SAKI smt 3d spi machine BF-3Si-L2

I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D ephambili (i-3D SPI, i-Solder Paste Inspection) eyenzelwe i-SMT yanamhlanje (i-surface mount technology) imigca yokuvelisa. Isebenzisa iteknoloji ye-imaging ye-3D ephezulu yokuchaneka ngokukhawuleza nangokuchanekileyo ukufumanisa umgangatho wokushicilela we-solder paste ngaphambi kokuba i-reflow soldering, kubandakanywa neeparitha eziphambili ezifana nomthamo, ukuphakama, indawo, i-offset, njl., ukwenzela ukukhusela ngokufanelekileyo iziphene ze-soldering kunye nokuphucula imveliso yemveliso.

2. Iinzuzo eziphambili

✅ Ukubonwa kokuchaneka okuphezulu kakhulu

Umlinganiselo wenqanaba leMicron: Ukuchaneka kwe-Z-axis (ubude) kunokufikelela kwi-±1μm, ilungele amacandelo epitch e-ultra-fine njenge-01005 kunye ne-0.3mm pitch BGA.

Imodeli ye-3D epheleleyo: Ngokuskena i-angle-angle eninzi, umthamo, ukuphakama, kunye nokumila kwe-solder paste kubalwa ngokuchanekileyo ukuphepha ingxaki ye-misjudgment yendabuko ye-2D SPI.

✅ Ukufunyanwa kwesantya esiphezulu, esifanelekileyo kwimigca yokuvelisa ephezulu

Isantya sokubona sifikelela kwi-600mm / s, kwaye imodi yeendlela ezimbini ixhaswa ukuhlangabezana neemfuno zemigca yokuvelisa i-SMT ephezulu (njengeefowuni eziphathwayo kunye nemigca yokuvelisa i-automotive electronics).

I-algorithm yokulawula intshukumo ekrelekrele inciphisa ukungcangcazela koomatshini kwaye iqinisekisa uzinzo lokuskena.

✅ I-algorithm yobukrelekrele yehlisa isantya se-alam yobuxoki

Ukufunda okunzulu kwe-AI: ngokuzenzekelayo ilungiselela iiparameters zokubona ukuze ziqhelanise neentlobo ezahlukeneyo zokuncamathisela i-solder (ezifana nelothe/i-lead-free, amanzi-washable/clean-free).

Uhlalutyo lwe-Adaptive threshold: kunciphisa ukugwetywa okubangelwa kukubonakalisa i-PCB kunye nokwahlukana kombala.

✅ Uyilo lwemodyuli, ukwandiswa okuguquguqukayo

Ukhetho lwemodyuli yokucoca ngokuzenzekelayo ukunciphisa impembelelo yentsalela ye-solder paste ekubhaqweni.

Inkxaso yonxibelelwano ne-AOI, umatshini wokubeka, kunye nenkqubo ye-MES ukufikelela kulawulo oluvaliweyo lwemveliso ekrelekrele.

3. Umgaqo wobugcisa

📌 Itekhnoloji yokucinga ye-3D

I-BF-3Si-L2 yamkela itekhnoloji ephindwe kabini ye-laser triangulation + ingqikelelo yokukhanya eyakhiwe:

Ukuskena kweLaser: Umgca welaser ochanekileyo uqikelelwa kwindawo yokuncamathelisa i-solder, kwaye ukukhanya okubonakalisiweyo kubanjwe yikhamera yeCCD ukubala idatha yobude.

Uncedo lokukhanya olucwangcisiweyo: Intelekelelo yokukhanya kwemigca emininzi iphucula isakhono sokubuyiselwa kwecontour ye-3D yeepads ezintsonkothileyo (ezifana neBGA, QFN).

📌 Inkqubo yokuhlola

Ukuma kwe-PCB: Ukuchaneka okuphezulu kwe-linear motor drive ukuqinisekisa indawo echanekileyo yokuskena.

Ukuskena kwe-3D: I-Laser + ukukhanya okucwangcisiweyo kuqokelela idatha yokuncamathisela ye-solder.

Uhlalutyo lwe-AI: Thelekisa imodeli yokuncamathisela ye-solder ukuchonga iziphene ezifana ne-solder enganelanga, i-bridging, i-offset, kunye nokumila okungaqhelekanga.

Ingxelo yedatha: Yenza iingxelo ze-SPC ngexesha lokwenyani ukukhokela inkqubo yoshicilelo.

4. Imisebenzi engundoqo

🔹 Ukuchongwa kweparamitha ye-3D yokuncamathisela kwesolder

Umthamo: Qinisekisa ukuba inani le-solder paste lidibana nomgangatho wokuphepha ukudibanisa okubandayo okanye iisekethe ezimfutshane.

Ubude: Khangela ukufana kwencama ye-solder ukuthintela ukuwa okanye ukubumba kakubi.

Indawo: Hlalutya ukhuselo lwesolder paste kwaye uchonge i-offset okanye i-diffusion anomalies.

Ubume: Khangela iimilo ezingaqhelekanga ezifana neengcebiso zokutsala kunye nokudakumba.

🔹 Ukukwazi ukubona isiphene

Uhlobo lwesiphene umgaqo wokufunyanwa

Umthamo onganelanga/ubude obungaphantsi komqobo

Ukuvala Uqhagamshelo olungaqhelekanga lokuphakama kwencama ye-solder ekufutshane

Ulungelelwaniso olungalunganga Indawo yokutenxa phakathi kwe-solder paste kunye ne-pad idlula uluhlu oluvumelekileyo

I-Shape Defect 3D contour ayihambelani nemodeli eqhelekileyo

5. Hardware kunye neenkcukacha

📌 Inkqubo yokubona

Umthombo weLaser: 650nm i-laser ebomvu, ukuchaneka ± 1μm (i-axis Z), ± 5μm (i-X / Y axis).

Ikhamera: I-CCD enesisombululo esiphakamileyo se-12MP, ixhasa ukuskena ngesantya esiphezulu.

Umthombo wokukhanya: I-Multi-angle ring LED + ukukhanya kwe-coaxial, ukulungelelaniswa kwiindawo ezahlukeneyo ze-PCB (i-high reflective, matte).

📌 Ubume bomatshini

Inkqubo eshukumayo: i-high-precision linear motor, ukuchaneka kokubeka okuphindaphindiweyo ± 3μm.

Isakhelo: Ukuqina okuphezulu kwe-aluminium alloy, i-anti-vibration design ukuqinisekisa ukuzinza.

I-Autofocus: ihambelana nobukhulu be-PCB eyahlukeneyo (0.2mm ~ 6mm).

📌 IiNgcaciso zobuGcisa

IiParameters BF-3Si-L2 Iinkcukacha

Ukuchaneka kokufunyanwa (umgca we-Z) ±1μm

Isantya sokubona Ukuya kuthi ga kwi-600mm / s (ingoma enye), imowudi yomkhondo emibini

Ubuncinci becandelo lobhaqo 01005 (0.4mm × 0.2mm)

PCB ubukhulu uluhlu 50mm × 50mm ~ 510mm × 460mm

Unxibelelwano lonxibelelwano lwe-SECS/GEM, TCP/IP, RS-232

Imfuno yamandla AC 200-240V, 50/60Hz

6. Isishwankathelo

I-SAKI BF-3Si-L2 3D SPI ibonelela ngemigca yemveliso ye-SMT ngokuchaneka okuphezulu, ukusebenza kakuhle, kunye nezisombululo zokubona ukucolwa kwe-alaser yobuxoki ephantsi nge-laser + ukukhanya okucwangcisiweyo okuphindwe kabini kumfanekiso we-3D, i-algorithm ehlakaniphile ye-AI kunye ne-high-speed scanning technology. Ixabiso layo eliphambili liku:

Ukuthintela iziphene ze-solder: ukunqanda iziphene ngaphambi kokuba i-reflow soldering kunye nokunciphisa iindleko zokuphinda zisebenze.

Ukuphucula ulawulo lwenkqubo: ukulungisa iiparamitha zoshicilelo ngedatha ye-SPC yexesha langempela.

Ukulungelelanisa kwiimfuno zexesha elizayo: inkxaso ye-miniaturized components (01005, 0.3mm BGA) kunye nemigca yokuvelisa umxube ophezulu.

Amashishini acetyiswayo:

✔ Ii-elektroniki zabathengi (iifowuni eziphathwayo, iitafile)

✔ Iimoto ze-elektroniki (ADAS, ECU)

✔ Imveliso ephezulu