SAKI smt 3d imashini ya spi BF-3Si-L2

SAKI BF-3Si-L2 nuburyo bugezweho bwo kugurisha paste ya 3D igurisha (3D SPI, Solder Paste Inspection) yagenewe imirongo ya kijyambere ya SMT (tekinoroji yubuso). Ikoresha tekinoroji ya 3D yerekana amashusho kugirango yihute kandi neza neza neza icapiro ryiza rya paste mbere yo kugurisha, harimo ibipimo byingenzi nkubunini, uburebure, agace, offset, nibindi, kugirango birinde neza inenge zagurishijwe no kuzamura umusaruro.

2. Ibyiza byingenzi

Det Ultra-high precision detection

Ibipimo bya Micron: ibipimo bya Z-axis (uburebure) birashobora kugera kuri mm 1 mm, bikwiranye nibice bya ultra-nziza cyane nka 01005 na 0.3mm ikibanza BGA.

Icyitegererezo cya 3D cyuzuye: Binyuze mu gusikana impande nyinshi, ingano, uburebure, n'imiterere ya paste yagurishijwe bibarwa neza kugirango wirinde ikibazo cyo guca imanza za gakondo 2D SPI.

Ection Kumenyekanisha byihuse, bikwiranye numurongo wo kubyara umusaruro mwinshi

Umuvuduko wo gutahura ugera kuri 600mm / s, kandi uburyo bubiri burashyigikirwa kugirango bikemure ibyifuzo byihuta byihuta bya SMT (nka terefone zigendanwa n'imirongo ikora ibikoresho bya elegitoroniki).

Igenzura ryubwenge algorithm igabanya ihindagurika ryimashini kandi ikanabikurikirana.

Algorithm yubwenge igabanya igipimo cyo gutabaza

AI yimbitse yimbitse: ihita ihindura ibipimo byo gutahura kugirango ihuze nubwoko butandukanye bwabacuruzi (nka sisitemu / idafite isasu, amazi-yogejwe / adafite isuku).

Isesengura ryimiterere yimihindagurikire: igabanya imanza zitari zo zatewe no gutekereza kwa PCB no gutandukanya ibara.

Design Igishushanyo mbonera, kwaguka byoroshye

Guhitamo byikora byikora kugirango bigabanye ingaruka zo kugurisha ibisigazwa bya paste kubitahura.

Shigikira guhuza hamwe na AOI, imashini ishyira, hamwe na sisitemu ya MES kugirango ugere kumugenzuzi ufunze-kugenzura ibikorwa byubwenge.

3. Ihame rya tekiniki

Technology Ikoranabuhanga rya 3D

BF-3Si-L2 ikoresha tekinoroji ya laser triangulation + yerekana urumuri:

Gusikana Lazeri: Umurongo wa lazeri uhanitse uteganijwe hejuru yuwagurishije paste, kandi urumuri rwerekanwe rufatwa na kamera ya CCD kugirango ibare amakuru yuburebure.

Imfashanyo yumucyo wubatswe: Multi-angle stripe light projection yongerera ubushobozi bwa 3D kontour yo kugarura padi igoye (nka BGA, QFN).

Process Igikorwa cyo kugenzura

Umwanya wa PCB: Ikinyabiziga gifite moteri ihanitse cyane kugirango igaragaze neza neza.

Gusikana 3D: Laser + urumuri rutunganijwe rukusanya amakuru yo kugurisha amakuru.

Isesengura rya AI: Gereranya ibicuruzwa bisanzwe bigurisha paste kugirango umenye inenge nkumugurisha udahagije, ikiraro, offset, nuburyo budasanzwe.

Ibitekerezo byatanzwe: Kora raporo ya SPC mugihe nyacyo cyo kuyobora inzira yo gucapa neza.

4. Imikorere yibanze

Parameter 3D ibipimo byerekana ibicuruzwa byagurishijwe

Umubumbe: Menya neza ko ingano ya paste yagurishijwe yujuje ubuziranenge kugirango wirinde kugurisha imbeho cyangwa imiyoboro migufi.

Uburebure: Menya uburinganire bwa paste yo kugurisha kugirango wirinde gusenyuka cyangwa kubumba nabi.

Agace: Gusesengura ubwishingizi bwa paste yagurishijwe hanyuma umenye offset cyangwa diffusion anomalies.

Imiterere: Menya imiterere idasanzwe nko gukurura inama no kwiheba.

Ubushobozi bwo gutahura neza

Ihame ryubwoko butandukanye

Ingano idahagije / uburebure buri munsi yurugero

Kurambura Ihuza ridasanzwe ryumuguzi wa paste uburebure

Kudahuza Umwanya gutandukana hagati yuwagurishije paste na padi birenze urwego rwemewe

Imiterere Yuzuye ya 3D kontour ntabwo ihuye nicyitegererezo gisanzwe

5. Ibyuma nibisobanuro

System Sisitemu nziza

Inkomoko ya Laser: 650nm laser itukura, ubunyangamugayo ± 1μm (Z axis), ± 5μm (X / Y axis).

Kamera: Ikomeye-12MP CCD, ishyigikira gusikana byihuse.

Inkomoko yumucyo: Impeta nyinshi zinguni LED + urumuri rwa coaxial, ruhuza nubuso butandukanye bwa PCB (byerekana cyane, matte).

Imiterere ya mashini

Sisitemu yimikorere: moteri yumurongo-mwinshi, moteri isubirwamo neza ± 3μm.

Ikadiri: Aluminium ikomeye cyane, ibishushanyo birwanya anti-vibration kugirango habeho ituze.

Autofocus: ihuza n'ubunini butandukanye bwa PCB (0.2mm ~ 6mm).

Ibisobanuro bya tekiniki

Ibipimo BF-3Si-L2 Ibisobanuro

Kumenya neza (Z axis) ± 1μm

Umuvuduko wo gutahura Kugera kuri 600mm / s (inzira imwe), uburyo bubiri bwo guhitamo

Ikintu ntarengwa cyo kumenya 01005 (0.4mm × 0.2mm)

Ingano ya PCB ingana na 50mm × 50mm ~ 510mm × 460mm

Imigaragarire y'itumanaho SECS / GEM, TCP / IP, RS-232

Amashanyarazi asabwa AC 200-240V, 50 / 60Hz

6. Incamake

SAKI BF-3Si-L2 3D SPI itanga imirongo yumusaruro wa SMT hamwe nibisobanuro bihanitse, bikora neza, hamwe n’ibicuruzwa bito byerekana ibicuruzwa byerekana ibicuruzwa ukoresheje laser + yubatswe urumuri rufite amashusho abiri ya 3D, algorithm ya AI ifite ubwenge hamwe na tekinoroji yo gusikana byihuse. Agaciro kayo yibanze muri:

Kwirinda inenge zo kugurisha: guhagarika inenge mbere yo kugurisha no kugabanya amafaranga yo gukora.

Kunoza igenzura ryimikorere: guhitamo ibipimo byo gucapa ukoresheje amakuru nyayo ya SPC.

Guhuza n'ibikenewe ejo hazaza: shyigikira ibice bito (01005, 0.3mm BGA) n'imirongo ivanze cyane.

Inganda zisabwa:

Electronic Ibikoresho bya elegitoroniki (terefone igendanwa, tableti)

Electronics Automotive electronics (ADAS, ECU)

Inganda zo mu rwego rwo hejuru