SAKI 3D AOi smt Umatshini woHlolo oluSebenzayo oluSebenzayo lwe-3Di-LS3

Kumashishini okuvelisa i-electronics yanamhlanje, iimfuno zokuhlolwa kwe-PCB (iibhodi zesekethe eziprintiweyo) ziya zinyuka kwaye ziphezulu, ngakumbi ukuhlolwa komgangatho we-welding yeepakethe ezixineneyo eziphezulu (ezifana ne-BGA, QFN, CSP) kunye namacandelo amancinci (njenge-0201, i-01005). Isixhobo se-AOI ye-2D yemveli (i-automatic optical inspection) ibe nzima ukuhlangabezana neemfuno ezichanekileyo, kwaye i-SAKI 3Di-LS3 3D AOI ibonelela ngesisombululo esichanekileyo nesisebenzayo sokuhlola i-SMT (i-teknoloji ye-surface mount) imigca yokuvelisa kunye ne-teknoloji ye-imaging ye-3D kunye ne-algorithms ehlakaniphile.

Iinzuzo zemveliso

✅ Ukuhlolwa kwe-3D echanekileyo ephezulu: Ukusebenzisa iteknoloji yokuskena i-laser, iiparitha eziphambili ezifana nobude obuhlangeneyo be-solder, i-coplanarity, kunye nevolumu inokulinganiswa ngokuchanekileyo ukunciphisa ukugwetywa kakubi.

✅ Ukuhlolwa kwesantya esiphezulu: Ukuphucula inkqubo ye-optical kunye ne-algorithm, isantya sokuhlola singaphezulu kwe-20% ephezulu kuneyemveli ye-3D AOI, efanelekileyo kwimigca yokuvelisa i-SMT ephezulu.

✅ Ukuqatshelwa kwesiphene esikrelekrele: I-algorithm ye-AI izifunda ngokuzenzekelayo kwaye yongezelele ukunciphisa izinga le-alam yobuxoki (Umnxeba ongeyonyani) kunye nokuphucula ukuthembeka kohlolo.

✅ Ukuhambelana okubanzi: ixhasa zonke iindidi zebhodi yePCB (eqinile, ebhetyebhetye, HDI) kunye namacandelo anzima (BGA, LGA, PoP, njl.).

✅ Uyilo lwemodyuli: imisebenzi yokubona inokwandiswa ngokweemfuno zabathengi, njenge-SPI (ukubonwa kwe-solder paste) unxibelelwano ukufikelela kulawulo lwenkqubo evaliweyo.

Umgaqo wokusebenza

I-SAKI 3Di-LS3 isebenzisa itekhnoloji ye-laser triangulation, idityaniswe nekhamera yeCCD enesisombululo esiphezulu, ukufezekisa umfanekiso we-3D:

I-Laser scanning: Umgca welaser uqikelelwa kumphezulu we-PCB, kwaye ikhamera ibamba ukukhanya okubonakalisiweyo kwii-engile ezahlukeneyo ukubala idatha yobude obuhlangeneyo be-solder.

Imodeli ye-3D: Ngokusebenzisa i-multi-angle scanning, iphrofayili ye-3D ye-joint solder yenziwa, kwaye ukuphakama, umthamo, imilo kunye nezinye iiparameters zilinganiswa ngokuchanekileyo.

Uhlalutyo lwe-AI: I-algorithm esekelwe ekufundeni okunzulu ithelekisa ngokuzenzekelayo imodeli edibeneyo ye-solder ukuchonga iziphene ezinje ngeendawo ezibandayo ze-solder, i-solder engonelanga, i-bridging, kunye ne-offset.

Imisebenzi engundoqo

1. 3D ubhaqo solder joint

Ukulinganisa ukuphakama, umthamo, kunye ne-coplanarity ye-solder joint ukuqinisekisa umgangatho wokuthengiswa kwezinto ezifihlakeleyo ze-solder ezifana ne-BGA kunye ne-QFN.

Khangela iziphene eziqhelekileyo ezifana nokungonelanga kwe-solder paste, iibhola ze-solder, kunye ne-tombstoneing.

2. Ukufunyanwa kwecandelo elichanekileyo eliphezulu

Chonga iingxaki ezifana nokubekwa kwe-offset, ilitye lengcwaba, kunye ne-rollover yamacandelo amancinci afana ne-0201 kunye ne-01005.

Ukuxhasa ukubonwa kwe-contour ye-3D yamacandelo akhethekileyo, iikhava ezikhuselayo, kunye nezihlanganisi.

3. Uhlalutyo lwedatha ehlakaniphile

Ukuvelisa ngokuzenzekelayo i-SPC (ulawulo lwenkqubo yamanani) iingxelo zokwandisa iinkqubo zokuvelisa.

Dibanisa ne-MES (inkqubo yokwenziwa kwemveliso) ukuze kuphunyezwe ukulandeleka kwedatha kunye nokubeka iliso ngexesha lokwenyani.

4. Iprogramu eguquguqukayo kunye nokulungiswa kweempazamo

Nika ujongano lwenkqubo yegraphical, inkxaso yeprogram engaxhunyiwe kwi-intanethi (OLP), kwaye unciphise ixesha lokutshintsha umgca.

Umsebenzi wokufunda ngokuzenzekelayo ukunciphisa umthwalo wokulungisa ngesandla.

Iimpawu zemveliso

📌 Inkqubo yokubona

I-high-resolution laser scanning: ukuchaneka kunokufikelela kwi-±1μm, ilungele ukufunyanwa kwecandelo le-ultra-fine pitch.

Umthombo wokukhanya we-multi-angle: iringi ye-LED + indibaniselwano yokukhanya kwe-coaxial ukuphelisa ukuphazamiseka kwesithunzi kunye nokuphucula umgangatho womfanekiso.

📌 Algorithm yeSoftware

UkuFunda Okunzulu kwe-AI: Ilungiselela ngokuzenzekelayo iiparamitha zokubona ukuziqhelanisa noyilo olwahlukileyo lwePCB.

I-Adaptive Threshold: Yehlisa izigwebo ezingalunganga ezibangelwa ngumbala we-PCB, imiboniso, njl.

📌 Ulwakhiwo loomatshini

Isakhelo soBulukhuni obuphezulu: Inciphisa impembelelo yokungcangcazela kwaye iqinisekisa uzinzo lokuskena.

I-Autofocus System: Iqhelanisa nobukhulu bebhodi eyahlukeneyo ngaphandle kohlengahlengiso lwezandla.

IiNgcaciso zobuGcisa

IiParamitha zeProjekthi

Ukuchongwa kokuchaneka ±1μm (umgca onguZ)

Isantya sokubhaqa ukuya kuthi ga kwi-25cm²/s

Ubuncinane becandelo 01005 (0.4mm × 0.2mm)

Ubude beLaser 650nm (i-laser ebomvu)

Isisombululo sekhamera 12MP (4096×3072)

Ubungakanani bePCB ehambelanayo 50mm × 50mm ~ 510mm × 460mm

Unxibelelwano lonxibelelwano lwe-SECS/GEM, TCP/IP

Imfuno yamandla AC 200-240V, 50/60Hz

Iimeko zesicelo

Izixhobo zombane zabathengi: Ukufunyanwa kwePCB enoxinaniso oluphezulu lweeselfowuni, iitafile, kunye nezixhobo ezinxitywayo ezikrelekrele.

Ii-elektroniki ze-Automotive: Ukulawulwa kwekhwalithi ye-Welding yezinto eziphambili ezifana ne-ADAS kunye ne-ECU.

Ulawulo lwamashishini: ukuchongwa kokuthembeka kwe-PCB yeeseva kunye nezikhululo ezisisiseko zonxibelelwano.

Ukuqukumbela

I-SAKI 3Di-LS3 3D AOI ibe sisixhobo sokulawula umgangatho esiyimfuneko kwimveliso ye-elektroniki yale mihla kunye ne-laser echanekileyo ephezulu yokuskena, i-algorithm yobukrelekrele be-AI kunye nesakhono sokubona ngesantya esiphezulu. Nokuba ijongana namacandelo amancinci okanye iinkqubo zokupakisha ezintsonkothileyo, inokubonelela ngezisombululo ezithembekileyo nezisebenzayo zokubona ukunceda abathengi baphucule isivuno kunye nokunciphisa iindleko zemveliso.