ISMECA NY32 omukwasi w’ebigezo

ISMECA NY32 nkola ya siteegi 32 ey’okugezesa/okusunsula/okukebera semikondokita ezikyukakyuka okuva mu ISMECA (kati kitundu kya Cohu), Switzerland. Ekoleddwa okupakinga okw’amaanyi, okw’amaanyi, n’okupakinga okw’emabega okw’obutuufu obw’amaanyi n’okugezesebwa okusembayo, era kitundu kya kyuma ekikulu eky’okukola mu bungi RF, analog, ebyuma eby’amaanyi, n’okupakinga eby’omulembe.

I. Enkola y’emirimu (Rotary Parallel Processing) .

NY32 ekozesa emmeeza ekyukakyuka ey'obutuufu obwa siteegi 32 okukola mu ngeri ey'otoma enkola yonna ey'okugezesa, okwekebejja, n'okusunsula okuyita mu "parallel stations + synchronous rotation":

Okuliisa: Okuliisa mu pallet/tube/reel, nga waliwo okuteeka mu kifo ekirabika n’okutereeza enyimirira.

Rotary Rotation: Siteegi 32 zikyukakyuka mu kiseera kye kimu, nga zimaliriza mu lunyiriri okukebera okw’amaaso okw’enjuyi 6 → okuzuula obuzibu mu infrared → okupima enkula ya 3D → okugezesa amasannyalaze → okussaako obubonero → okusunsula.

Ebikolwa Ebikulu:

Okulaba: Kkamera ey’amaanyi + okuyingira mu infrared, okuzuula endabika/obunene/enjatika.

Okugezesa: Okukwatagana ne kaadi ya Probe, okumaliriza okugezesa DC/RF/parameter.

Okusunsula: Ebika bisunsulwa okusinziira ku mutindo (Good/Defective/Grade) n’ebifulumizibwa mu reels/tubes/pallets.

Data Loop: PAICe digital twin platform erondoola mu kiseera ekituufu, era AI algorithms zitereeza parameters mu ngeri ey’otoma.

II. Ebikwata ku Musingi (2026 Ensengeka y’Omutindo) .

1. Obusobozi n’ebifo we bakolera

Omuwendo gwa Workstations: Ebifo 32 ebikwatagana

Obusobozi obusinga obunene: 30,000 UPH (yuniti/essaawa)

Ebifo ebigezesebwa: Okutuuka ku 16 (okugezesebwa mu ngeri ey’enjawulo) .

MTBA (Obudde bwa wakati wakati w’okuddaabiriza): >120 min, okutebenkera okw’amaanyi

2. Okukwatagana ne Package

Enkula: mm 0.3×0.6 ～ mm 17×17

Ekika: QFN/DFN, SOIC, SOT, SC, LED, MEMS, WLCSP, Okufa okw’obwereere

Ultra-thin Processing: Ewagira 50 μm okufa okugonvu (NY32W version)

3. Obusobozi bw’okukebera n’okugezesa

Enkola y’okulaba: NV-Core platform, 6-sided optical + infrared okukebera

Okukebera mu 3D: Tekinologiya wa 3D Flex®, okupima 3D topography y’enkulungo/ebikonde

Infrared Flaw Detection: Eyingira mu silicon okuzuula enjatika ez’omunda/enjatika ezikwese

Okugezesa amasannyalaze: Okugezesa amasannyalaze ga DC/RF/, okutuuka ku 3,500 V (power version)

4. Ebyuma n’okuyungibwa ku bantu

Ebipimo (W×D×H): Nga. 1,800×1,500×1,800 mm

Obuzito: Nga. kkiro 1,200

Empuliziganya: SECS/GEM, KISS, PAICe digital twin (omutindo gw’amakolero 4.0)

Obudde bw’okukyusa: eddakiika 20–60, ekyukakyuka okusinziira ku layini z’okufulumya ezitabuliddwa

III. Emirimu emikulu (Enkola z’okukozesa) .

NY32 essira erisinga kulissa ku kugezesa okusembayo okwa semiconductor back-end packaging. Omulimu gwayo omukulu kwe kumaliriza okugezesa amasannyalaze, okwekenneenya endabika, okusunsula grade, n’okupakinga chips/ebyuma. Okukozesebwa okwa bulijjo mulimu:

Ebyuma bya RF: Chips za RF ez’essimu/IoT, modulo za Bluetooth/Wi-Fi

Analog/Mixed-signal ICs: PMIC, sensa, amplifier ezikola, ADC/DAC

Ebyuma ebikozesebwa amaanyi: MOSFET, IGBT, SiC/GaN wide bandgap ebyuma (NY32W version)

Ebyuma ebikozesebwa mu kulaba: LED, Mini LEDs, Laser Diodes, Modules z’amaaso

Okupakinga okw’omulembe: WLCSP, Bare Die, FC (Flip Chip), MEMS

Ebyuma ebikozesebwa mu mmotoka: Chips z’emmotoka (AEC-Q100), Sensors, Power Modules

IV. Emirimu Emikulu

1. Okugatta okuva ku nkomerero okutuuka ku nkomerero (Core Selling Point) .

Empeereza ey’ekifo kimu: Okutikka → Okukebera ku njuyi 6 → Okuzuula obuzibu mu infrared → Okupima mu 3D → Okugezesa amasannyalaze → Okussaako obubonero → Okusunsula → Okupakinga

Parallel Processing: 32-station synchronous okukola, obulungi okusinga wala ebyuma serial

2. Okukebera okulaba okw’omulembe okwa NV-Core

6-Sided Full Coverage: Waggulu/wansi/4 Side Endabika, Ebipimo, Okukebera obulema

Infrared Penetration: Ezuula enjatika ez’omunda, ebituli, n’enjatika ezikwese mu bintu bya silikoni, ne kirongoosa amakungula

3D Flex®: Okupima okutuufu okw’obuwanvu bw’omupiira gwa BGA, coplanarity, n’enkula y’ebikonde (obutuufu ±5 μm)

OCR/Barcode: Okutegeera obubonero bwa layisi, okulondoola koodi ya 2D

3. Okugezesa Amasannyalaze mu ngeri eziwera

Okugezesa mu ngeri ey’enjawulo: Ebifo ebigezesebwa ebituuka ku 16, ekikendeeza nnyo ku budde bw’okugezesa

Okubikka kwa paramita: DC (IV), AC (CV), RF (S-parameters), amaanyi, engeri z’ebbugumu

Okugezesa ebbugumu ery’essatu: Ebbugumu ly’ekisenge / Ebbugumu erya waggulu / Ebbugumu erya wansi (-40°C okutuuka ku +150°C), nga lituukana n’ebisaanyizo eby’omutindo gw’emmotoka

4. Okusunsula n’okupakinga mu ngeri ey’amagezi

Multi-bin Sorting: Okutuuka ku mitendera 16, nga gigabanyizibwamu okusinziira ku parameters / yield

Okukyusa ebifulumizibwa: Tape & Reel, Tube, Tray, Bulk

Okukyusa Reel mu ngeri ey’otoma: ARC okukyusa reel mu ngeri ey’otoma, okukendeeza ku budde bw’okuyimirira

5. Amakolero 4.0 n’Okugezi

PAICe Digital Twin: Okulondoola mu kiseera ekituufu, okukebera okuva ewala, okuddaabiriza okuteebereza

DI-Core Data Intelligence: Okwekenenya amakungula, okulongoosa enkola, okulabula ku anomaly

AI Algorithm: Okuzuula ekika ky’obulema mu ngeri ey’otoma, okutereeza parameter drift, okukyusa okweyiga

V. Ebirungi Ebikulu (Okugeraageranya ne NY20 / Abavuganya) .

1. **Kabaka w'obusobozi, Obulung'amu obutavuganyizibwa:**

30,000 UPH, 30% waggulu buli yuniti area okusinga NY20 (50,000 UPH, naye workstations ntono).

Okugezesa okukwatagana + okukebera mu ngeri ey’okukwatagana, yuniti emu yenkana ebyuma 2-3 eby’omuddiring’anwa.

2. Obutuufu bw’okukebera okw’omutendera ogw’oku ntikko, Amakungula agakakasiddwa:

6-sided + infrared + 3D full-dimensional inspection, omuwendo gw’okusubwa obulema <0.01%. Okuzuula okuyingira kwa infrared okw’enjatika entonotono ez’omunda, tekisoboka na byuma bya kinnansi.

3D okupima obutuufu ±5 μm, okutuukiriza ebisaanyizo ebikakali eby’okupakinga eby’omulembe.

3. Okukyukakyuka okukyukakyuka, Okukyuka amangu:

Okubikka okuva ku 0.3×0.6 mm ultra-small okutuuka ku 17×17 mm ultra-large packages.

Enkyukakyuka ey’amangu ey’eddakiika 20-60, okulonda okusooka ku layini ezitabuliddwa ez’ebika bingi, ebitonotono.

Awagira embeera ez’enjawulo nga waya za zaabu/ekikomo/ffeeza alloy, dies ennyimpi, n’ebyuma ebikozesa amaanyi.

4. Okutebenkera okungi, Ebisale by’okuddaabiriza ebitono:

MTBA > eddakiika 120, okukola obutasalako > 720 Okukola essaawa 24 awatali buzibu

Dizayini ya modulo, okuddaabiriza okwangu, ebitundu bya bonna, n’omuwendo omutono ogw’ekiseera ekiwanvu

5. Okukola ebintu ebikulemberwa data, mu ngeri ey’amagezi

Digital twin + AI algorithm esobozesa okuddaabiriza okulagula n’okwetereeza enkola

Okulondoola data mu nkola enzijuvu kutuukana n’okukakasa omutindo gw’emmotoka/amakolero (nga AEC-Q100, ISO 26262)

VI. Ebiteeso by’okulonda

NY32 esinga okwettanirwa: RF/analog ICs, ebyuma by’amaanyi, LEDs, okupakinga okw’omulembe, ebyetaago by’obuzito obw’amaanyi, eby’amakungula amangi

NY32W esinga okwagalibwa: WLCSP, bare die, chips ezigonvu ennyo (50 μm), ebyuma ebigazi bbandi (SiC/GaN)

NY20 esinga okwettanirwa: Obudde obutono obw’okugezesa obw’amaanyi ennyo (<100 ms), ebyuma ebitali bimu, okufulumya LED ey’amaanyi ennyo