Saki 3D AOI machine 3Di MD2

Regarding the specifications, functions, features and advantages of Saki AOI 3Di MD2, the following is a comprehensive summary based on public information and common industry standards (Note: specific parameters may vary depending on the version or configuration, it is recommended to refer to the latest official information):

1. Basic specifications

Model: SAKI 3Di MD2

Type: 3D automatic optical inspection equipment (AOI)

Application: Quality inspection of printed circuit board (PCB) assembly (SMT/DIP process)

Detection technology: 3D stereo imaging technology, combined with multi-angle light source and high-resolution camera.

2. Core functions

3D solder joint detection:

Through multi-axis laser or structured light scanning, accurately measure parameters such as solder joint height, shape, volume, and identify defects such as cold solder joints, insufficient solder, and bridges.

Component detection:

Detect missing components, wrong parts, reverse polarity, offset, warping (tombstone), etc.

Compatibility:

Supports a variety of PCB types (flexible boards, rigid boards, high-density boards) and components (from 0201 to large BGA).

High-speed detection:

High frame rate camera with fast motion control, adapt to the rhythm of high-speed SMT production line.

3. Main features

High-precision 3D imaging:

Using phase shift method or laser triangulation, the resolution can reach micron level.

Multi-light source system:

Combining light sources of different angles and colors (such as red, blue, infrared) to enhance defect contrast.

Intelligent algorithm:

Image analysis based on deep learning, reducing false alarm rate (False Call), adaptive to different process standards.

User-friendly interface:

Graphical programming interface, support offline simulation and recipe management, shorten line change time.

4. Technical advantages

Compared with traditional 2D AOI:

More accurate solder joint detection: 3D technology can quantify the amount of solder and avoid 2D misjudgment caused by color or shadow.

Adapt to complex components: better detection effect for high-density packaging (such as QFN, PoP) and special-shaped components.

Linked with SPI (solder paste inspection equipment):

Can be associated with upstream SPI data to analyze the causal relationship between solder paste printing and final solder joint quality.

Data traceability:

Supports detection data storage and statistical analysis (such as CPK, defect distribution map), to help process optimization.

5. Typical application scenarios

SMT back-end detection: full or random inspection of PCB after reflow soldering.

Automotive electronics: boards with high reliability requirements (such as ECU, ADAS modules).

Medical/aerospace: Meet strict standards such as IPC-A-610 Class 3.

6. Additional functions (optional configuration)

Dual-track detection: Supports dual-track parallel detection to improve production capacity.

AI self-learning: Continuously optimizes detection algorithms through historical data.

Remote diagnosis: Supports IoT networking to achieve remote maintenance and fault warning.

Notes

Manufacturer support: SAKI Corporation (Japan) provides customized solutions, and the actual performance needs to be configured according to production line requirements.

Verification suggestions: It is recommended to verify the matching degree between the equipment and the specific product through Demo testing.

If you need more detailed parameters (such as detection speed, minimum detection size, etc.), it is recommended to contact SAKI official or the Xinling technical team directly to provide technical documents.