SAKI 3D AOi smt Ekyuma ekikebera amaaso mu ngeri ey’otoma 3Di-LS3

Mu mulimu gw’okukola ebyuma eby’omulembe, ebyetaago by’okukebera PCB (printed circuit boards) byeyongera obungi naddala okukebera omutindo gw’okuweta ebipapula ebirina density enkulu (nga BGA, QFN, CSP) n’ebitundu ebitonotono (nga 0201, 01005). Ebyuma eby’ennono ebya 2D AOI (automatic optical inspection) bibadde bizibu okutuukiriza ebyetaago eby’obutuufu obw’amaanyi, era SAKI 3Di-LS3 3D AOI egaba eky’okukebera ekituufu era ekikola obulungi ku layini z’okufulumya SMT (surface mount technology) ne tekinologiya waakyo ow’omulembe ow’okukuba ebifaananyi ebya 3D n’enkola ez’amagezi.

Ebirungi ebiri mu bikozesebwa

✅ High-precision 3D inspection: Nga tukozesa tekinologiya wa laser scanning, parameters enkulu nga solder joint height, coplanarity, ne volume bisobola okupimibwa obulungi okukendeeza ku misjudgment.

✅ Okukebera ku sipiidi ya waggulu: Okulongoosa enkola y’amaaso n’enkola, sipiidi y’okukebera esukka ebitundu 20% okusinga eya 3D AOI ey’ennono, esaanira layini z’okufulumya SMT ez’amaanyi.

✅ Okutegeera obulema mu ngeri ey’amagezi: AI algorithm eyiga mu ngeri ey’otoma era n’elongoosa okukendeeza ku muwendo gwa alamu ey’obulimba (False Call) n’okulongoosa obwesigwa bw’okukebera.

✅ Okukwatagana okugazi: kuwagira ebika byonna eby'ebika bya PCB board (rigid, flexible, HDI) n'ebitundu ebizibu (BGA, LGA, PoP, n'ebirala).

✅ Modular design: emirimu gy’okuzuula giyinza okugaziwa okusinziira ku byetaago bya kasitoma, nga SPI (solder paste detection) linkage okutuuka ku closed-loop process control.

Omusingi gw’okukola

SAKI 3Di-LS3 ekozesa tekinologiya wa laser triangulation, nga egattibwa wamu ne kkamera ya CCD ey’obulungi obw’amaanyi, okutuuka ku bifaananyi ebya 3D:

Laser scanning: Layini ya laser efulumizibwa ku PCB surface, era camera ekwata ekitangaala ekitunuuliddwa okuva mu nkoona ez’enjawulo okubala data y’obugulumivu bw’ekiyungo kya solder.

3D modeling: Okuyita mu multi-angle scanning, 3D profile y’ekiyungo kya solder ekolebwa, era obuwanvu, obuzito, enkula n’ebipimo ebirala bipimibwa bulungi.

Okwekenenya kwa AI: Enkola eyesigamiziddwa ku kuyiga okw’obuziba egeraageranya mu ngeri ey’otoma enkola y’ekiyungo kya solder eky’omutindo okuzuula ebikyamu nga ebiyungo bya solder ebinyogovu, solder obutamala, bridging, ne offset.

Emirimu emikulu

1. Okuzuula ekiyungo kya solder mu ngeri ya 3D

Pima obugulumivu, obuzito, n’obutafaanagana (coplanarity) bw’ekiyungo kya solder okukakasa omutindo gw’okusonda kw’ebiyungo bya solder ebikwese nga BGA ne QFN.

Zuula obulema obutera okubeerawo nga solder paste obutamala, emipiira gya solder, n’okukuba amayinja mu ntaana.

2. Okuzuula ebitundu ebituufu ennyo

Laba ebizibu nga placement offset, tombstone, n’okuyiringisibwa kw’ebitundu ebitono ennyo nga 0201 ne 01005.

Okuwagira 3D contour okuzuula ebitundu eby’enjawulo-enkula, ebibikka ebiziyiza, n’ebiyungo.

3. Okwekenenya data mu ngeri ey’amagezi

Okukola lipoota za SPC (statistical process control) mu ngeri ey’otoma okusobola okulongoosa enkola z’okufulumya.

Okugatta ne MES (enkola y’okukola ebintu) okutuuka ku kulondoola data n’okulondoola mu kiseera ekituufu.

4. Okukola pulogulaamu ezikyukakyuka n’okulongoosa

Okuwa enkola ya pulogulaamu ey’ebifaananyi, okuwagira pulogulaamu ezitali ku mutimbagano (OLP), n’okukendeeza ku budde bw’okukyusa layini.

Omulimu gw'okuyiga mu ngeri ey'okwekolako okukendeeza ku mulimu gw'okulongoosa mu ngalo.

Ebintu ebikwata ku bikozesebwa

📌 Enkola y'amaaso

High-resolution laser scanning: obutuufu busobola okutuuka ku ±1μm, esaanira okuzuula ebitundu by’eddoboozi ery’amaanyi ennyo.

Ensibuko y’ekitangaala eky’enkoona nnyingi: okugatta ettaala ya ring LED + coaxial okumalawo okutaataaganyizibwa kw’ekisiikirize n’okulongoosa omutindo gw’okukuba ebifaananyi.

📌 Enkola ya Sofutiweya

AI Deep Learning: Elongoosa mu ngeri ey’otoma ensengeka z’okuzuula okusobola okutuukagana ne dizayini za PCB ez’enjawulo.

Adaptive Threshold: Ekendeeza ku kusalawo okukyamu okuva ku langi ya PCB, okutunula n’ebirala.

📌 Enzimba y'ebyuma

High Rigidity Frame: Ekendeeza ku kukankana n’okukakasa nti sikaani enywevu.

Autofocus System: Ekwatagana n’obuwanvu bwa bboodi obw’enjawulo awatali kulongoosa mu ngalo.

Ebikwata ku by’ekikugu

Ebipimo bya Pulojekiti

Obutuufu bw’okuzuula ±1μm (Z axis) .

Sipiidi y’okuzuula Okutuuka ku 25cm2/s

Ekitundu ekitono ennyo 01005 (0.4mm × 0.2mm)

Obuwanvu bw’amayengo ga layisi 650nm (layisi emmyufu) .

Obulungi bwa kamera 12MP (4096×3072)

PCB ekwatagana sayizi 50mm × 50mm ~ 510mm × 460mm

Enkola y'empuliziganya SECS/GEM, TCP/IP

Amaanyi ageetaagisa AC 200-240V, 50/60Hz

Ensonga z’okukozesa

Ebyuma ebikozesebwa: Okuzuula PCB eya density enkulu ku masimu, tabuleti, n’ebyuma ebigezi ebyambalibwa.

Ebyuma ebikozesebwa mu mmotoka: Okulondoola omutindo gw’okuweta ebitundu ebikulu nga ADAS ne ECU.

Okufuga amakolero: Okuzuula obwesigwa bwa PCB ku seeva ne base stations z’empuliziganya.

Mu bufunzi

SAKI 3Di-LS3 3D AOI efuuse ekyuma ekyetaagisa okulondoola omutindo mu kukola ebyuma eby’omulembe olw’okusika layisi mu ngeri entuufu, AI intelligent algorithm n’obusobozi bw’okuzuula ku sipiidi ey’amaanyi. Ka kibeere nti ekola ku bitundu ebitonotono oba enkola enzibu ez’okupakinga, esobola okuwa eby’okuzuula ebyesigika era ebikola obulungi okuyamba bakasitoma okulongoosa amakungula n’okukendeeza ku nsaasaanya y’okufulumya.