SAKI smt 3d spi makina BF-3Si-L2

SAKI BF-3Si-L2 ndi makina apamwamba oyendera 3D solder paste (3D SPI, Solder Paste Inspection) yopangidwira mizere yamakono ya SMT (surface mount technology). Amagwiritsa ntchito luso lojambula bwino kwambiri la 3D kuti azindikire mwamsanga komanso molondola kusindikiza kwa phala la solder pamaso pa reflow soldering, kuphatikizapo magawo ofunikira monga voliyumu, kutalika, dera, kuchepetsa, ndi zina zotero, kuti muteteze bwino kuwonongeka kwa soldering ndi kukonza zokolola.

2. Ubwino waukulu

✅ Kuzindikira kolondola kwambiri

Muyezo wa mulingo wa Micron: Kulondola kwa Z-axis (kutalika) kumatha kufika ± 1μm, koyenera zigawo zamtundu wa Ultra-fine monga 01005 ndi 0.3mm pitch BGA.

Full 3D modeling: Kupyolera mu kusanthula kosiyanasiyana, kuchuluka, kutalika, ndi mawonekedwe a solder phala amawerengedwa molondola kuti apewe vuto lachiganizo lolakwika la chikhalidwe cha 2D SPI.

✅ Kuzindikira kothamanga kwambiri, koyenera mizere yopangira zinthu zambiri

Kuthamanga kwadzidzidzi kumafika ku 600mm / s, ndipo njira zapawiri zimathandizidwa kuti zikwaniritse zosowa za mizere yothamanga kwambiri ya SMT (monga mafoni a m'manja ndi mizere yopangira zamagetsi zamagetsi).

Anzeru mayendedwe a aligorivimu amachepetsa kugwedezeka kwamakina ndikuwonetsetsa kukhazikika kwa sikani.

✅ Algorithm yanzeru imachepetsa ma alarm abodza

Kuphunzira mwakuya kwa AI: imapangitsa kuti zizindikilo zitheke kuti zigwirizane ndi mitundu yosiyanasiyana ya ma solder (monga lead/lead-free, madzi osasamba/oyera).

Kusanthula kwa Adaptive threshold: kumachepetsa kuganiziridwa molakwika chifukwa cha mawonekedwe a PCB komanso kusiyana kwamitundu.

✅ Mapangidwe amtundu, kukulitsa kosinthika

Mwasankha basi kuyeretsa gawo kuti muchepetse kukhudzidwa kwa zotsalira za solder pakudziwika.

Thandizani kulumikizana ndi AOI, makina oyika, ndi makina a MES kuti mukwaniritse kuwongolera kosatsekeka kwa opanga mwanzeru.

3. mfundo zaumisiri

📌 Ukadaulo wojambula wa 3D

BF-3Si-L2 imatengera ukadaulo wapawiri wa laser triangulation + kuwala kowoneka bwino:

Kusanthula kwa Laser: Mzere wolondola kwambiri wa laser umawonetsedwa pamtunda wa solder, ndipo kuwala kowonekera kumajambulidwa ndi kamera ya CCD kuti iwerengere kutalika kwa data.

Thandizo lopanga kuwala: Kuwoneka kowala kwa mizere ingapo kumakulitsa luso lobwezeretsanso ma contour a 3D a mapadi ovuta (monga BGA, QFN).

📌 Njira yoyendera

Kuyika kwa PCB: Kuyendetsa bwino kwambiri kwa liniya yamagalimoto kuti muwonetsetse malo olondola.

Kusanthula kwa 3D: Laser + yowunikira yopangidwa mwadongosolo imasonkhanitsa deta ya solder phala.

Kusanthula kwa AI: Fananizani mitundu yokhazikika ya solder kuti muzindikire zolakwika monga kusakwanira kwa solder, bridging, offset, ndi mawonekedwe achilendo.

Ndemanga za data: Pangani malipoti a SPC munthawi yeniyeni kuti muwongolere kukhathamiritsa kwa ntchito yosindikiza.

4. Ntchito zazikulu

🔹 Kuzindikira kwa magawo a 3D a phala la solder

Voliyumu: Onetsetsani kuti kuchuluka kwa phala la solder kukugwirizana ndi muyezo kuti mupewe kuzizira kapena mabwalo amfupi.

Utali: Zindikirani kufanana kwa phala la solder kuti musagwe kapena kusawumba bwino.

Dera: Unikani kuphimba kwa solder phala ndikuzindikira zolakwika kapena zosokoneza.

Mawonekedwe: Zindikirani mawonekedwe osakhazikika monga nsonga zokoka ndi ma depressions.

🔹 Kutha kuzindikira zolakwika

Kuzindikira mtundu wa vuto

Kusakwanira kwa Voliyumu/utali pansi pa malire

Kulunzanitsa Kulumikizana kosakhazikika kwa ma solder paste oyandikana nawo

Kupatuka kwa malo pakati pa solder phala ndi pad kumapitilira mulingo wololeka

Shape Defect 3D contour sagwirizana ndi mtundu wamba

5. Zida ndi mafotokozedwe

📌 Optical system

Gwero la laser: 650nm laser yofiira, yolondola ± 1μm (Z olamulira), ± 5μm (X/Y olamulira).

Kamera: CCD 12MP yokhala ndi mawonekedwe apamwamba, imathandizira kusanthula kothamanga kwambiri.

Gwero lowala: Mphete yamitundu yambiri ya LED + coaxial kuwala, yosinthika kumadera osiyanasiyana a PCB (yowoneka bwino kwambiri, matte).

📌 Kapangidwe ka makina

Zoyenda dongosolo: mkulu-mwatsatanetsatane liniya galimoto, repeatable malo olondola ± 3μm.

Frame: Aluminiyamu yolimba kwambiri, kapangidwe ka anti-vibration kuonetsetsa bata.

Autofocus: igwirizane ndi makulidwe osiyanasiyana a PCB (0.2mm ~ 6mm).

📌 Mafotokozedwe aukadaulo

Ma Parameters BF-3Si-L2

Kuzindikira kolondola (Z axis) ±1μm

Kuthamanga kozindikira Kufikira 600mm / s (nyimbo imodzi), njira yapawiri yosankha

Osachepera kuzindikira gawo 01005 (0.4mm × 0.2mm)

PCB kukula osiyanasiyana 50mm × 50mm ~ 510mm × 460mm

Kuyankhulana kwa SECS/GEM, TCP/IP, RS-232

Zofunikira zamagetsi AC 200-240V, 50/60Hz

6. Mwachidule

SAKI BF-3Si-L2 3D SPI imapereka mizere yopangira ma SMT yolondola kwambiri, yogwira ntchito kwambiri, komanso njira zodziwira ma alarm abodza otsika kudzera pazithunzithunzi zapawiri za 3D za laser +, algorithm yanzeru ya AI komanso ukadaulo wowunikira kwambiri. Phindu lake lalikulu lagona mu:

Kupewa kuwonongeka kwa soldering: kutsekereza zolakwika musanayambe kugulitsanso ndikuchepetsa ndalama zogwirira ntchito.

Kuwongolera njira zowongolera: kukhathamiritsa magawo osindikiza kudzera mu data yeniyeni ya SPC.

Sinthani ku zosowa zamtsogolo: thandizirani magawo ang'onoang'ono (01005, 0.3mm BGA) ndi mizere yosakanikirana kwambiri.

Makampani ovomerezeka:

✔ Consumer electronics (mafoni am'manja, mapiritsi)

✔ Zamagetsi zamagalimoto (ADAS, ECU)

✔ Kupanga kwapamwamba