SAKI smt 3D X-imashini BF-3AXiM200

SAKI BF-3AXiM200 ni sisitemu yo mu rwego rwohejuru ya 3D X-ray yo kugenzura byikora (AXI), yagenewe ibikoresho bya elegitoroniki bipfunyika cyane (nka BGA, CSP, Flip Chip) hamwe n'iteraniro rya PCB. Ikoresha micro-yibanze ya X-ray yerekana amashusho + CT yogusuzuma kugirango igere ku igenzura ridasenya ingingo zagurishijwe zihishe hamwe nudusembwa twimbere, kandi ikoreshwa cyane mubikoresho bya elegitoroniki yimodoka, icyogajuru, itumanaho rya 5G, ibikoresho byubuvuzi nibindi bice bifite ibyangombwa byizewe cyane.

2. Ibyingenzi byingenzi nibipimo bya tekiniki

Iboneza Ibikoresho

Ikintu Ibipimo

Inkomoko ya X-Gufungura umuyoboro wa microfocus, voltage ya 30kV-160kV

Ingano yibanda kuri 0.5μm (ntarengwa), imiterere ya subicron urwego

Detector Ikomeye-sensibilité yibibaho, ikemura 2048 × 2048

Umubare ntarengwa wa PCB ubunini 510mm × 460mm (ubunini bunini burashobora gutegurwa)

Ubushobozi bwo gusikana CT Shyigikira 360 ° tomografiya, uburinganire bwa 3μm

Sisitemu yimikorere Yumwanya-wuzuye wumurongo module, isubirwamo neza neza position 2μm

Umutekano wimirasire Igipimo cya <1μSv / h, ukurikije amahame mpuzamahanga yumutekano

Ibipimo ngenderwaho

Umuvuduko wo gutahura:

Uburyo bwa 2D: 50250mm / s (gusikana byihuse)

Uburyo bwa 3D-CT: iminota 10-30 / ikibaho (ukurikije ibisabwa byo gukemura)

Kumenyekanisha neza:

Urashobora kumenya abagurisha ubusa ubusa ≥3μm

Shyigikira Solder ihuriweho ubuziranenge bwibice 01005 (0.4mm × 0.2mm)

3. Imikorere ninshingano

🔹 1. Kugaragaza inenge-yuzuye

Inenge zo gusudira:

Ubukonje bukonje, Ikiraro, Ubusa, Umupira wo kugurisha

Ibibazo by'inteko:

Ibice bidahuye, pin crack, ibikoresho byamahanga

🔹 2. 3D-CT tomografiya (bidashoboka)

Kwiyubaka-Ibice bitatu: Gukora icyitegererezo cyibice bitatu byabagurisha / binyuze mu mwobo unyuze mu mpande nyinshi, hanyuma ugasesengura umubare:

Igipimo cyubusa (Void%), ugurisha kuzuza uburebure, coplanarity

Isesengura ry'imbere mu gihugu:

PCB yimbere yimbere mugufi, umuringa ushyizwemo umuringa (PTH) uburinganire bwuzuye

🔹 3. Isesengura ryubwenge no gucunga amakuru

Ubwoko bwa AI bwikora: Kwiga byimbitse algorithm ihita yerekana ubwoko bwinenge (nka IPC-A-610 Icyiciro cya 3 gisanzwe).

Igenzura rya gahunda ya SPC: imibare nyayo yibicuruzwa byagurishijwe (ingano, uburebure), hamwe nibisekuru bya raporo zerekana.

Kwishyira hamwe kwa MES: gushyigikira protocole ya SECS / GEM, no gukorana namakuru ya sisitemu yo gucunga uruganda.

4. Ibyiza byibicuruzwa

✅ Ultra-high resolution imaging

0.5μm micro-yibanze X-ray: gufata neza uwagurishije amakuru arambuye yikibanza cyiza cyane BGA (ikibanza 0.3mm).

16-biti yerekana ibara ryerekana: gutandukanya itandukaniro rito (nkitandukaniro riri hagati yuwagurishije hamwe nu muringa).

Ection Uburyo bwiza bwo kumenya

2D gusikana byihuse: bikwiriye kugenzurwa byuzuye kumurongo wibikorwa, hamwe n umuvuduko wa 250mm / s.

3D-CT isesengura ryimbitse: tomografiya-yuzuye neza kubice byingenzi (nka ECU yimodoka).

Ubwenge no kwikora

Igikorwa kimwe-buto: guteganya gahunda yo kugenzura, gushyigikira gahunda ya interineti (OLP).

Ihinduramiterere ryikora: kugabanya intoki no kunoza ibikoresho bihamye.

Umutekano no kubahiriza

Kurinda imirasire: kuyobora ibirahuri bikingira + igikoresho cyo guhuza kugirango ukore neza.

Icyemezo cy'inganda: Yujuje IPC, IATF 16949 (imodoka), ISO 13485 (ubuvuzi).

5. Ibisanzwe byo gusaba

Ibyuma bya elegitoroniki

ADAS radar module: Menya icyuho cyagurishijwe mumihanda yumurongo mwinshi.

Sisitemu yo gucunga bateri (BMS): Menya neza gusudira kwizerwa ryinzira ndende.

Itumanaho rya 5G

Millimeter wave antenna PCB: Kugenzura ubuziranenge bwo gusudira ibice bya RF (nkibikoresho bya GaN).

Base power power amplifier: Gisesengura ibyago byumunaniro wumuriro wa padi nini.

Ikirere

Sisitemu yo kugenzura ibyogajuru: Kugaragaza inenge ya 3D yerekana imiterere yimbere ihuza imbaho ​​nyinshi.

Module yo kugenzura indege: Kudasenya kwipimisha hejuru-pin kubara QFN.

Equipment Ibikoresho byo kwa muganga

Ibikoresho bya elegitoroniki bidashoboka: Menya abagurisha biocompatibilité (ibisigisigi bidafite isigarira).

Ibikoresho byo gufata amashusho PCB: Kugenzura intera yo kugenzura imiyoboro yumuriro mwinshi.

6. Gutandukanya abanywanyi

Imikorere SAKI BF-3AXiM200 Ibikoresho bisanzwe X-Ray

Icyemezo 0.5μm (inganda zo hejuru) Mubisanzwe 1 ~ 5μm

Uburyo bwo gutahura 2D + 3D-CT kwishyira hamwe, gushyigikira gusikana kugorora Benshi bashyigikira 2D cyangwa tomografi yoroshye

Ubwenge bwa AI bwikora inenge itondekanya + gufunga-gusubiramo inzira Ibitekerezo Wishingikirije kuburambe bwintoki kugirango ucire urubanza

Kwaguka Isesengura ryingufu zidasanzwe (EDS) module Igikorwa gihamye

7. Incamake

SAKI BF-3AXiM200 ibaye igisubizo cyibanze cyo gutahura ibikoresho byikoranabuhanga byizewe cyane hamwe na subicron, ubwenge bwa CT scanning hamwe ninganda 4.0. Agaciro kayo yibanze muri:

Kugenzura inenge zeru: guhagarika ibishobora kunanirwa hakiri kare kandi bigabanye ingaruka nyuma yo kugurisha.

Gukwirakwiza amakuru neza: kunoza uburyo bwo gusudira ukoresheje isesengura ryinshi (nkigipimo cyubusa).

Kurwanya inganda zuzuye: byujuje ubuziranenge bukomeye nk'imodoka, ubuvuzi, n'ikirere.