SAKI smt 3D X-ray makina BF-3AXiM200

SAKI BF-3AXiM200 ndi apamwamba-mapeto 3D X-ray basi anayendera dongosolo (AXI), opangidwa kuti mkulu kachulukidwe ma CD pakompyuta (monga BGA, CSP, Flip Chip) ndi zovuta PCB msonkhano. Amagwiritsa ntchito teknoloji ya micro-focus X-ray imaging + CT scanning kuti akwaniritse kufufuza kosawonongeka kwazitsulo zobisika za solder ndi zolakwika zamkati, ndipo zimagwiritsidwa ntchito kwambiri pamagetsi a galimoto, ndege, mauthenga a 5G, zipangizo zamankhwala ndi madera ena omwe ali ndi zofunikira zodalirika kwambiri.

2. Mafotokozedwe apakati ndi magawo aukadaulo

📌 Kusintha kwa Hardware

Zinthu Parameters

X-ray gwero Open microfocus chubu, voteji osiyanasiyana 30kV-160kV

Kuyikirako 0.5μm (ocheperako), mulingo wa submicron

Detector High-sensitivity flat-panel detector, kusamvana 2048 × 2048

Kukula kwakukulu kwa PCB 510mm × 460mm (kukula kokulirapo kumatha makonda)

CT kupanga sikani luso Support 360 ° tomography, wosanjikiza kulondola 3μm

Zoyenda dongosolo High-mwatsatanetsatane liniya gawo, repeatable malo olondola ± 2μm

Chitetezo cha radiation Kutayikira mlingo <1μSv/h, mogwirizana ndi mfundo za chitetezo padziko lonse

📌 Zizindikiro zogwirira ntchito

Liwiro lozindikira:

2D mode: ≤250mm / s (kusanthula mwachangu)

3D-CT mode: 10-30 mphindi / bolodi (malingana ndi zofunika kusamvana)

Kuzindikira kuwonongeka:

Itha kuzindikira voids olowa nawo ≥3μm

Support Solder olowa khalidwe kusanthula 01005 zigawo zikuluzikulu (0.4mm×0.2mm)

3. Ntchito zazikulu ndi maudindo

🔹 1. Kuzindikira zolakwika mwatsatanetsatane

Kuwonongeka kwa kuwotcherera:

Cold Solder, Bridging, Void, Solder Ball

Mavuto a Assembly:

Kusalongosoka kwa zigawo, pin crack, zinthu zakunja

🔹 2. 3D-CT tomography (ngati mukufuna)

Kumanganso kwa mbali zitatu: Pangani chitsanzo cha mbali zitatu cha zolumikizira zogulitsira/kudzera mabowo kudzera m'mawonedwe amitundu ingapo, ndikusanthula mochulukira:

Mtengo wopanda kanthu (Wopanda%), kutalika kwa solder, coplanarity

Kusanthula kwamkati:

PCB mkati wosanjikiza dera lalifupi, mkuwa yokutidwa dzenje (PTH) metallization umphumphu

🔹 3. Kusanthula mwanzeru ndi kasamalidwe ka data

Gulu lodziwikiratu la AI: Kuphunzira mwakuya kumangowonetsa mitundu ya zolakwika (monga IPC-A-610 Class 3 standard).

Kuwongolera kwa SPC: ziwerengero zenizeni zenizeni za magawo olumikizana a solder (kuchuluka, kutalika), ndi kutulutsa malipoti amayendedwe.

Kuphatikiza kwa MES: thandizirani protocol ya SECS/GEM, ndikulumikizana ndi data yamakina oyang'anira fakitale.

4. Zopindulitsa za mankhwala

✅ Kujambula kwapamwamba kwambiri

0.5μm yaying'ono-focus X-ray: jambulani momveka bwino tsatanetsatane wa solder wa Ultra-fine pitch BGA (0.3mm phula).

16-bit grayscale detector: siyanitsani kusiyana kwa kachulukidwe kakang'ono (monga kusiyana pakati pa phala la solder ndi copper layer).

✅ Kuzindikira koyenera kwamitundu yambiri

Kusanthula mwachangu kwa 2D: koyenera kuyang'anitsitsa mzere wopanga, ndi liwiro la 250mm/s.

Kusanthula mozama kwa 3D-CT: tomography yolondola kwambiri m'malo ofunikira (monga ECU yamagalimoto).

✅ Luntha ndi zochita zokha

Kugwiritsa ntchito batani limodzi: pulogalamu yowunikiratu, kuthandizira pulogalamu yapaintaneti (OLP).

Kuwongolera kwadzidzidzi: kuchepetsa kulowererapo pamanja ndikuwongolera kukhazikika kwa zida.

✅ Chitetezo ndi kutsata

Chitetezo cha radiation: chotchinga chagalasi chotsogolera + chipangizo cholumikizira kuti chitsimikizire kuti chikugwira ntchito bwino.

Chitsimikizo chamakampani: Chimakumana ndi IPC, IATF 16949 (magalimoto), ISO 13485 (zachipatala).

5. Zochitika zogwiritsira ntchito

🚗 Zamagetsi zamagalimoto

Moduli ya radar ya ADAS: Pezani ma voids ogulitsidwa m'njira zama siginecha apamwamba kwambiri.

Battery management system (BMS): Onetsetsani kudalirika kwa kuwotcherera kwa njira zamakono.

📡 Kulumikizana kwa 5G

Milimeter wave antenna PCB: Tsimikizirani mtundu wa kuwotcherera kwa zigawo za RF (monga zida za GaN).

Base station power amplifier: Unikani chiwopsezo cha kutopa kwamapadi akulu akulu.

🛰️ Zamlengalenga

Dongosolo la Satellite control: Kuzindikira zolakwika za 3D zamalumikizidwe amkati amitundu yambiri.

Njira yowongolera ndege: Kuyesa kosawononga kwa mapini apamwamba a QFN phukusi.

🏥 Zida zamankhwala

Zamagetsi zoyikika: Dziwani kuti pali mgwirizano wa solder (zotsalira zopanda lead).

Zida zojambulira PCB: Kutsimikizira kwapatali kwapatali kwa mabwalo othamanga kwambiri.

6. Kusiyanitsa ndi opikisana nawo

Ntchito SAKI BF-3AXiM200 Zida Zamakono za X-Ray

Kusamvana 0.5μm (pamwamba pamakampani) Nthawi zambiri 1 ~ 5μm

Mawonekedwe ozindikira 2D + 3D-CT kuphatikiza, kuthandizira kupendekera kothandizira Kwambiri kumangothandizira 2D kapena tomography yosavuta

Gulu la Intelligent AI lodziwikiratu lachilema + mayankho otseka-loop ndondomeko Dalirani pazochitikira pamanja kuti muweruze

Extensibility Optional energy spectrum analysis (EDS) module Fixed function

7. Mwachidule

SAKI BF-3AXiM200 yakhala njira yomaliza yodziwira popanga zida zamagetsi zodalirika kwambiri zokhala ndi ma submicron resolution, kusanthula kwanzeru kwa CT ndi kuthekera kophatikiza kwa Viwanda 4.0. Phindu lake lalikulu lagona mu:

Kuwongolera zolakwika paziro: chepetsani zolephera zomwe zingachitike mudakali achangu ndikuchepetsa zoopsa zogulitsa pambuyo pogulitsa.

Kukhathamiritsa koyendetsedwa ndi data: sinthani njira zowotcherera pogwiritsa ntchito kusanthula kwachulukidwe (monga void rate).

Kusintha kwathunthu kwamakampani: kwaniritsani miyezo yolimba kwambiri monga zamagalimoto, zamankhwala, ndi zakuthambo.