SAKI smt 3D X-ray machine BF-3AXiM200

I-SAKI BF-3AXiM200 yinkqubo yokuhlola ezenzekelayo ye-X-ray ye-3D ye-X-ray (i-AXI), eyenzelwe ukupakishwa kwe-elektroniki yoxinaniso oluphezulu (njenge-BGA, i-CSP, i-Flip Chip) kunye nendibano ye-PCB enzima. Isebenzisa i-micro-focus i-X-ray imaging + i-CT scanning technology ukufezekisa ukuhlolwa okungonakaliyo kwamalungu e-solder afihliweyo kunye neziphene zangaphakathi, kwaye isetyenziswa ngokubanzi kwi-automotive electronics, i-aerospace, unxibelelwano lwe-5G, izixhobo zonyango kunye nezinye iinkalo ezineemfuno eziphezulu kakhulu zokuthembeka.

2. Iimpawu eziphambili kunye neeparitha zobugcisa

📌 Ubume besixhobo

Iiparamitha zento

Umthombo weX-reyi Vula ityhubhu ye-microfocus, uluhlu lwamandla ombane 30kV-160kV

Ubungakanani bogxininiso 0.5μm (ubuncinci), inqanaba le-submicron yesisombululo

I-Detector High-sensitivity flat-panel detector, isisombululo 2048 × 2048

Ubungakanani obukhulu bePCB yokubona 510mm × 460mm (ubungakanani obukhulu bunokwenziwa ngokwezifiso)

I-CT scanning ikhono Inkxaso ye-360 ° tomography, ukuchaneka komgangatho we-3μm

Inkqubo eshukumayo Imodyuli yomgca echanekileyo, ukuchaneka okuphindaphindayo ± 2μm

Ukhuseleko kwimitha Ithamo lokuvuza <1μSv/h, ngokuhambelana nemigangatho yokhuseleko yamazwe ngamazwe

📌 Iimpawu zokusebenza

Isantya sokubhaqa:

Imowudi ye-2D: ≤250mm/s (ukuskena ngesantya esiphezulu)

Imodi ye-3D-CT: imizuzu eyi-10-30 / ibhodi (kuxhomekeke kwiimfuno zesisombululo)

Ubuzaza bokubona isiphene:

Inokuchonga i-solder joint voids ≥3μm

Inkxaso yeSolder uhlalutyo lomgangatho odibeneyo we-01005 yamacandelo (0.4mm×0.2mm)

3. Imisebenzi engundoqo kunye neendima

🔹 1. Ukuchongwa kwesiphene ngokuchanekileyo

Iziphene zokuwelda:

Cold Solder, Bridging, Void, Solder Ball

Iingxaki zeNdibano:

Ukungahambi kakuhle kwecandelo, i-pin crack, imathiriyeli yangaphandle

🔹 2. I-3D-CT tomography (ukhetho)

Ulwakhiwo olunamacala amathathu: Veza imodeli emacala-ntathu ee-solder joints/ngemingxuma ngothelekelelo lwee-engile ezininzi, kwaye uhlalutye ngokobungakanani:

Ixabiso elingenanto (i-Void%), ukuphakama kokuzaliswa kwe-solder, i-coplanarity

Uhlalutyo lwesakhiwo sangaphakathi:

PCB umaleko wangaphakathi wesekethe emfutshane, umngxuma copper plated (PTH) metallization ingqibelelo

🔹 3. Uhlalutyo oluhlakaniphile kunye nolawulo lwedatha

Ukuhlelwa ngokuzenzekelayo kwe-AI: I-algorithm yokufunda ngokujulile iphawula ngokuzenzekelayo iintlobo zesiphene (ezifana ne-IPC-A-610 Class 3 standard).

Ulawulo lwenkqubo ye-SPC: izibalo zexesha langempela leeparamitha ezidibeneyo ze-solder (umthamo, ukuphakama), kunye nokuveliswa kweengxelo zendlela.

Ukuhlanganiswa kwe-MES: inkxaso ye-SECS / i-GEM protocol, kunye nokusebenzisana kunye nedatha yenkqubo yolawulo lwefektri.

4. Iinzuzo zemveliso

✅ Imifanekiso enesisombululo esiphezulu

0.5μm micro-focus X-reyi: bamba ngokucacileyo iinkcukacha solder joint of ultra-fine pitch BGA (0.3mm pitch).

Isixhobo se-16-bit grayscale detector: yahlula umahluko omncinci woxinaniso (njengomahluko phakathi kwe-solder paste kunye ne-copper layer).

✅ Ubhaqo olusebenzayo lweendlela ezininzi

Ukuskena ngokukhawuleza kwe-2D: ifanelekile ukuhlolwa okupheleleyo komgca wokuvelisa, kunye nesantya se-250mm / s.

Uhlalutyo olunzulu lwe-3D-CT: i-tomography echanekileyo yeendawo eziphambili (ezifana ne-ECU yemoto).

✅ Ubukrelekrele kunye ne-automation

Ukusebenza kweqhosha elinye: inkqubo yokuhlola kwangaphambili, inkxaso yeprogram engaxhunyiwe kwi-intanethi (OLP).

Ukulinganisa okuzenzekelayo: ukunciphisa ukungenelela ngesandla kunye nokuphucula ukuzinza kwezixhobo.

✅ Ukhuseleko kunye nokuthotyelwa

Ukukhuselwa kwemitha: isikhuselo seglasi ekhokelela + isixhobo esinxibelelanayo ukuqinisekisa ukusebenza ngokukhuselekileyo.

Isiqinisekiso soShishino: Idibana ne-IPC, i-IATF 16949 (imoto), imigangatho ye-ISO 13485 (yezonyango).

5. Iimeko zesicelo esiqhelekileyo

🚗 Iimoto ze-elektroniki

Imodyuli ye-radar ye-ADAS: Khangela i-solder voids kwiindlela zesignali eziphezulu.

Inkqubo yokulawula ibhetri (BMS): Qinisekisa ukuthembeka kwe-welding kwiindlela zangoku eziphezulu.

📡 5G unxibelelwano

I-eriyali ye-Millimeter wave PCB: Qinisekisa umgangatho we-welding yamacandelo e-RF (njengezixhobo ze-GaN).

Isiseko sokukhulisa amandla esitishi: Hlalutya umngcipheko wokudinwa kwe-thermal yeepads ezinobungakanani obukhulu.

🛰️ I-Aerospace

Inkqubo yokulawula iSatellite: Ukufunyanwa kwesiphako se-3D sothungelwano lwangaphakathi lweebhodi ezinomaleko amaninzi.

Imodyuli yokulawula i-Flight: Uvavanyo olungonakalisi lwe-high-pin count ye-QFN iiphakheji.

🏥 Izixhobo zonyango

Ii-elektroniki ezifakelwayo: Khangela ukuhambelana kwe-solder edibeneyo (intsalela engenalo ilothe).

Isixhobo sokubonisa i-PCB: Ukuqinisekiswa kwesithuba se-Insulation yeesekethe eziphezulu zombane.

6. Umahluko kubantu okhuphisana nabo

Umsebenzi we-SAKI BF-3AXiM200 izixhobo zeX-Ray eziqhelekileyo

Isisombululo 0.5μm (phezulu kwishishini) Ngokuqhelekileyo 1 ~ 5μm

Imowudi yokubona i-2D+3D-CT udibaniso, inkxaso yokutshekisha ukuskena Uninzi lwenkxaso ye-2D kuphela okanye i-tomography elula

I-Intelligent AI yokuhlelwa kwesiphene ngokuzenzekelayo + ingxelo yenkqubo evaliweyo Thembela kumava okwenziwa ngesandla ukuze ugwebe

Ukwandiswa Uphononongo lwamandla okuzikhethelayo (EDS) imodyuli esisigxina

7. Isishwankathelo

I-SAKI BF-3AXiM200 ibe sesona sisombululo siphezulu sokubona ukuthembeka okuphezulu kokwenziwa kwe-elektroniki kunye nesisombululo se-submicron, ukuskena okukrelekrele kwe-CT kunye ne-Industry 4.0 yokuhlanganisa amandla. Ixabiso layo eliphambili liku:

Ulawulo olungenaziphene: ukunqanda ukusilela okunokwenzeka kwangethuba kwaye unciphise umngcipheko emva kokuthengisa.

Ukulungiswa okuqhutywa yidatha: ukuphucula iinkqubo ze-welding ngokusebenzisa uhlalutyo lobungakanani (njengezinga elingenanto).

Ukuziqhelanisa neshishini elipheleleyo: ukuhlangabezana neyona migangatho ingqongqo njengemoto, ezonyango, kunye ne-aerospace.