Saki 3D AOI imashini 3Di MD2

Kubireba ibisobanuro, imikorere, ibiranga nibyiza bya Saki AOI 3Di MD2, ibikurikira nincamake yuzuye ishingiye kumakuru rusange hamwe ninganda zisanzwe (Icyitonderwa: ibipimo byihariye birashobora gutandukana bitewe na verisiyo cyangwa iboneza, birasabwa kohereza amakuru aheruka yemewe):

1. Ibisobanuro by'ibanze

Icyitegererezo: SAKI 3Di MD2

Ubwoko: ibikoresho bya 3D byikora optique yo kugenzura (AOI)

Gusaba: Kugenzura ubuziranenge bwibibaho byumuzunguruko (PCB) inteko (SMT / DIP inzira)

Ubuhanga bwo gutahura: tekinoroji ya 3D stereo yerekana amashusho, ihujwe nisoko ryumucyo mwinshi hamwe na kamera ihanitse.

2. Imikorere yibanze

Kugurisha 3D kugurisha hamwe:

Binyuze mu bice byinshi bya laser cyangwa gusikana urumuri rwubatswe, bapima neza ibipimo nkuburebure bwumugurisha uburebure, imiterere, ingano, kandi umenye inenge nkibihuru bikonje bikonje, umugurisha udahagije, nikiraro.

Kumenya ibice:

Menya ibice byabuze, ibice bitari byo, polarite ihindagurika, offset, kurwana (ibuye ryimva), nibindi.

Guhuza:

Shyigikira ubwoko butandukanye bwa PCB (imbaho ​​zoroshye, imbaho ​​zikomeye, imbaho ​​zuzuye cyane) hamwe nibigize (kuva 0201 kugeza BGA nini).

Kumenya umuvuduko mwinshi:

Kamera yo hejuru yerekana kamera hamwe nigenzura ryihuta, ihuza nigitekerezo cyihuta cyumurongo wa SMT.

3. Ibyingenzi

Ishusho ya 3D-yuzuye neza:

Ukoresheje uburyo bwo guhinduranya icyiciro cyangwa laser triangulation, imyanzuro irashobora kugera kurwego rwa micron.

Sisitemu itanga urumuri rwinshi:

Gukomatanya amasoko yumucyo yinguni zitandukanye namabara (nkumutuku, ubururu, infragre) kugirango wongere itandukaniro.

Algorithm y'ubwenge:

Isesengura ry'amashusho rishingiye ku myigire yimbitse, kugabanya igipimo cyo gutabaza ibinyoma (Ihamagarwa ry'ibinyoma), rihuza n'ibikorwa bitandukanye.

Imigaragarire-Abakoresha:

Igishushanyo mbonera cya porogaramu, shyigikira kumurongo wigana no gucunga resept, kugabanya umurongo uhindura igihe.

4. Ibyiza bya tekiniki

Ugereranije na gakondo 2D AOI:

Ibicuruzwa byukuri byagurishijwe hamwe: tekinoroji ya 3D irashobora kugereranya umubare wabagurishije kandi ikirinda guca urubanza 2D ruterwa nibara cyangwa igicucu.

Kumenyera ibice bigoye: ingaruka nziza yo gutahura kubipfunyika bwinshi (nka QFN, PoP) nibice byihariye.

Uhujwe na SPI (ibikoresho byo kugenzura ibicuruzwa byagurishijwe):

Urashobora guhuzwa namakuru yo hejuru ya SPI kugirango asesengure isano itera hagati yo kugurisha paste yo kugurisha hamwe nubucuruzi bwa nyuma bugurishwa.

Gukurikirana amakuru:

Shyigikira kubika amakuru yo kubika no gusesengura imibare (nka CPK, ikarita yo gukwirakwiza inenge), kugirango ifashe inzira nziza.

5. Ibisanzwe byo gusaba

SMT inyuma-gutahura: kugenzura byuzuye cyangwa bidasubirwaho PCB nyuma yo kugurisha ibicuruzwa.

Automotive electronics: ikibaho gifite ibisabwa byizewe cyane (nka ECU, modules ya ADAS).

Ubuvuzi / ikirere: Wuzuze amahame akomeye nka IPC-A-610 Icyiciro cya 3.

6. Imirimo yinyongera (iboneza ridahinduka)

Dual-track detection: Gushyigikira inzira-ebyiri zibangikanye kugirango zongere ubushobozi bwumusaruro.

AI kwiyigisha: Gukomeza kunonosora algorithms ukoresheje amakuru yamateka.

Kwipimisha kure: Shyigikira imiyoboro ya IoT kugirango ugere kure no kuburira amakosa.

Inyandiko

Inkunga y'abakora: SAKI Corporation (Ubuyapani) itanga ibisubizo byabigenewe, kandi imikorere nyayo igomba gushyirwaho ukurikije umurongo utanga umusaruro.

Ibyifuzo byo kugenzura: Birasabwa kugenzura urwego ruhuye hagati yibikoresho nibicuruzwa byihariye binyuze mu kizamini cya Demo.

Niba ukeneye ibisobanuro birambuye (nkumuvuduko wo gutahura, ingano ntoya yo gutahura, nibindi), birasabwa kuvugana numuyobozi wa SAKI cyangwa itsinda rya tekinike rya Xinling kugirango utange ibyangombwa bya tekiniki.