ry'amashanyarazi rya DC/RF/, kugeza kuri 3.500 V (ikoreshwa ry'amashanyarazi)

4. Imiterere n'imikoranire

Ingano (Ubugari × Ubwinshi × Ubwinshi): Hafi 1,800 × 1,500 × 1,800 mm

Uburemere: Hafi 1.200 kg

Itumanaho: SECS/GEM, KISS, PAICe digital twin (Indangagaciro 4.0)

Igihe cyo guhindura: iminota 20–60, ikoreshwa mu gutunganya ibintu bitandukanye

III. Imikorere y'ingenzi (Ingero z'ikoreshwa)

NY32 yibanda ku igeragezwa rya nyuma ryo gupakira ibikoresho bya semiconductor back-end. Inshingano yayo y'ingenzi ni ugukora isuzuma ry'amashanyarazi, kugenzura uko ibintu bimeze, gutondekanya amanota, no gupakira ibikoresho bya chips/devices. Porogaramu zisanzwe zirimo:

Ibikoresho bya RF: Telefoni igendanwa/IoT RF chips, module za Bluetooth/Wi-Fi

Imbuga za Analog/Mixed-signal ICs: PMIC, sensors, operating amplifiers, ADC/DAC

Ibikoresho by'amashanyarazi: MOSFET, IGBT, SiC/GaN wide bandgap devices (verisiyo ya NY32W)

Ibyuma by'ikoranabuhanga: LED, Mini LED, Laser Diode, Modules Optical

Pakingi igezweho: WLCSP, Bare Die, FC (Flip Chip), MEMS

Ibyuma by'ikoranabuhanga by'imodoka: Udupira tw'imodoka (AEC-Q100), Ibikoresho byo gupima, Module z'amashanyarazi

IV. Imirimo y'ingenzi

1. Guhuza ibicuruzwa kuva ku mpera kugeza ku mpera (Icyiciro cy'ingenzi cyo kugurisha)

Serivisi yo Guhagarara Rimwe: Gupakira → Igenzura ry'Impande 6 → Gutahura Ibizinga bya Infrared → Gupima Ibipimo bya 3D → Isuzuma ry'amashanyarazi → Gushyiramo ikimenyetso → Gutondekanya → Gupakira

Gutunganya ibintu mu buryo bunyuranye: Imikorere ya sitasiyo 32 ihuza imikorere, imikorere myiza irenze kure ibikoresho by'uruhererekane

2. Igenzura rya NV-Core Advanced Vision

Uburyo bwose bwo gufata amashusho bufite impande 6: Hejuru/Hasi/Isura y'uruhande 4, Ingano, Igenzura ry'ibisembwa

Kwinjira kwa infrared: Imenya imyobo y'imbere, ububobere, n'imyobo ihishe mu bikoresho bya silikoni, bigatuma umusaruro urushaho kwiyongera

3D Flex®: Gupima neza uburebure bw'umupira wa BGA, uko umeze, n'imiterere y'agapira (ubuziranenge ± 5 μm)

OCR/Barcode: Kumenya ibimenyetso bya laser, gukurikirana kode za 2D

3. Isuzuma ry'amashanyarazi ry'uburyo bwinshi

Gupima mu buryo bunyuranye: Ibikoresho bigera kuri 16 byo gupima, bigabanya cyane igihe cyo gupima

Ibipimo bikubiye muri parametero: DC (IV), AC (CV), RF (S-parameters), ingufu, imiterere y'ubushyuhe

Isuzuma ry'ubushyuhe butatu: Ubushyuhe bw'icyumba / Ubushyuhe bwinshi / Ubushyuhe bwo hasi (-40℃ kugeza +150℃), bwujuje ibisabwa ku rwego rw'imodoka

4. Gutondekanya no Gupakira mu buryo bw'ubwenge

Gutondekanya udusanduku twinshi: Kugeza ku byiciro 16, bigashyirwa mu byiciro hakurikijwe ibipimo / umusaruro

Guhindura umusaruro: Kaseti n'Ingufu, Umuyoboro, Agasanduku, Ingano

Guhindura Reel mu buryo bwikora: Guhindura reel mu buryo bwikora mu buryo bwikora mu buryo bwikora mu buryo bwikora, bigabanya igihe cyo kudakora

5. Inganda 4.0 n'Ubwenge

PAICe Digital Twin: Gukurikirana mu buryo bwihuse, gusuzuma indwara hakoreshejwe ikoranabuhanga, no kubungabunga amakuru mbere y'igihe

DI-Core Data Intelligence: Isesengura ry'umusaruro, kunoza imikorere, umuburo w'ibitagenda neza

Algorithm y'ubuhanga mu bya siyansi: Kumenya ubwoko bw'ikosa mu buryo bwikora, gukosora uburyo bwo guhindagurika kw'ibipimo, kwigira ku giti cyawe mu buryo bwo guhindura

V. Ibyiza by'ingenzi (Ugereranyije na NY20 / Abarushanwa)

1. **Umwami w'ubushobozi, Ubushobozi budasanzwe:**

30.000 UPH, 30% biri hejuru kuri buri gice ugereranyije na NY20 (50.000 UPH, ariko hari aho gukorera hake).

Isuzuma rya 'parallel test' + igenzura rya 'parallel test', igice kimwe gihwanye n'ibikoresho 2-3 by'uruhererekane.

2. Ubuziranenge bw'igenzura ry'icyiciro cyo hejuru, umusaruro wizewe:

Igenzura ryuzuye ry’impande 6 + infrared + 3D, igipimo cyo kubura inenge <0.01%. Gusuzuma imiyoboro mito y’imbere mu buryo bwa infrared, ntibishoboka hakoreshejwe ibikoresho bisanzwe.

Ubuziranenge bwo gupima ibintu mu buryo bwa 3D ± 5 μm, bwujuje ibisabwa bikomeye byo gupakira ibintu mu buryo bugezweho.

3. Guhuza n'imimerere mu buryo bworoshye, impinduka zihuse:

Ubwinshi bw'amapaki kuva kuri 0.3 × 0.6 mm nto cyane kugeza kuri 17 × 17 mm nini cyane.

Guhinduranya vuba mu minota 20-60, ni amahitamo ya mbere ku mirongo myinshi ivanze, ifite ubwoko buto.

Ishyigikira ibintu byihariye nk'insinga za zahabu/umuringa/ifeza, udukoresho tworoheje, n'ibikoresho by'amashanyarazi.

4. Ihindagurika Rikomeye, Amafaranga yo Kubungabunga Ari Make:

MTBA > iminota 120, ikora neza > 720 Ikora amasaha 24 nta kibazo

Igishushanyo mbonera cy'uburyo, kubungabunga byoroshye, ibice byose, n'igiciro gito cy'igihe kirekire

5. Inganda zishingiye ku makuru n'ubuhanga

Algorithm y'ubuhanga bw'ikoranabuhanga bw'impanga + AI ituma habaho kubungabunga no kwihutisha ibikorwa.

Gukurikirana amakuru mu buryo bwuzuye bihuye n'ibyemezo by'ubuziranenge bw'imodoka/inganda (nk'ibi bikurikira: AEC-Q100, ISO 26262)

VI. Ibyifuzo byo guhitamo

NY32 ikundwa: RF/analog ICs, ibikoresho by'amashanyarazi, LEDs, gupakira bigezweho, ingano nini kandi bisaba umusaruro mwinshi

NY32W ikundwa: WLCSP, die yambaye ubusa, utwuma duto cyane (50 μm), ibikoresho binini byo gufunga (SiC/GaN)

NY20 ikundwa: Igihe gito cyo gupima vuba cyane (<100 ms), ibikoresho bitandukanye, gukora LED nyinshi cyane