Isikhokelo soCwangciso lwe-ASM AD838 Die Bonder | Ukuhlolwa kweWafer, iCarrier kunye neTools

I-ASM AD838 die bonder kufuneka ikhethwe ngokwendlela esebenza ngayo kunye noqwalaselo lwenkqubo efakiweyo, kungekhona ngegama le-AD838 kuphela.Umatshini usenokuba nehardware efanelekileyo yokubeka kodwa ungabi nayo ifomathi ye-wafer, izixhobo zokuthwala, intloko yebhondi, iseti yemilomo, imodyuli yokukhupha, iphakheji yombono okanye isixhobo se-substrate esifunekayo kwisicelo esijoliswe kuso.

Kwi-LED, i-photonics, i-optoelectronics kunye nezinye iiprojekthi ze-precision die attach, umbuzo wokwenyani wezixhobo uyasebenza: i-die ingena njani kumatshini, ikhethwa njani, ilungiswa njani i-adhesive okanye izinto zenkqubo, iqinisekiswa njani i-alignment, yeyiphi i-carrier okanye i-substrate efumana i-die, kwaye zeziphi izixhobo ezikhoyo ukuxhasa ulandelelwano olupheleleyo?

Esi sikhokelo soqwalaselo lwe-die bonder ye-ASM AD838 sichaza iindawo ezibalulekileyo ekufuneka zihlolwe ngaphambi kokukhetha, ukuthenga, ukuhlaziya okanye ukufaneleka komatshini we-die bonding we-AD838.

Ngamafutshane: Yintoni emisela amandla e-ASM AD838 Die Bonder?

Amandla asebenzayo e-ASM AD838 die bonder axhomekeke kuhlobo oluchanekileyo lomatshini kunye noqwalaselo olufakiweyo. Iindawo eziphambili ziquka ukuphathwa kwe-wafer, indlela yomthombo we-die, ukuphathwa kwe-carrier okanye i-substrate, ukuseta intloko ye-bond, izixhobo ze-nozzle kunye ne-eject, iimodyuli zokuhambisa okanye zokunyathela, inkqubo yombono, indlela yokulungelelanisa, i-hardware ye-automation, i-controller kunye ne-software status.

• Ubungakanani bewafer bodwa abuqinisekisi amandla apheleleyo omthombo wedayi.

• Izixhobo zokuthwala kunye nezixhobo ze-substrate zinokugqiba ukuba umatshini uyayifanela na imveliso.

• Intloko yebhondi kunye nomlomo kufuneka zihambelane nobukhulu bedayi, imeko yedayi kunye nendlela yokubeka.

• Ukusebenza kombono kufuneka kuhlolwe kuthelekiswa neempawu zokwenyani zokulungelelanisa kunye neempawu zesiseko.

• Ukufumaneka kwezixhobo kunokumisela isantya sokufaneleka ngaphezu kwekhabhathi yomatshini ngokwayo.

Kutheni kufuneka kuchazwe ukuhamba kwezinto ngaphambi kokuba kukhethwe umatshini we-ASM AD838

Yonke iprojekthi yokubopha idayisi inomjelo obonakalayo. Idayi iqala kwi-wafer, itreyi, ipakethi ye-waffle, iGel-Pak®, i-carrier okanye enye indlela yokubonisa. Ikhethwa ngesixhobo esichaziweyo, ingadlula kwinqanaba lokukhupha okanye lokunyathela, ilungelelaniswe ngekhamera okanye inkqubo yesalathiso, kwaye ibekwe kwi-substrate, i-leadframe, i-carrier, i-fixture okanye icandelo lephakheji.

Uqwalaselo lomatshini kufuneka luxhase yonke inyathelo elibalulekileyo kuloo msinga. Umsantsa kuyo nayiphi na indawo enye unokuthintela iprojekthi ekubeni ifikelele kwinqanaba elifanelekileyo.

Umgaqo woqwalaselo:Tshatisa umatshini we-AD838 nolandelelwano olupheleleyo lwe-die attachment, kungekuphela nje ngobukhulu be-die okanye usapho lweqonga.

1. Chonga iQonga le-AD838 elichanekileyo ngaphambi kokuba uphonononge uqwalaselo

Ngaphambi kokuba uphonononge izixhobo zekhompyutha, chonga indlela echanekileyo yokuchonga umatshini. Iinkqubo zokuqala ze-AD838, oomatshini be-AD838L abalandelayo, ii-AD838L-Plus kunye neenkqubo ze-AD838L-G2 akufuneki zithathwe njengezineempawu ezifanayo ezishicilelweyo, ukuphathwa kwezinto okanye ukhetho lwenkqubo.

Cela umfanekiso wepleyiti yegama, inombolo ye-serial, igama elipheleleyo lemodeli kunye noluhlu loqwalaselo lomatshini. Oku kunceda ukuthintela impazamo eqhelekileyo: ukusebenzisa amandla apapashiweyo ohlobo olunye lwe-AD838-family kwenye imashini enikezelwayo.

2. Chaza indlela yokuphatha i-Die Source kunye ne-Wafer

Ukuphathwa kwe-wafer kufuneka kuhlolwe ukusuka kwindawo yokuqala yokulayisha ukuya kwi-die pickup. Qinisekisa ububanzi be-wafer, ifreyimu ye-wafer okanye isitayile seringi, imbonakalo ye-die, imfuneko ye-ring expander, uqwalaselo lwe-wafer loader kunye nazo naziphi na iimodyuli zokuphatha ngokuzenzekelayo ezifakwe kumatshini.

Kwidayi ebuthathaka, ebhityileyo, encinci okanye esetyenziswa ngokukodwa, jonga kwakhona indlela idayisi ekhululwa ngayo, exhaswa ngayo kwaye idluliselwa ngayo kwindawo yokuthathwa. Imeko yedayi, unyango olungasemva, indlela yokusarha kunye nezinto zokufaka i-wafer zinokuchaphazela icebo lokuthathwa elifunekayo.

Imibuzo Emele Ibuzwe

• Lo matshini ulungele ukuphatha ububanzi be-wafer kunye nesitayile sefreyimu ngayiphi indlela?

• Ingaba i-ring expander, i-wafer loader okanye i-wafer handling module ifakiwe?

• Lo matshini wawusetyenziselwa ntoni ubukhulu bedayi kunye nobungakanani bedayi ngaphambili?

• Yeyiphi indlela yokuthathwa kunye nendlela yokukhupha efakiweyo?

• Ngaba umthengisi angabonisa indlela yokuphatha esebenzisa izinto ezimeleyo?

3. Ukujonga kwakhona ukuPhathwa kweCarrier, Substrate kunye neFixture

Emva kokuyithatha, idayisi kufuneka ibekwe kwindawo yokuyithatha. Oku kungaba yi-ceramic substrate, i-metal carrier, i-LED package component, i-photonics submount, i-leadframe, i-strip, i-boat, i-optical component holder okanye i-custom fixture.

Icala elifumanayo lenkqubo lidla ngokugqiba ukuba umatshini osetyenzisiweyo unokufaneleka ngokukhawuleza na. Umatshini unokuba nentloko yebhondi ekwaziyo kodwa ungabi nayo ipleyiti yokufakelwa efanelekileyo, indlela yokufumana indawo, inqanaba lesiseko, ipleyiti yokufudumeza okanye indlela yokudlulisela imveliso ekujoliswe kuyo.

Cela iinkcukacha malunga nezixhobo zokuthwala ezifakiweyo, izibambi ze-substrate, iipleyiti zokufakelwa, izigaba ze-heater, ii-locating pin, ii-clamps kunye ne-hardware eyenziwe ngokwezifiso. Thelekisa ezi zixhobo kunye nejometri echanekileyo kunye nezinto zecandelo eliza kwamkela.

4. Tshatisa iBond Head kunye neTool Interface kwiDie

Ulwakhiwo lwentloko yebhondi kufuneka luhlolwe ngokujonga ubungakanani bedayi, ubukhulu, umphezulu wepickup, ubuthathaka, indlela yezinto ezisetyenziswayo kunye nolwalathiso olufunekayo lokubekwa. Isixhobo esisebenza kakuhle kwidayi enye ye-LED okanye icandelo le-photonics sisenokungafaneleki kwimilo yedayi okanye uyilo lwe-substrate.

Qinisekisa ujongano lwesibambi sesixhobo esifakiweyo, ii-nozzles, ii-collets, izixhobo zokukhupha, izixhobo zokuthatha kunye neereferensi zokulinganisa. Apho iprojekthi ifuna ukufudumeza, ukujikeleza, amandla okubeka alawulwayo okanye intshukumo yenkqubo ekhethekileyo, qinisekisa ukuba uqwalaselo olubonakalayo luyazixhasa ezo mfuno.

5. Qinisekisa indlela yokulungiselela izinto

Ukuncamathisela idayisi kudla ngokufuna ukulungiswa kwezinto ngaphambi kokuba zibekwe. Ngokuxhomekeke kwindlela ezisetyenziswa ngayo, inkqubo ingabandakanya ukusasazwa kwe-epoxy, ukunyatheliswa, ukudluliselwa kweglu, ukufuthwa, ukuditshwa, ukufudunyezwa, amanyathelo anxulumene ne-UV okanye enye indlela yezinto.

Musa ukucinga ukuba umatshini unokuxhasa izinto ekujoliswe kuzo kuba unemodyuli yokukhupha okanye yokunyathela efakiweyo. Qinisekisa i-hardware yokwenyani, indlela yolwelo, imeko yenkqubo, ukuhambelana kwezinto, imeko yesixhobo kunye nolandelelwano lomjikelo olucetywayo.

Uluhlu lokujonga uHlolo loLungiselelo lwezinto

• Imodyuli yokukhupha, yokunyathela okanye yokudlulisa izinto ifakiwe

• Imeko yeevalvu, iisirinji, iimpompo, ii-nozzles kunye nezixhobo zokukhupha amanzi

• Ubuninzi okanye ipateni yezinto ezifunekayo

• Imfuneko yenkqubo yokufudumala, ubushushu bangaphambi kwexesha okanye ubushushu

• Ukucoca nokugcina imeko yeendawo ezinxibelelana nezinto

• Ukuhambelana ne-glue efunekayo, i-flux okanye i-process medium

6. Qinisekisa umbono kunye nolungelelwaniso ngokuchasene neMveliso yokwenyani

Iinkqubo zokubona kufuneka zivavanywe ngokubhekiselele kwidayi yokwenyani, i-substrate kunye neempawu zesalathiso ezisetyenziswa kwimveliso. Imeko yekhamera, i-optics, ukukhanya, intsimi yombono, i-alignment logic kunye ne-calibration zonke zinokuchaphazela iziphumo ezisebenzayo.

Ikhamera ebonakala kwifoto yomatshini ayanelanga. Umatshini kufuneka ubonise ukuqatshelwa kwereferensi kunye nokuziphatha kokulungelelanisa usebenzisa izixhobo ezimeleyo, isampuli yenkqubo okanye ithagethi echaziweyo ye-optical.

Kwimisebenzi ye-photonics okanye ye-optoelectronics, ukulungelelaniswa kunokuba luncedo kakhulu kwi-substrate geometry, iimpawu zephakheji, ulwalathiso lwedayi kunye neereferensi ezibonakalayo zesicelo esithile. Indlela yokuhlola kufuneka kuvunyelwane ngayo ngaphambi kokuthenga.

7. Qonda i-Tooling njengeNxalenye ePhambili yoMshini

Izixhobo zokufaka izixhobo aziyonto iyimfuneko. Ii-nozzles, ii-collets, izixhobo zokukhupha, ii-carrier plates, izinto zokufaka izixhobo, ii-calibration blocks kunye nee-substrate holders zinokugqiba ukuba umatshini ungasetyenziswa na kwiphakheji ekujoliswe kuyo.

Ngaphambi kokuba uthenge, cela uluhlu lwezixhobo oluneenkcukacha ezineefoto, ubungakanani, iireferensi zenxalenye apho zifumaneka khona kunye nokusetyenziswa kwenkqubo okwaziwayo. Emva koko hlela into nganye ngolu hlobo:

• Iyahambelana nemveliso entsha

• Inokuhlengahlengiswa

• Ifuna uqinisekiso lobunjineli

• Ayinamsebenzi nenkqubo ekujoliswe kuyo

• Akukho nto ifunekayo kwaye ifuna uyilo olutsha okanye ukufunwa kwempahla

8. Jonga iimfuno ze-Automation kunye ne-Changeover

Iimfuno zokwenza izinto ngokuzenzekelayo zingahluka kakhulu phakathi komsebenzi weprototype, ukuhlanganiswa komthamo omncinci kunye nemveliso yomthamo omkhulu. Hlola ukuba umatshini uquka na ukulayisha izinto ngokuzenzekelayo, ukukhupha izinto, ukuphathwa kwemagazini, inkxaso yesondlo, ukudluliselwa kwe-wafer, ukutshintsha izixhobo okanye iimpawu zokutshintsha imveliso ezifanelekileyo kwiprojekthi.

Kwiindawo ezixutyiweyo zemveliso, vavanya ixesha elifunekayo lokutshintsha imilomo, utshintsho lwezinto ezisetyenziswayo, ukuseta umthwali, ukulayisha iresiphi, ukulungiswa kwekhamera kunye nokuqinisekiswa kwenkqubo. Umatshini unokuba nethuba eliphezulu lokubeka izinto kodwa ungasebenzi kakuhle kutshintsho oluqhelekileyo lwemveliso.

9. Qinisekisa ukuba uMlawuli, iSoftware kunye noLungelo lweResiphi

Isoftware yomatshini kufuneka iphathwe njengenxalenye yoqwalaselo lwemveliso. Qinisekisa imeko yomlawuli, ikhompyutha yoshishino, inguqulelo yesoftware, iinketho ezivunyiweyo, useto lombono, ii-backups ezikhoyo, iiresiphi, iifayile zeparameter kunye namaxwebhu obuchwephesha.

Xa utshintsha umatshini okhoyo, misela ukuba ingaba iindlela zokupheka zangoku, izixhobo kunye nemisebenzi yokusebenza yomqhubi zinokudluliselwa na. Oku kubaluleke kakhulu apho inkqubo sele ixhomekeke kwiindawo ezimiselweyo zedaye, iipateni zokukhupha, iindawo zokuthwala okanye iindlela zokulungelelanisa ezibonakalayo.

I-ASM AD838 Configuration Matrix

Iimpazamo zoQwalaselo oluQhelekileyo lwe-ASM AD838

Impazamo 1: Ukukhetha ngobungakanani beWafer kuphela

Ubungakanani bewafer bubalulekile, kodwa abuqinisekisi ukubonakala kwedayi, indlela yokukhupha, ukuphathwa kwethwali, izixhobo zesubstrate, ukwakheka kwentloko yebhondi okanye amandla okubona.

Impazamo yesi-2: Ukucinga ukuba izixhobo ezibandakanyiweyo zihambelana nemveliso entsha

Izixhobo zokuqala zisenokuba zenzelwe idayi eyahlukileyo, i-substrate, i-package geometry, indlela yezinto okanye ulandelelwano lwenkqubo. Ukuhambelana kwezixhobo kufuneka kujongwe ngokuchasene nesicelo esitsha.

Impazamo 3: Ukungayinaki i-substrate efumanayo

Iiprojekthi ezininzi zigxile ekuthathweni kwezinto ezifakwe kwi-die pickup kodwa zithatha kancinci indlela yokuphatha izinto ezifakwe kwi-substrate okanye i-carrier. Ukungabikho kwezixhobo ze-fixture kunokuthintela ukufaneleka nokuba icala le-die source lilungile.

Impazamo 4: Ukuphatha iikhamera njengobungqina bobuchule bokulungelelanisa

Umatshini usenokuba neekhamera kodwa usafuna ii-optics ezahlukeneyo, ukukhanya, useto lwesoftware, izixhobo zokulinganisa okanye i-logic yokulungelelanisa iphakheji ekujoliswe kuyo.

Impazamo 5: Ukushiya iSoftware kunye nokuCwangcisa iiResiphi Kude kube semva kokuhanjiswa

Ukubuyiselwa kwesilawuli, iikopi, iifayile zokhetho, ukufikelela kwiiresiphi kunye namaxwebhu kufuneka kuqinisekiswe ngaphambi kokuba kuthunyelwe. Ezi zinto zinokuba nzima ukuziphinda-phinda emva kokufakwa.

Yintoni Omele Uyicele Ngaphambi Kokuvuma Isicatshulwa se-ASM AD838

• Umfanekiso wegama lomatshini kunye nenombolo yochungechunge

• Imifanekiso yangoku enesisombululo esiphezulu sendawo yenkqubo kunye neemodyuli zokuphatha

• Uluhlu olubhaliweyo lwezixhobo zokuphatha i-wafer ezifakiweyo, ezithwalayo kunye neziphathekayo ze-substrate

• Intloko yebhondi, umlomo, isixhobo sokukhupha kunye noluhlu lwezinto ezifunekayo

• Iinkcukacha zemodyuli yokukhupha, yokustampa okanye yokulungiselela izinto

• Ikhamera yombono, ulwazi lwe-optics kunye nokukhanya

• Umlawuli, iPC, isoftware, ukhetho kunye nesimo se-backup

• Ulwazi ngokuhlaziywa okanye ngokugcinwa kwempahla apho lufumaneka khona

• Isindululo se-FAT kunye nobubanzi bokubonisa obusebenzayo

• Imigaqo yokupakisha, yokufaka kunye nenkxaso

Ingcebiso Yokugqibela: Thelekisa Indlela Epheleleyo Yenkqubo

I-ASM AD838 die bonder inokuba lukhetho oluqinileyo lweqonga xa uqwalaselo lokwenyani lomatshini luhambelana nenkqubo epheleleyo yemveliso. Uhlolo oluchanekileyo luqala ngomthombo we-die, umthwali okanye i-substrate, indlela yezinto eziphathekayo, intloko ye-bond, izixhobo, isicwangciso sokubona kunye nendawo yesoftware.

Ngaphambi kokuba uvume ikowuteshini ye-AD838, qinisekisa ukuba yonke ikhonkco ebalulekileyo kwikhonkco lenkqubo igutyungelwe. Oku kunceda ukuthintela impazamo eqhelekileyo yokuthenga izixhobo: ukukhetha usapho lomatshini olufanelekileyo olunesimo esingafanelekanga esifakiweyo.

Izixhobo ezinxulumene ne-ASM Die Bonder

• I-ASM AD838 vs BESI vs K&S Die Bonder Comparison Guide

• Isikhokelo sokuthenga se-ASM AD838 Die Bonder esisetyenzisiweyo

• Hlola Izixhobo Zokubopha I-Die

Imibuzo Ebuzwa Rhoqo Malunga Noqwalaselo lwe-ASM AD838

Ngaba i-ASM AD838, AD838L kunye ne-AD838L-G2 zimatshini ezifanayo?

Hayi. Ziimodeli ezifanayo kodwa akufuneki kuthathwe ngokuba zinesimo esifanayo, ukuphathwa kwezinto, izixhobo, iinkqubo zokubona okanye amandla enkqubo epapashweyo. Soloko uqinisekisa umatshini onikezelwayo.

Yeyiphi eyona ndlela ibalulekileyo yokujonga uqwalaselo lwe-AD838?

Eyona nto ibalulekileyo kukujonga ukuba ikhonkco lenkqubo epheleleyo liyahambelana na nesicelo: umthombo wedayi, ukuphathwa kwe-wafer, ukuphathwa kwe-carrier okanye i-substrate, intloko yebhondi, izixhobo, indlela yezinto, umbono kunye nesoftware.

Kutheni ukuphathwa kwenkampani yokuthwala kubalulekile ekubopheleleni ngedayi?

Ukuphathwa komthwali kunye ne-substrate kugqiba indlela icandelo elifumanayo elibanjwa ngayo, elibekwe ngayo, elifudunyezwa ngayo nelidluliselwa ngayo. Izinto ezilahlekileyo okanye ezingahambelaniyo zinokuthintela ukufaneleka kwenkqubo.

Ngaba i-ASM AD838 ingasebenzisa ii-nozzle ezahlukeneyo kunye neeseti zezixhobo?

Ukuhambelana kwezixhobo kuxhomekeke kwintloko efakiweyo, ujongano lwezixhobo kunye nokuseta inkqubo. Abathengi kufuneka bacele uluhlu lwezixhobo oluneenkcukacha kwaye baqinisekise ukufaneleka kwedayi kunye nesiseko esicwangcisiweyo.

Yintoni ekufuneka ihlolwe ukuze ijongwe ulungelelwaniso lombono lwe-AD838?

Jonga izixhobo zekhamera ezifakiweyo, i-optics, ukukhanya, indawo yokujonga, imeko yokulinganisa, isoftware yokulungelelanisa kunye nokusebenza ngokuchasene neempawu zedayi kunye ne-substrate ezimeleyo.

Ngaba i-AD838 die bond esetyenzisiweyo inokuxhasa imveliso entsha?

Kusenokwenzeka, kodwa ukufaneleka kuxhomekeke ekubeni iimodyuli zokuphatha ezifunekayo, izixhobo, izixhobo, izixhobo zenkqubo yezinto, ukuseta umbono kunye nesoftware zinokuxhasa na indlela entsha yemveliso.

Loluphi ulwazi olufunekayo ukuze kuhlolwe uqwalaselo lwe-AD838?

Nika iifoto zomatshini, inombolo ye-serial, ubukhulu bedayi, ifomathi ye-wafer okanye yetreyi, iinkcukacha ze-substrate, indlela yezinto ezisetyenzisiweyo, imveliso ekujoliswe kuyo, uluhlu lwezixhobo kunye nokuhamba kwenkqubo ekujongwe ukuba ihambe.

Ngaba ufuna uncedo lokujonga uqwalaselo lweNkqubo ye-ASM AD838?

Yabelana ngoqwalaselo lomatshini olufumanekayo, ubungakanani bedayi, ifomathi ye-wafer okanye yenkampani, umzobo we-substrate, indlela yezinto ezisetyenzisiweyo, iinkcukacha zezixhobo kunye neemfuno zemveliso ekujoliswe kuyo. Uhlolo oluluncedo lwe-AD838 luqala ngendlela epheleleyo yenkqubo endaweni yegama leqonga lodwa.