Ekyuma kya SAKI smt 3d spi BF-3Si-L2

SAKI BF-3Si-L2 nkola ya mulembe ey’okukebera solder paste mu ngeri ya 3D (3D SPI, Solder Paste Inspection) eyakolebwa ku layini z’okufulumya ez’omulembe eza SMT (surface mount technology). Ekozesa tekinologiya ow’okukuba ebifaananyi mu ngeri ya 3D okuzuula amangu era mu butuufu omutindo gw’okukuba ebitabo bya solder paste nga tebannaba kuddamu kugikuba solder, omuli ebikulu nga volume, height, area, offset, n’ebirala, okusobola okuziyiza obulungi obulema mu soldering n’okulongoosa amakungula g’okufulumya.

2. Ebirungi ebikulu

✅ Okuzuula okutuufu okw'amaanyi ennyo

Okupima ku ddaala lya Micron: Obutuufu bwa Z-axis (obugulumivu) busobola okutuuka ku ±1μm, nga busaanira ebitundu by’eddoboozi erya ultra-fine nga 01005 ne 0.3mm pitch BGA.

Full 3D modeling: Okuyita mu multi-angle scanning, volume, height, ne shape ya solder paste bibalirirwa bulungi okwewala ekizibu ky’okusalawo obubi ekya 2D SPI ey’ennono.

✅ Okuzuula ku sipiidi ey’amaanyi, okusaanira layini z’okufulumya ez’obusobozi obw’amaanyi

Sipiidi y’okuzuula etuuka ku mm/s 600, era mode ya mirongooti ebiri ewagirwa okutuukiriza ebyetaago bya layini z’okufulumya SMT ez’amaanyi (nga amasimu n’ebyuma ebikola ebyuma by’emmotoka).

Intelligent motion control algorithm ekendeeza ku kukankana kw’ebyuma era ekakasa nti sikaani enywevu.

✅ Intelligent algorithm ekendeeza ku muwendo gwa alamu ey’obulimba

AI deep learning: automatically optimizes detection parameters okutuukagana n’ebika bya solder paste eby’enjawulo (nga lead/lead-free, water-washable/clean-free).

Adaptive threshold analysis: ekendeeza ku kusalawo okukyamu okuva ku PCB reflection n’enjawulo ya langi.

✅ Dizayini ya modulo, okugaziwa okukyukakyuka

Optional automatic cleaning module okukendeeza ku impact ya solder paste residue ku kuzuula.

Okuwagira enkolagana ne AOI, ekyuma ekiteeka, n’enkola ya MES okutuuka ku kufuga okuggaddwa-loop okw’okukola okw’amagezi.

3. Omusingi gw’eby’ekikugu

📌 Tekinologiya w'okukuba ebifaananyi mu ngeri ya 3D

BF-3Si-L2 ekwata tekinologiya ow’emirundi ebiri ow’okulaga enjuyi essatu eza layisi + okuteebereza ekitangaala ekitegekeddwa:

Laser scanning: Layini ya layisi ey’obutuufu obw’amaanyi efulumizibwa ku ngulu wa solder paste, era ekitangaala ekitunuuliddwa kikwatibwa kkamera ya CCD okubala data y’obugulumivu.

Obuyambi bw’ekitangaala ekitegekeddwa: Okulaga ekitangaala eky’emisono mingi (multi-angle stripe light projection) kwongera ku busobozi bw’okuzzaawo enkula ya 3D eya paadi enzibu (nga BGA, QFN).

📌 Enkola y'okukebera

PCB positioning: High-precision linear motor drive okukakasa ekifo ekituufu eky’okusika.

3D scanning: Laser + ensengeka ekitangaala synchronously okukung'aanya solder paste data.

Okwekenenya AI: Geraageranya ebikolwa bya solder paste ebya bulijjo okuzuula obulema nga solder obutamala, bridge, offset, n’enkula etali ya bulijjo.

Data feedback: Okukola lipoota za SPC mu kiseera ekituufu okulungamya okulongoosa enkola y’okukuba ebitabo.

4. Emirimu emikulu

🔹 Okuzuula parameter ya 3D eya solder paste

Volume: Kakasa nti obungi bwa solder paste butuukana n’omutindo okwewala okusoda mu nnyonta oba short circuits.

Obugulumivu: Zuula obumu bwa solder paste okuziyiza okugwa oba okubumba obubi.

Ekitundu: Weekenneenye ebibikka ekikuta kya solder era ozuule obutafaanagana mu offset oba diffusion.

Enkula: Zuula enkula ezitali za bulijjo nga ensonga z’okusika n’okunyigirizibwa.

🔹 Obusobozi bw'okuzuula obulema

Ekika ky’obulema Enkola y’okuzuula

Volume/obugulumivu obutamala wansi wa threshold

Bridging Okuyungibwa okutali kwa bulijjo okw’obugulumivu bwa solder paste oburiraanye

Misalignment Okukyama kw’ekifo wakati wa solder paste ne pad kusukka range ekkirizibwa

Shape Defect 3D contour tekwatagana na model ya mutindo

5. Hardware n’ebikwata ku nsonga eno

📌 Enkola y'amaaso

Ensibuko ya layisi: 650nm layisi emmyufu, obutuufu ±1μm (Z ekisiki), ±5μm (X/Y ekisiki).

Kkamera: CCD ya 12MP ey’obulungi obw’amaanyi, ewagira okusika ku sipiidi ey’amaanyi.

Ensibuko y’ekitangaala: Multi-angle ring LED + coaxial light, ekyukakyuka ku PCB surfaces ez’enjawulo (high reflective, matte).

📌 Ensengeka y'ebyuma

Enkola y’entambula: motor ya linear ey’obutuufu obw’amaanyi, obutuufu bw’okuteeka mu kifo ekiddibwamu ±3μm.

Fuleemu: Aluminum alloy ya high-rigidity, anti-vibration design okukakasa nti enywevu.

Autofocus: okutuukagana n'obuwanvu bwa PCB obw'enjawulo (0.2mm ~ 6mm).

📌 Ebikwata ku by'ekikugu

Ebipimo BF-3Si-L2 Ebikwata ku

Obutuufu bw’okuzuula (Z axis) ±1μm

Sipiidi y’okuzuula Okutuuka ku 600mm/s (olutindo lumu), mode y’olutindo ebiri eky’okwesalirawo

Ekitundu ekitono eky’okuzuula 01005 (0.4mm × 0.2mm)

PCB sayizi ya 50mm × 50mm ~ 510mm × 460mm

Enkola y’empuliziganya SECS/GEM, TCP/IP, RS-232

Amaanyi ageetaagisa AC 200-240V, 50/60Hz

6. Mu bufunze

SAKI BF-3Si-L2 3D SPI egaba layini z’okufulumya SMT n’obutuufu obw’amaanyi, obulungi ennyo, n’okuzuula alamu ey’obulimba entono solder paste solutions okuyita mu laser + structured light dual 3D imaging, AI intelligent algorithm ne tekinologiya wa sikaani ey’amaanyi. Omugaso gwayo omukulu guli mu:

Okuziyiza obulema mu kusoda: okukwata obulema nga tonnaba kuddamu kukola solder n’okukendeeza ku ssente ezisaasaanyizibwa mu kuddamu okukola.

Okulongoosa enkola y’okufuga: okulongoosa enkola z’okukuba ebitabo okuyita mu data ya SPC mu kiseera ekituufu.

Okukwatagana n’ebyetaago eby’omu maaso: okuwagira ebitundu ebitonotono (01005, 0.3mm BGA) ne layini z’okufulumya ezitabuddwa ennyo.

Amakolero agasemba:

✔ Ebyuma ebikozesebwa mu byuma bikalimagezi (amasimu, tabuleti) .

✔ Ebyuma ebikozesebwa mu mmotoka (ADAS, ECU) .

✔ Okukola ebintu eby’omulembe