Siemens asm d3i smt chip mounter

Siemens SIPLACE D3i SMT Mashiinka Falanqaynta Farsamo Dhamaystiran

1. Meelaynta qalabka iyo asalka suuqa

1.1 Meelaynta Qalabka

Mawqifka Khadka Alaabta: D3i waa mashiinka SMT-ga dhexe-ilaa-sare ee mashiinka SMT ee Siemens (hadda ASM SIPLACE), oo ku yaal khadka wax-soo-saarka SMT oo leh xawaare sare, saxsanaan sare iyo dabacsanaan sare, oo ku habboon wax-soo-saarka elektiroonigga ah ee-mugga weyn iyo noocyo badan oo kala duwan (sida qalabka elektiroonigga ah, qalabka isgaarsiinta, iyo elektiroonigga macaamiisha sare).

Xiriirka soo noqnoqda: D3i waa nooc la cusboonaysiiyay ee taxanaha D. Marka la barbar dhigo taxanaha D1/D2, waxay wanaajisaa saxnaanta firfircoon iyo waxtarka isbeddelka khadka, waxayna taageertaa meelaynta qaybaha kakan (sida qaybo qaabaysan iyo BGA-weyn).

1.2 Dhaxalka Farsamada

Lahaanshaha Sumcadda: Siemens SMT meheradda markii dambe waxay ka tirsan tahay Nidaamyada Golaha ASM, laakiin waxay sii waday nidaamka tignoolajiyada SIPLACE.

Faa'iidooyinka Muhiimka ah: Dhaxalashada mootada toosan ee SIPLACE, Fly Vision iyo tignoolajiyada kale ee shatiga leh.

2. Mabda'a shaqada ee asaasiga ah

2.1 Habka rakibidda

gudbinta PCB iyo meelaynta

PCB waxa ay mishiinka ka gashaa biraha hagaha ee saxda ah waxana lagu hagaajiyaa xajinta farsamada + faakuumka.

Kamarada FCM waxay aqoonsataa dhibcaha PCB (Fiducial) si ay u magdhabiso qallooca PCB ama leexashada booska.

Xulashada iyo hagaajinta qaybaha

Madaxa kor-u-qaadista wuxuu ka soo qaadaa qaybaha quudiyaha wuxuuna ku ogaadaa qaybaha wakhtiga dhabta ah iyada oo loo marayo kamaradda ICM (module kamarad isku dhafan):

Maqnaanshaha booska dhexe

Khaladka xagasha wareega

Pin coplanarity (loogu talagalay QFP/BGA)

Isticmaalka tignoolajiyada udub dhexaad u ah duulista, qaybaha waa la habeeyey inta lagu jiro dhaqdhaqaaqa si loo yareeyo wakhtiga hakadka.

Kordhinta firfircoon

Matoorka toosan ayaa kaxeeya madaxa korka, oo ay weheliso xakamaynta xakamaynta wareegga-nanometer-ka, si loo gaaro meelaynta heerka nanometer (± 15μm @3σ).

Waxay taageertaa kontoroolka xooga si looga hortago waxyeelada qaybaha saxda ah (sida MLCC khafiif ah).

2.2 Farsamada Muhiimka ah

Tiknoolajiyada Tooska ah ee Tooska ah: Gudbinta aan kala go 'lahayn, xawaaraheeda ilaa 2m/s², cimriga cimrigiisu aad ayuu uga badan yahay caagagga rasaasta.

Madaxa meelaynta MultiStar: Ikhtiyaar ah 12/16 madaxa biibiile, wuxuu taageeraa isbarbardhigga Xulashada & Goobta.

Nidaamka quudinta caqliga:

Waxay taageertaa quudiyaha korantada (eFeeder), si toos ah ayuu u cabbiraa booska marka la beddelayo alaabta.

Waxaa lagu ballaarin karaa in ka badan 300+ saldhigyo walxaha, oo ku habboon cajaladaha 8mm ~ 104mm.

3. Habaynta Hardware iyo software

3.1 Dhismaha qalabka

Module Sharaxaadda Waxqabadka

Madaxa meelaynta taxanaha MultiStar, 12/16 nozzle optional, wuxuu taageeraa qaybaha 0201 ~ 45mm × 45mm.

Nidaamka aragga - ICM (habaynta qaybaha): 50μm@15ms

- FCM (meelaynta PCB): ± 10μm saxsanaanta

Nidaamka Quudinta Quudiye koronto (eFeeder), wuxuu taageeraa maareynta qashinka garaadka.

Xakamaynta dhaqdhaqaaqa matoor toosan + matoorka grating, dib u celinta ± 15μm.

Nidaamka wareejinta Gaadhi-laba-track ah, wuxuu taageeraa cabbirka PCB 50mm × 50mm ~ 510mm × 460mm.

3.2 Nidaamka Software

SIPLACE Software Suite:

Pro: Barnaamijyada aasaasiga ah iyo tayaynta

Xpert: Falanqaynta xogta horumarsan (sida CPK, tirakoobka dhimista meelaynta).

Kormeere: La socodka wax soo saarka wakhtiga-dhabta ah (OEE, alaarmiga khaladka).

Hawsha kobcinta garaadka:

hagaajinta isku xigxiga meelaynta firfircoon: Yaree masaafada dhaqaaqa cududda madaxa.

Caawinta beddelka khadka (QuickChange): Si toos ah u aqoonso isbeddellada ku yimaadda booska saldhigga walxaha

4. Halbeegyada waxqabadka muhiimka ah

Tilmaamayaasha xuduudaha D3i

Xawaaraha meelaynta ugu badan 60,000 CPH (qiimaha aragtiyeed, dhab ahaantii waxay kuxirantahay isku darka qaybaha)

Saxnaanta meelaynta ±15μm @3σ (qaybaha chip), ± 35μm (BGA weyn)

Qaybaha kala duwan 0201 ~ 45mm × 45mm, dhumucdiisuna waa 0.2 ~ 12mm

Awoodda quudiyaha ugu badnaan 324 (cajalad 8mm)

Waqtiga beddelka khadka <5 daqiiqo (Qaabka QuickChange)

5. Xaaladaha codsiga warshadaha

Qalabka elektiroonigga ah ee baabuurta: ECU guddiga kontoroolka (meelaynta qaybta u adkaysta heerkulka sare).

Qalabka isgaarsiinta: 5G saldhigga saldhigga RF moduleka (cufnaanta sare BGA).

Qalabka elektiroonigga ah: PCB aaladda la dhex-marin karo (Qaybaha garoonka aadka u fiican).

Xakamaynta warshadaha: Motherboard-ka xakamaynta warshadaha isku halaynta sare.

6. Cilad-baadhis qoto-dheer iyo dayactir

6.1 Khaladaadka guud iyo xalalka

Khaladka 1: Meelaynta qayb ka mid ah

Sababaha suurtagalka ah:

Meelaynta PCB waa khalad (khalad aqoonsiga dhabta ah).

Xirashada sanka waxay sababtaa leexashada dhererka qaadista.

Xalka:

Nadiifi kamaradda FCM oo dib u habeyn barta tixraaca.

Isticmaal calibratarka dhererka sanka si aad u hagaajisid cabbirada dhidibka-Z.

Khaladka 2: Fashil qaadis la'aan

Sababaha suurtagalka ah:

Duubka oo xirma ama daadinta dhuumaha faakuumka.

Qalad dejinta cabbirka dhumucda qaybaha

Xalka:

Ku nadiifi dhuunta birta nadiifiyaha ultrasonic.

Hubi cadaadiska dhaliyaha faakuumka (qiimaha caadiga ah: -80~-90kPa).

Khaladka 3: Alaarmiga wadida (ERR-2105)

Sababaha suurtagalka ah: culeyska xad-dhaafka ah ee matoorka toosan ama cillad-qodeeyaha.

Xalka:

Gacanta ku hubi haddii ay jirto arrin shisheeye oo ku taal tareenada hagaha ka dib marka korontada la damiyo.

La xidhiidh ASM taageero farsamo si aad u bedesho moduleka wadista.

6.2 Qorshaha dayactirka ka hortagga

Mawduuca dayactirka wareegga

Maalin kasta - Nadiifi sankalka, muraayadda kamarada

- Hubi cadaadiska faakuumka

Toddobaadle - Saliid hagaha toosan

- Ka dhig dhererka dhidibka-Z ee madaxa meelaynta

Bishii - Si buuxda u cabbir nidaamka muuqaalka

- Halbeegyada qalabka kaabta

7. Falanqaynta isbarbardhigga ee alaabta tartanka

Model SIPLACE D3i FUJI NXT III Panasonic CM602

Xawaaraha (CPH) 60,000 75,000 50,000

Saxnaanta (μm) ± 15 ± 25 ± 30

Waqtiga beddelka khadka <5 daqiiqo 10 daqiiqo 8 daqiiqo

Faa'iidooyinka Saxnaanta firfircoon ee sare Xawaaraha ugu sarreeya waafaqid guddiga

8. Kooban

SIPLACE D3i, oo leh tignoolajiyadeeda tooska ah ee wadista tooska ah, nidaamka quudinta caqliga leh iyo naqshadaynta qaabaysan, waxay aad ugu saraysaa xaaladaha meelaynta adag ee saxda ah, waxayna si gaar ah ugu habboon tahay goobaha wax soo saarka ee dhamaadka-sare sida elektiroonigga baabuurta iyo qalabka isgaarsiinta.

Talooyin:

Dayactirka joogtada ah wuxuu kordhin karaa nolosha qalabka (fiiri tilmaamaha tooska ah iyo nidaamyada vacuum).

Waxaan kugula talineynaa inaad si dhakhso leh ugu xalliso cilladaha adag addeeggayaga ogaanshaha fog.

Si aad u hesho buugag farsamo oo faahfaahsan ama hagaha hawlgalka software, booqo bogga taageerada farsamada ee ASM.