Siemens asm d3i smt isixhosi setshiphu

Siemens SIPLACE D3i SMT Machine Comprehensive Technical Analysis

1. Ukuma kweZixhobo kunye neMvelaphi yeMarike

1.1 Ukuma kweZixhobo

Isikhundla soMlayini weMveliso: I-D3i ngumatshini we-SMT ophakathi ukuya kwi-high-end ye-modular ye-Siemens (ngoku eyi-ASM SIPLACE), ebekwe kumgca wokuvelisa i-SMT ngesantya esiphezulu, ukuchaneka okuphezulu kunye nokuguquguquka okuphezulu, okufanelekileyo kwimveliso ye-elektroniki ye-volume enkulu kunye neentlobo ezininzi (ezifana ne-automotive electronics, izixhobo zonxibelelwano, kunye ne-electronics-end-end-electronic consumer).

Iteration Relationship: I-D3i ngumzekelo ophuculweyo we-D series. Xa kuthelekiswa nochungechunge lwe-D1 / D2, ilungiselela ukuchaneka okuguquguqukayo kunye nokusebenza kakuhle kokutshintsha komgca, kwaye ixhasa ukubekwa kwecandelo elinzima (njengamacandelo akhethekileyo kunye ne-BGA enkulu).

1.2 Ilifa leTekhnoloji

Ubunini beBrand: Ishishini le-Siemens SMT kamva laba lele-ASM Assembly Systems, kodwa yaqhubeka inkqubo yetekhnoloji ye-SIPLACE.

Izinto eziluncedo ezingundoqo: Ukufumana ilifa le-SIPLACE linear motor drive, Fly Vision kunye nezinye iitekhnoloji ezinelungelo elilodwa lomenzi wechiza.

2. Umgaqo ongundoqo wokusebenza

2.1 Inkqubo yokunyuswa

PCB transmission kunye nokubeka

I-PCB ingena kumatshini ngomzila wesikhokelo esichaneke kakhulu kwaye ilungiswe ngoomatshini bokubamba + i-vacuum adsorption.

Ikhamera ye-FCM ichonga amanqaku e-PCB efiducial (Fiducial) ukubuyisela ukuguqulwa kwe-PCB okanye ukutenxa kwindawo.

Ukuchongwa kwecandelo kunye nokulinganisa

Intloko enyukayo ithatha amacandelo kwi-feeder kwaye ibone izinto ngexesha langempela ngekhamera ye-ICM (imodyuli yekhamera edibeneyo):

Indawo esembindini yokulinganisa

Impazamo ye-engile yokujikeleza

I-Pin coplanarity (yeQFP/BGA)

Ukusebenzisa itekhnoloji ye-flying centering, amacandelo ayalinganiswa ngexesha lokunyakaza ukunciphisa ixesha lokumisa.

Ukufakwa ngamandla

Injini yomgca iqhuba intloko ekhwelayo, idityaniswe nerula yokugawula i-loop evaliweyo, ukuphumeza i-nanometer-level positioning (±15μm @3σ).

Ixhasa ukunyanzeliswa kokulawula ukunyanzeliswa ukuthintela umonakalo kwizinto ezichanekileyo (ezifana ne-MLCC ebhityileyo).

2.2 IThekhnoloji enguNdoqo

ITekhnoloji ye-Linear Direct Drive: Usasazo olungenamkhuseli, isantya ukuya kuthi ga kwi-2m/s², ubomi bubodlula kude isikrufu esikhokeleyo semveli.

Intloko yokubeka i-MultiStar: Ngokuzikhethela i-12/16 intloko yomlomo, ixhasa i-Pick & Place Parallelism.

Inkqubo yokutyisa ekrelekrele:

Ixhasa isondlo sombane (i-eFeeder), ilungelelanisa indawo ngokuzenzekelayo xa utshintsha imathiriyeli.

Inokwandiswa ukuya kwizikhululo zemathiriyeli ezingama-300+, ezihambelana ne-8mm ~ 104mm iiteyiphu zezinto.

3. I-Hardware kunye noqwalaselo lwesoftware

3.1 Uyilo lwehardware

Ingcaciso yemodyuli esebenzayo

Intloko yokubeka i-MultiStar series, i-nozzle ekhethiweyo ye-12/16, ixhasa i-0201 ~ 45mm × 45mm amacandelo.

Inkqubo yombono - ICM (ukulinganisa icandelo): 50μm@15ms

- FCM (PCB positioning): ±10μm ukuchaneka

Inkqubo yokutya I-Electric feeder (eFeeder), ixhasa ulawulo lomgqomo olukrelekrele.

Ulawulo olushukumayo Injini yomgca + irula yokugawula, ukuphinda-phinda ±15μm.

Inkqubo yokuhambisa i-Dual-track conveyor, ixhasa ubukhulu bePCB 50mm×50mm~510mm×460mm.

3.2 Inkqubo yesoftware

SIPLACE Software Suite:

Ipro: Inkqubo esisiseko kunye nokwenza ngcono.

I-Xpert: Uhlalutyo lwedatha ephucukileyo (efana ne-CPK, i-placement offset statistics).

Ukubeka iliso: Ukujongwa kwexesha langempela lemveliso (OEE, i-alarm yephutha).

Umsebenzi wokwandisa ngobukrelekrele:

Ukulungiswa kokulandelelana kokubekwa okunamandla: Nciphisa umgama oshukumayo wengalo yentloko.

Uncedo lokutshintsha umgca (QuickChange): Ukuchonga ngokuzenzekelayo utshintsho kwindawo yesikhululo sezinto eziphathekayo.

4. Iiparamitha zentsebenzo eziphambili

Izalathi D3i iiparamitha

Isantya esiphezulu sokubeka i-60,000 CPH (ixabiso lethiyori, eyona ixhomekeke kumxube wecandelo)

Ukuchaneka kokubekwa ±15μm @3σ (amalungu etshiphu), ±35μm (iBGA enkulu)

Uluhlu lwecandelo 0201 ~ 45mm×45mm, ubukhulu 0.2 ~ 12mm

Umthamo we-Fieder Ubuninzi 324 (8mm tape)

Ixesha lokutshintsha umgca <5 imizuzu (imowudi ye-QuickChange)

5. Iimeko zesicelo seshishini

I-Automotive electronics: Ibhodi yokulawula ye-ECU (ukubekwa kwecandelo lobushushu obuphezulu).

Izixhobo zonxibelelwano: Isiseko se-5G isiseko semodyuli ye-RF (i-BGA ephezulu yoxinaniso).

Izixhobo zombane zezonyango: Isixhobo esifakelwayo iPCB (amalungu epitch aphezulu kakhulu).

Ulawulo lwemizi-mveliso: Ukuthembeka okuphezulu kwebhodi yolawulo lweshishini.

6. Ukucombulula iingxaki kunye nokugcinwa ngokunzulu

6.1 Iimpazamo eziqhelekileyo kunye nezisombululo

Impazamo yoku-1: Ukubekwa kwecandelo kwi-offset

Unobangela onokwenzeka:

Ukubekwa kwe-PCB akuchanekanga (impazamo yolwazi lwefiducial).

Ukunxitywa kweNozzle kubangela ukutenxa kobude bomfanekiso.

Isisombululo:

Coca ikhamera yeFCM kwaye uhlengahlengise indawo yereferensi.

Sebenzisa isilinganisi sobude bombhobho ukulungisa iparamitha ze-Z-axis.

Impazamo yesi-2: Ukusilela kwe-vacuum pickup

Unobangela onokwenzeka:

Ukuvaleka kombhobho okanye ukuvuza kombhobho wokufunxa.

Impazamo yokumisela ipharamitha yobukhulu becandelo.

Isisombululo:

Coca umbhobho ngesicoci se-ultrasonic.

Jonga uxinzelelo lwejeneretha (ixabiso eliqhelekileyo: -80~-90kPa).

Impazamo yesi-3: I-alarm ye-Drive (ERR-2105)

Oonobangela abanokubakho: Umthwalo omninzi wemoto okanye ukusilela kwe-encoder.

Isisombululo:

Jonga ngesandla ukuba ngaba kukho umcimbi wangaphandle kumzila kaloliwe emva kokucinywa kombane.

Qhagamshelana nenkxaso yobugcisa ye-ASM ukuze ubuyisele imodyuli yokuqhuba.

6.2 Isicwangciso solondolozo esithintelwayo

Umjikelo woLondolozo umxholo

Mihla le - Coca umbhobho, ilensi yekhamera

- Jonga uxinzelelo lwevacuum

Ngeveki - Thambisa isikhokelo somgca

- Lungiselela ubude be-Z-axis yentloko yokubeka

Ngenyanga - Lungiselela ngokupheleleyo inkqubo yokubonwayo

- Iiparamitha zezixhobo zogcino

7. Uhlalutyo oluthelekisayo lweemveliso ezikhuphisanayo

Umzekelo SIPLACE D3i FUJI NXT III Panasonic CM602

Isantya (CPH) 60,000 75,000 50,000

Ukuchaneka (μm) ±15 ±25 ±30

Ixesha lokutshintsha umgca <5 imizuzu 10 imizuzu 8 imizuzu

Izinto eziluncedo Ukuchaneka okuguquguqukayo okuphezulu Ultra-high speed Ukuhambelana kwebhodi enkulu

8. Isishwankathelo

I-SIPLACE D3i, kunye nethekhnoloji yokuqhubela phambili ngokuthe ngqo, inkqubo yokutya ehlakaniphile kunye noyilo lwemodyuli, igqwesa kwiimeko zokubeka ezichanekileyo ezichanekileyo, kwaye ifaneleke ngokukodwa kwiinkalo zokuvelisa eziphezulu ezifana ne-automotive electronics kunye nezixhobo zonxibelelwano.

Izindululo:

Ukugcinwa rhoqo kunokwandisa ubomi bezixhobo (kugxininise kwizikhokelo zomgca kunye neenkqubo ze-vacuum).

Sincoma ukuba ukhawuleze uzisombulule iimpazamo ezinzima ngenkonzo yethu yoxilongo olukude.

Ukufumana iinkcukacha ezithe vetshe zeemanyuwali zoomatshini okanye izikhokelo zokusebenza kwesoftware, tyelela i-ASM esemthethweni yenkxaso yobugcisa portal.