SAKI smt Ekyuma kya X-ray ekya 3D BF-3AXiM200

SAKI BF-3AXiM200 nkola ya mutindo gwa waggulu eya 3D X-ray automatic inspection system (AXI), eyakolebwa okupakinga eby’amasannyalaze eby’amaanyi (nga BGA, CSP, Flip Chip) n’okukuŋŋaanya PCB enzibu. Ekozesa tekinologiya wa micro-focus X-ray imaging + CT scanning okutuuka ku kwekebejja okutali kwa kusaanyaawo kw’ebiyungo bya solder ebikwese n’obulema obw’omunda, era ekozesebwa nnyo mu byuma by’emmotoka, eby’omu bwengula, empuliziganya ya 5G, ebyuma by’obujjanjabi n’emirimu emirala nga yeetaaga okwesigika okw’amaanyi ennyo.

2. Ebikulu ebikwata ku nsonga n’ebipimo by’ebyekikugu

📌 Ensengeka ya Hardware

Ebipimo by’Ekintu

Ensibuko ya X-ray Open microfocus tube, voltage range 30kV-160kV

Sayizi ya essira 0.5μm (ekitono), okusalawo submicron level

Detector Ekyuma ekizuula eky’ekika kya flat-panel eky’obuwulize obw’amaanyi, okusalawo 2048×2048

Okuzuula okusinga obunene PCB sayizi 510mm × 460mm (sayizi ennene esobola okulongoosebwa)

Obusobozi bwa CT scanning Okuwagira 360° tomography, obutuufu bwa layeri 3μm

Enkola y’entambula Module ya linear ey’obutuufu obw’amaanyi, obutuufu bw’okuteeka mu kifo obuddibwamu ±2μm

Obukuumi bw’emisanvu Dozi y’okukulukuta <1μSv/h, nga ekwatagana n’omutindo gw’ensi yonna ogw’obukuumi

📌 Ebiraga enkola y’emirimu

Sipiidi y’okuzuula:

2D mode: ≤250mm/s (okusika ku sipiidi ey’amaanyi)

3D-CT mode: eddakiika 10-30/board (okusinziira ku byetaago by’okusalawo)

Obuwulize bw’okuzuula obulema:

Asobola okuzuula ebituli by’ekiyungo kya solder ≥3μm

Okuwagira Okwekenenya omutindo gw’ekiyungo kya Solder eky’ebitundu 01005 (0.4mm×0.2mm)

3. Emirimu n’emirimu emikulu

🔹 1. Okuzuula obulema mu ngeri entuufu

Ebikyamu mu kuweta:

Solder ennyogovu, Bridging, Void, Omupiira gwa Solder

Ebizibu by’okukuŋŋaanya:

Component misalignment, enjatika ya ppini, ebintu eby’ebweru

🔹 2. Okukuba ebifaananyi mu ngeri ya 3D-CT (nga kyetaagisa) .

Okuddamu okuzimba mu bitundu bisatu: Okukola ekifaananyi eky’ebitundu bisatu eky’ebiyungo bya solder/okuyita mu bituli okuyita mu kuteebereza okw’enkoona nnyingi, era okwekenneenya mu bungi:

Void rate (Void%), obuwanvu bw’okujjuza solder, coplanarity

Okwekenenya ensengeka y’omunda:

PCB inner layer short circuit, ekituli ekisiigiddwa ekikomo (PTH) ekyuma ekituufu

🔹 3. Okwekenenya n’okuddukanya data mu ngeri ey’amagezi

AI automatic classification: Enkola y’okuyiga okw’obuziba ekola akabonero mu ngeri ey’otoma ebika by’obulema (nga IPC-A-610 Class 3 standard).

SPC enkola okufuga: ebibalo mu kiseera ekituufu eby’ebipimo by’ekiyungo kya solder (volume, height), n’okukola lipoota z’omulembe.

Okugatta MES: okuwagira enkola ya SECS/GEM, n’okukolagana ne data y’enkola y’okuddukanya ekkolero.

4. Ebirungi ebiri mu bikozesebwa

✅ Okukuba ebifaananyi mu ngeri ey’obulungi ennyo

0.5μm micro-focus X-ray: kwata bulungi ebikwata ku kiyungo kya solder ebya ultra-fine pitch BGA (0.3mm pitch).

16-bit grayscale detector: okwawula enjawulo entono mu density (nga enjawulo wakati wa solder paste ne copper layer).

✅ Okuzuula obulungi mu ngeri nnyingi

2D fast scanning: esaanira okwekenneenya mu bujjuvu layini y’okufulumya, nga erina sipiidi ya 250mm/s.

3D-CT okwekenneenya mu bujjuvu: high-precision tomography ku bitundu ebikulu (nga automotive ECU).

✅ Obukessi n'okukola mu ngeri ey'obwengula

Enkola ya button emu: pulogulaamu y'okukebera etegekeddwa, okuwagira pulogulaamu ezitali ku mutimbagano (OLP).

Okupima mu ngeri ey’otoma: okukendeeza ku kuyingirira mu ngalo n’okulongoosa obutebenkevu bw’ebyuma.

✅ Obukuumi n'okugoberera amateeka

Obukuumi bw’obusannyalazo: lead glass shielding + interlocking device okukakasa nti ekola bulungi.

Satifikeeti y’amakolero: Etuukana n’omutindo gwa IPC, IATF 16949 (emmotoka), ISO 13485 (obusawo).

5. Ensonga eza bulijjo ez’okukozesa

🚗 Ebyuma ebikozesebwa mu mmotoka

Module ya rada ya ADAS: Zuula ebifo ebitaliimu solder mu makubo ga siginiini aga frequency enkulu.

Enkola y’okuddukanya bbaatule (BMS): Okukakasa obwesigwa bw’okuweta amakubo agakola amasannyalaze amangi.

📡 Empuliziganya ya 5G

Millimeter wave antenna PCB: Kakasa omutindo gw’okuweta ebitundu bya RF (nga ebyuma bya GaN).

Base station power amplifier: Yeekenneenya akabi k’obukoowu bw’ebbugumu mu paadi ennene.

🛰️ Eby'omu bwengula

Enkola y’okufuga setilayiti: Okuzuula obulema mu ngeri ya 3D ey’okuyungibwa kwa layeri ez’omunda ez’ebipande ebirina layeri nnyingi.

Module y’okufuga ennyonyi: Okugezesa okutali kwa kusaanyaawo kwa bipapula bya QFN ebirina ppini ennene.

🏥 Ebikozesebwa mu by'obujjanjabi

Ebyuma ebiteekebwa mu mubiri: Zuula obutakwatagana bwa solder joint biocompatibility (ebisigadde ebitaliimu lead).

Ebyuma ebikuba ebifaananyi PCB: Okukakasa ebanga ly’okuziyiza (insulation spacing) ku circuit za vvulovumenti enkulu.

6. Okwawukana ku bavuganya

Omulimu SAKI BF-3AXiM200 Ebyuma ebya bulijjo ebya X-Ray

Okusalawo 0.5μm (amakolero waggulu) Ebiseera ebisinga 1 ~ 5μm

Enkola y’okuzuula 2D+3D-CT okugatta, okuwagira okusika okulengejja Ebisinga biwagira 2D oba tomography ennyangu yokka

Intelligent AI automatic defect classification + closed-loop process feedback Weesigamye ku bumanyirivu mu ngalo okusalawo

Okugaziwa Module y’okwekenneenya ensengekera y’amasoboza ey’okwesalirawo (EDS) Omulimu ogutakyukakyuka

7. Mu bufunze

SAKI BF-3AXiM200 efuuse eky’okuzuula eky’enkomerero eky’okukola ebyuma eby’amasannyalaze ebyesigika ennyo nga biriko submicron resolution, intelligent CT scanning n’obusobozi bw’okugatta Industry 4.0. Omugaso gwayo omukulu guli mu:

Zero defect control: okukwata ebiyinza okulemererwa nga bukyali n’okukendeeza ku bulabe obw’oluvannyuma lw’okutunda.

Data-driven optimization: okulongoosa enkola z’okuweta nga tuyita mu kwekenneenya mu bungi (nga void rate).

Okutuukagana n’embeera mu makolero mu bujjuvu: okutuukiriza omutindo ogusinga okukakali ng’emmotoka, eby’obujjanjabi, n’eby’omu bwengula.