Siemens SIPLACE D3i SMT Ekyuma Okwekenenya Eby'ekikugu Okujjuvu
1. Okuteeka ebyuma mu kifo n’akatale
1.1 Okuteeka ebyuma mu kifo
Product Line Position: D3i ye kyuma kya SMT ekya modular okuva mu makkati okutuuka ku mutindo ogwa waggulu ekya Siemens (kati ASM SIPLACE), nga kiteekeddwa mu layini y’okufulumya SMT nga kiri ku sipiidi ya waggulu, precision ya waggulu n’okukyukakyuka okw’amaanyi, nga kirungi okukola ebyuma ebinene n’eby’enjawulo (nga ebyuma by’emmotoka, ebyuma by’empuliziganya, n’ebyuma eby’omulembe ebikozesebwa).
Enkolagana y’okuddiŋŋana: D3i ye model erongooseddwa eya D series. Bw’ogeraageranya ne D1/D2 series, elongoosa obutuufu obukyukakyuka n’obulungi bw’okukyusa layini, era ewagira okuteeka ebitundu ebizibu ennyo (nga ebitundu eby’enkula ey’enjawulo ne BGA eya sayizi ennene).
1.2 Obusika bwa tekinologiya
Brand Ownership: Bizinensi ya Siemens SMT oluvannyuma yali ya ASM Assembly Systems, naye n’egenda mu maaso n’enkola ya tekinologiya eya SIPLACE.
Ebirungi Ebikulu: Okusikira SIPLACE linear motor drive, Fly Vision ne tekinologiya omulala alina patent.
2. Omusingi omukulu ogw’okukola
2.1 Enkola y’okussaako
Okutambuza kwa PCB n’okuteeka mu kifo
PCB eyingira mu kyuma ng’eyita mu ggaali z’omukka ezikulembera ezituufu ennyo era n’etereezebwa n’okusiba ebyuma + okuyungibwa mu bbugumu (vacuum adsorption).
FCM camera ezuula PCB fiducial points (Fiducial) okuliyirira PCB deformation oba position deviation.
Okulonda ebitundu n’okupima
Omutwe gw’okussaako gulonda ebitundu okuva mu feeder ne guzuula ebitundu mu kiseera ekituufu nga guyita mu kkamera ya ICM (integrated camera module):
Okukyusa ekifo ky’omu makkati
Ensobi mu nkoona y’okukyusakyusa
Okukwatagana kwa ppini (ku QFP/BGA) .
Nga bakozesa tekinologiya w’okubuuka wakati, ebitundu bipima nga bitambula okukendeeza ku budde bw’okuyimirira.
Okussaako ebyuma mu ngeri ey’amaanyi
Linear motor evuga omutwe gw’okussaako, nga egattibwa wamu n’okufuga kwa grating ruler closed-loop, okutuuka ku nanometer-level positioning (±15μm @3σ).
Awagira okuteeka amaanyi okufuga okuziyiza okwonooneka kw’ebitundu ebituufu (nga MLCC ennyimpi).
2.2 Tekinologiya Omukulu
Linear Direct Drive Technology: Transmission etaliimu kusika, sipiidi etuuka ku 2m/s2, obulamu busukka wala lead screw ey’ennono.
Omutwe gw’okuteeka MultiStar: Omutwe gw’entuuyo ogwa 12/16 ogw’okwesalirawo, guwagira Pick & Place Parallelism.
Enkola ey’amagezi ey’okuliisa:
Awagira ekyuma ekigabula amasannyalaze (eFeeder), kaliba ekifo mu ngeri ey’otoma nga okyusa ebintu.
Asobola okugaziwa okutuuka ku 300+ ebintu siteegi, okukwatagana ne 8mm ~ 104mm ebintu obutambi.
3. Ensengeka ya Hardware ne software
3.1 Enzimba ya Hardware
Module Ennyonnyola y’emirimu
Omutwe gw'okuteeka MultiStar series, ogw'okwesalirawo 12/16 nozzle, guwagira ebitundu 0201 ~ 45mm × 45mm.
Enkola y’okulaba - ICM (okupima ebitundu): 50μm@15ms
- FCM (okuteekebwa mu kifo kya PCB): ±10μm obutuufu
Enkola y’okuliisa Emmere y’amasannyalaze (eFeeder), ewagira okuddukanya ebibbo mu ngeri ey’amagezi.
Okufuga entambula Linear motor + grating ruler, okuddiŋŋana ±15μm.
Enkola ya conveyor Dual-track conveyor, ewagira PCB sayizi 50mm × 50mm ~ 510mm × 460mm.
3.2 Enkola ya pulogulaamu
Ekisenge kya Sofutiweya SIPLACE:
Pro: Okukola pulogulaamu ezisookerwako n’okulongoosa.
Xpert: Okwekenenya data okw’omulembe (nga CPK, ebibalo by’okukyusakyusa mu kuteekebwa).
Monitor: Okulondoola okufulumya mu kiseera ekituufu (OEE, alamu y’ensobi).
Omulimu gw’okulongoosa ogw’amagezi:
Dynamic placement sequence optimization: Okukendeeza ku bbanga ly’okutambula kw’omukono gw’omutwe.
Obuyambi bw’okukyusa layini (QuickChange): Laba mu ngeri ey’otoma enkyukakyuka mu kifo kya siteegi y’ebintu.
4. Ebikulu ebikwata ku nkola y’emirimu
Ebiraga D3i parameters
Sipiidi esinga obunene ey’okuteeka 60,000 CPH (omuwendo gw’enzikiriziganya, ddala kisinziira ku kutabula ebitundu)
Obutuufu bw’okuteeka ±15μm @3σ (ebitundu bya chip), ±35μm (BGA ennene)
Ebitundu range 0201 ~ 45mm × 45mm, obuwanvu 0.2 ~ 12mm
Obusobozi bw’okuliisa Ekisinga obunene 324 (8mm tape)
Obudde bw'okukyusa layini 5. Ensonga z’okukozesa amakolero Ebyuma ebikozesebwa mu mmotoka: ECU control board (okuteeka ebitundu ebigumira ebbugumu eringi). Ebikozesebwa mu mpuliziganya: Module ya 5G base station RF (high density BGA). Ebyuma ebikozesebwa mu by’obujjanjabi: Ekyuma ekiteekebwa mu mubiri PCB (ultra-fine pitch components). Okufuga amakolero: Motherboard efugira amakolero eyeesigika ennyo. 6. Okugonjoola ebizibu mu bujjuvu n’okuddaabiriza 6.1 Ensobi eza bulijjo n’okugonjoola ebizibu Ensobi 1: Okukyusakyusa mu kuteeka ebitundu Ebiyinza okuvaako ensonga eno: Enfo ya PCB si ntuufu (ensobi mu kutegeera mu ngeri ey’obwesige). Okwambala kwa nozzle kuleeta pickup height deviation. Okugonjoola: Okwoza kkamera ya FCM era oddemu okupima ekifo ekijuliziddwa. Kozesa ekipima obugulumivu bw’entuuyo okutereeza ebipimo bya Z-axis. Ensobi 2: Vacuum pickup eremereddwa Ebiyinza okuvaako ensonga eno: Okuzibikira kwa nozzle oba okukulukuta kwa payipu ya vacuum. Ensobi mu kuteekawo parameter y'obuwanvu bw'ekitundu. Okugonjoola: Okwoza entuuyo n’ekyuma ekiyonja eky’amaloboozi agayitibwa ultrasonic cleaner. Kebera puleesa ya jenereta ya vacuum (omuwendo ogwa mutindo: -80 ~-90kPa). Ensobi 3: Alamu y’okuvuga (ERR-2105) . Ebiyinza okuvaako: Linear motor overload oba encoder okulemererwa. Okugonjoola: Kebera mu ngalo oba waliwo ebintu ebigwira ku ggaali y’omukka eraga oluvannyuma lw’amasannyalaze okuggwaako. Tuukirira abayambi ab'ekikugu ba ASM okukyusa modulo ya drive. 6.2 Enteekateeka y’okuddaabiriza okuziyiza Ebirimu mu Kuddaabiriza enzirukanya Buli lunaku - Yoza entuuyo, lenzi ya kkamera - Kebera puleesa ya vacuum Buli wiiki - Siiga ekitabo ekilungamya eky’ennyiriri - Kaliba obuwanvu bwa Z-axis obw’omutwe gw’okuteeka Buli mwezi - Kaliba mu bujjuvu enkola y’okulaba - Ebipimo by'ebyuma eby'okutereka 7. Okwekenenya okugeraageranya ebintu ebivuganya Omutindo gwa SIPLACE D3i FUJI NXT III Panasonic CM602 Sipiidi (CPH) 60,000 75,000 50,000 Obutuufu (μm) ±15 ±25 ±30 Obudde bw’okukyusa layini Ebirungi Obutuufu obw’amaanyi obw’amaanyi Sipiidi eya waggulu ennyo Okukwatagana ne bboodi ennene 8. Mu bufunze SIPLACE D3i, ne tekinologiya waayo ow’okuvuga obutereevu mu layini, enkola y’okuliisa ey’amagezi n’enkola ya modulo, esukkulumye mu mbeera ez’okuteeka enzibu mu ngeri ey’obutuufu ennyo, era esaanira nnyo mu bintu eby’omulembe eby’okukola ebintu ng’ebyuma by’emmotoka n’ebyuma by’empuliziganya. Ebiteeso: Okuddaabiriza buli kiseera kuyinza okwongera ku bulamu bw’ebyuma (essira lisse ku bikulembeze eby’ennyiriri (linear guides) n’enkola za vacuum). Tukuwa amagezi okugonjoola amangu ensobi enzibu ng’oyita mu mpeereza yaffe ey’okukebera okuva ewala. Okumanya ebisingawo ku bitabo by’ebyuma oba ebiragiro ebikwata ku nkola ya pulogulaamu, genda ku mukutu omutongole ogwa ASM ogw’obuyambi obw’ekikugu.