Ku bikwata ku nsengeka, emirimu, ebikozesebwa n’ebirungi bya Saki AOI 3Di MD2, bino wammanga bye bifunze ebijjuvu nga byesigamiziddwa ku mawulire ag’olukale n’omutindo gw’amakolero ogwa bulijjo (Weetegereze: ebipimo ebitongole biyinza okwawukana okusinziira ku nkyusa oba ensengeka, kirungi okujuliza amawulire amatongole agasembyeyo):
1. Ebikwata ku nsonga enkulu
Omutindo gwa mmotoka: SAKI 3Di MD2
Ekika: Ebyuma ebikebera amaaso mu ngeri ya 3D (AOI)
Okukozesa: Okukebera omutindo gw’okukuŋŋaana kwa printed circuit board (PCB) (enkola ya SMT/DIP)
Tekinologiya w’okuzuula: Tekinologiya w’okukuba ebifaananyi mu ngeri ya 3D stereo, ng’agattiddwa wamu n’ensibuko y’ekitangaala eky’enkoona nnyingi ne kkamera ey’obulungi obw’amaanyi.
2. Emirimu emikulu
Okuzuula ekiyungo kya solder mu ngeri ya 3D:
Okuyita mu layisi ya multi-axis oba structured light scanning, pima bulungi parameters nga solder joint height, shape, volume, era ozuule ebikyamu nga cold solder joints, structured solder joint, ne bridges.
Okuzuula ebitundu:
Zuula ebitundu ebibulamu, ebitundu ebikyamu, reverse polarity, offset, warping (tombstone), n’ebirala.
Okukwatagana:
Awagira ebika bya PCB eby’enjawulo (ebipande ebikyukakyuka, ebipande ebikalu, ebipande ebirina density enkulu) n’ebitundu (okuva ku 0201 okutuuka ku BGA ennene).
Okuzuula ku sipiidi ey’amaanyi:
High frame rate camera nga erina fast motion control, ekwatagana n'ennyimba za high-speed SMT production line.
3. Ebintu ebikulu ebirimu
Ebifaananyi bya 3D ebituufu ennyo:
Nga tukozesa enkola ya phase shift oba laser triangulation, okusalawo kuyinza okutuuka ku ddaala lya micron.
Enkola y’ensibuko y’ekitangaala ekingi:
Okugatta ensibuko z’ekitangaala ez’enkoona ne langi ez’enjawulo (nga emmyufu, bbululu, infrared) okutumbula enjawulo y’obulema.
Enkola ey’amagezi:
Okwekenenya ebifaananyi nga kwesigamiziddwa ku kuyiga okw’amaanyi, okukendeeza ku muwendo gwa alamu ey’obulimba (False Call), okutuukagana n’omutindo gw’enkola ogw’enjawulo.
Enkola enyangu okukozesa:
Graphical programming interface, okuwagira okusiiga okutali ku mutimbagano n’okuddukanya enkola, okukendeeza ku budde bw’okukyusa layini.
4. Enkizo mu by’ekikugu
Bw’ogeraageranya ne 2D AOI ey’ennono:
Okuzuula ekiyungo kya solder mu ngeri entuufu: Tekinologiya wa 3D asobola okugera obungi bwa solder n’okwewala okusalawo obubi mu 2D okuva ku langi oba ekisiikirize.
Adapt to complex components: better detection effect for high-density packaging (nga QFN, PoP) n’ebitundu eby’enkula ey’enjawulo.
Ekwatagana ne SPI (ebyuma ebikebera solder paste):
Kiyinza okukwatagana ne upstream SPI data okwekenneenya enkolagana evuddeko wakati w’okukuba ebitabo mu solder paste n’omutindo gw’ekiyungo kya solder ekisembayo.
Okulondoola data:
Awagira okutereka data y’okuzuula n’okwekenneenya ebibalo (nga CPK, maapu y’okusaasaanya obulema), okuyamba okulongoosa enkola.
5. Ensonga eza bulijjo ez’okukozesa
SMT back-end detection: okwekebejja mu bujjuvu oba mu ngeri ey’ekifuulannenge PCB oluvannyuma lw’okuddamu okusolder.
Ebyuma ebikozesebwa mu mmotoka: obubaawo obulina ebyetaago eby’okwesigamizibwa eby’amaanyi (nga ECU, ADAS modules).
Eby’obujjanjabi/eby’omu bbanga: Tuukirira omutindo omukakali nga IPC-A-610 Class 3.
6. Emirimu egy’enjawulo (okusengeka okw’okwesalirawo) .
Dual-track detection: Ewagira okuzuula parallel-track bbiri okulongoosa obusobozi bw’okufulumya.
AI okweyiga: Bulijjo elongoosa enkola z’okuzuula okuyita mu data ey’ebyafaayo.
Okuzuula okuva ewala: Kuwagira emikutu gya IoT okutuuka ku ndabirira okuva ewala n’okulabula ensobi.
Ebiwandiiko
Obuwagizi bw’abakola: SAKI Corporation (Japan) egaba eby’okugonjoola ebituufu, era omulimu gwennyini gwetaaga okutegekebwa okusinziira ku byetaago bya layini y’okufulumya.
Ebiteeso by’okukakasa: Kirungi okukakasa diguli y’okukwatagana wakati w’ebyuma n’ekintu ekigere ng’oyita mu kugezesa kwa Demo.
Bw’oba weetaaga ebipimo ebisingawo ebikwata ku nsonga (nga sipiidi y’okuzuula, obunene bw’okuzuula obutono, n’ebirala), kirungi okutuukirira omukungu wa SAKI oba ttiimu y’ebyekikugu eya Xinling butereevu okuwa ebiwandiiko eby’ekikugu.