Montador de chips Siemens asm d3i smt

Siemens SIPLACE D3i SMT Machine Comprehensive Technical Analysis

1. Equipment Positioning and Market Background

1.1 Equipment Positioning

Product Line Position: D3i is a mid-to-high-end modular SMT machine of Siemens (now ASM SIPLACE), positioned in the SMT production line with high speed, high precision and high flexibility, suitable for large-volume and multi-variety electronic manufacturing (such as automotive electronics, communication equipment, and high-end consumer electronics).

Iteration Relationship: D3i is an upgraded model of the D series. Compared with the D1/D2 series, it optimizes the dynamic accuracy and line change efficiency, and supports more complex component placement (such as special-shaped components and large-size BGA).

1.2 Technology Inheritance

Brand Ownership: Siemens SMT business later belonged to ASM Assembly Systems, but continued the SIPLACE technology system.

Core Advantages: Inheriting SIPLACE linear motor drive, Fly Vision and other patented technologies.

2. Core working principle

2.1 Mounting process

Transmisión y posicionamiento de PCB

PCB enters the machine through high-precision guide rails and is fixed by mechanical clamping + vacuum adsorption.

FCM camera identifies PCB fiducial points (Fiducial) to compensate for PCB deformation or position deviation.

Selección y calibración de componentes

The mounting head picks up components from the feeder and detects components in real time through the ICM camera (integrated camera module):

Center position offset

Rotation angle error

Pin coplanarity (for QFP/BGA)

Using flying centering technology, components are calibrated during movement to reduce pause time.

Dynamic mounting

Linear motor drives the mounting head, combined with grating ruler closed-loop control, to achieve nanometer-level positioning (±15μm @3σ).

Supports force control mounting to prevent damage to precision components (such as thin MLCC).

2.2 Core Technology

Linear Direct Drive Technology: Frictionless transmission, speed up to 2m/s², lifespan far exceeds traditional lead screw.

MultiStar placement head: Optional 12/16 nozzle head, supports Pick & Place Parallelism.

Sistema de alimentación inteligente:

Supports electric feeder (eFeeder), automatically calibrates position when changing materials.

Can be expanded to 300+ material stations, compatible with 8mm~104mm material tapes.

3. Configuración de hardware y software

3.1 Arquitectura de hardware

Module Functional description

Placement head MultiStar series, optional 12/16 nozzle, supports 0201~45mm×45mm components.

Sistema de visión - ICM (calibración de componentes): 50 μm a 15 ms

- FCM (PCB positioning): ±10μm accuracy

Feeding system Electric feeder (eFeeder), supports intelligent bin management.

Motion control Linear motor + grating ruler, repeatability ±15μm.

Conveyor system Dual-track conveyor, supports PCB size 50mm×50mm~510mm×460mm.

3.2 Sistema de software

Paquete de software SIPLACE:

Pro: Basic programming and optimization.

Xpert: Advanced data analysis (such as CPK, placement offset statistics).

Monitor: Real-time production monitoring (OEE, fault alarm).

Intelligent optimization function:

Dynamic placement sequence optimization: Reduce the moving distance of the head arm.

Line change assistance (QuickChange): Automatically identify changes in material station position.

4. Parámetros clave de rendimiento

Indicators D3i parameters

Maximum placement speed 60,000 CPH (theoretical value, actual depends on component mixing)

Placement accuracy ±15μm @3σ (chip components), ±35μm (large BGA)

Rango de componentes: 0,201 ~ 45 mm × 45 mm, espesor: 0,2 ~ 12 mm

Feeder capacity Maximum 324 (8mm tape)

Tiempo de cambio de línea <5 minutos (modo QuickChange)

5. Escenarios de aplicación industrial

Automotive electronics: ECU control board (high temperature resistant component placement).

Communication equipment: 5G base station RF module (high density BGA).

Medical electronics: Implantable device PCB (ultra-fine pitch components).

Industrial control: High reliability industrial control motherboard.

6. Solución de problemas y mantenimiento en profundidad

6.1 Fallos comunes y soluciones

Fault 1: Component placement offset

Posibles causas:

PCB positioning is inaccurate (fiducial recognition error).

Nozzle wear causes pickup height deviation.

Solución:

Limpie la cámara FCM y recalibre el punto de referencia.

Use the nozzle height calibrator to adjust the Z-axis parameters.

Falla 2: Falla de recogida de vacío

Posibles causas:

Nozzle blockage or vacuum pipeline leakage.

Component thickness parameter setting error.

Solución:

Clean the nozzle with an ultrasonic cleaner.

Check the vacuum generator pressure (standard value: -80~-90kPa).

Fault 3: Drive alarm (ERR-2105)

Possible causes: Linear motor overload or encoder failure.

Solución:

Manually check whether there is foreign matter on the guide rail after power off.

Comuníquese con el soporte técnico de ASM para reemplazar el módulo de unidad.

6.2 Plan de mantenimiento preventivo

Contenido de Mantenimiento del Ciclo

Daily - Clean the nozzle, camera lens

- Verificar la presión de vacío

Weekly - Lubricate the linear guide

- Calibrate the Z-axis height of the placement head

Monthly - Fully calibrate the visual system

- Parámetros del equipo de respaldo

7. Análisis comparativo de productos competitivos

Model SIPLACE D3i FUJI NXT III Panasonic CM602

Speed (CPH) 60,000 75,000 50,000

Accuracy (μm) ±15 ±25 ±30

Tiempo de cambio de línea <5 minutos 10 minutos 8 minutos

Advantages High dynamic accuracy Ultra-high speed Large board compatibility

8. Resumen

SIPLACE D3i, with its linear direct drive technology, intelligent feeding system and modular design, excels in high-precision complex placement scenarios, and is particularly suitable for high-end manufacturing fields such as automotive electronics and communication equipment.

Recomendaciones:

Regular maintenance can extend the life of the equipment (focus on linear guides and vacuum systems).

We recommend that you quickly resolve complex faults through our remote diagnostic service.

For more detailed mechanical manuals or software operation guides, visit the ASM official technical support portal.