Saki 3D AOI machine 3Di MD2

Ngokuphathelele ukucaciswa, imisebenzi, iimpawu kunye neenzuzo ze-Saki AOI 3Di MD2, oku kulandelayo sisishwankathelo esibanzi esisekelwe kulwazi loluntu kunye nemigangatho yoshishino eqhelekileyo (Qaphela: iiparamitha ezithile zinokwahluka ngokuxhomekeke kuguqulelo okanye uqwalaselo, kuyacetyiswa ukuba ubhekisele kulwazi lwamva nje olusemthethweni):

1. Iinkcukacha ezisisiseko

Umzekelo: SAKI 3Di MD2

Uhlobo: Isixhobo sokuhlola esizenzekelayo se-3D (AOI)

Isicelo: Ukuhlolwa komgangatho webhodi yesekethe eprintiweyo (PCB) assembly (SMT/DIP process)

Itekhnoloji yokufumanisa: Itekhnoloji ye-3D ye-stereo imaging, edityaniswe nomthombo wokukhanya we-multi-angle kunye nekhamera enesisombululo esiphezulu.

2. Imisebenzi engundoqo

Ukufunyanwa ngokudibeneyo kwe-solder ye-3D:

Ngokusebenzisa i-laser ye-multi-axis okanye ukuskena kokukhanya okucwangcisiweyo, ukulinganisa ngokuchanekileyo iiparamitha ezinjengobude bejoyinti le-solder, imilo, umthamo, kunye nokuchonga iziphene ezinje ngokubanda kwe-solder, i-solder engonelanga, kunye neebhulorho.

Ukufunyanwa kwelungu:

Khangela izinto ezingekhoyo, iindawo ezingalunganga, i-polarity ebuyela umva, i-offset, i-warping (ilitye lengcwaba), njl.

Ukuhambelana:

Ixhasa iintlobo ngeentlobo zePCB (iibhodi eziguquguqukayo, iibhodi eziqinileyo, iibhodi ezinoxinano oluphezulu) kunye namacandelo (ukusuka ku-0201 ukuya kwi-BGA enkulu).

Ukubona ngesantya esiphezulu:

Ikhamera yezinga eliphezulu lekhamera kunye nokulawula ukunyakaza okukhawulezayo, ukulungelelanisa kwisigqi somgca wemveliso ye-SMT ephezulu.

3. Iimpawu eziphambili

Ukuchaneka okuphezulu komfanekiso we-3D:

Ukusebenzisa indlela yokutshintsha kwesigaba okanye i-laser triangulation, isisombululo sinokufikelela kwinqanaba le-micron.

Inkqubo yomthombo wokukhanya okuninzi:

Ukudibanisa imithombo yokukhanya yee-engile ezahlukeneyo kunye nemibala (efana nobomvu, ibhlowu, i-infrared) ukunyusa umahluko osisiphene.

I-algorithm ekrelekrele:

Uhlalutyo lomfanekiso olusekelwe ekufundeni okunzulu, ukunciphisa izinga le-alarm yobuxoki (Umnxeba ongeyonyani), ukulungelelaniswa nemigangatho yenkqubo eyahlukeneyo.

Ujongano olusebenziseka lula:

Ujongano lwenkqubo yomzobo, ukuxhasa ukulinganisa ngaphandle kweintanethi kunye nolawulo lweresiphi, mfutshane ixesha lokutshintsha umgca.

4. Iinzuzo zobugcisa

Xa kuthelekiswa ne-2D AOI yemveli:

Ukufunyanwa kwe-solder echanekileyo ngakumbi: Itekhnoloji ye-3D inokulinganisa inani le-solder kwaye igweme ukugwetywa kakubi kwe-2D okubangelwa ngumbala okanye isithunzi.

Ukulungelelanisa kumacandelo anzima: isiphumo esingcono sokufumanisa ukupakisha okuphezulu (okufana ne-QFN, i-PoP) kunye nezixhobo ezikhethekileyo.

Idityaniswe ne-SPI (isixhobo sokuhlola i-solder paste):

Inokudityaniswa nedatha ye-SPI enyukayo ukuhlalutya ubudlelwane be-causal phakathi koshicilelo lwe-solder paste kunye nomgangatho odibeneyo we-solder.

Ukulandelelwa kwedatha:

Ixhasa ukugcinwa kwedatha yokufumanisa kunye nohlalutyo lwezibalo (ezifana ne-CPK, imephu yokusabalalisa isiphene), ukunceda inkqubo yokuphucula.

5. Iimeko zesicelo esiqhelekileyo

Ukubonwa kwe-SMT ngasemva: ukuhlolwa okupheleleyo okanye okungahleliwe kwe-PCB emva kokuphinda kufakwe i-soldering.

I-elektroniki ye-Automotive: iibhodi ezineemfuno eziphezulu zokuthembeka (ezifana ne-ECU, iimodyuli ze-ADAS).

Unyango/i-aerospace: Dibana nemigangatho engqongqo efana ne-IPC-A-610 iClass 3.

6. Imisebenzi eyongezelelweyo (uqwalaselo olukhethwayo)

Ukufunyanwa kweendlela ezimbini: Ixhasa ukufunyanwa kweendlela ezimbini ezihambelanayo ukuphucula umthamo wemveliso.

Ukuzifundela kwe-AI: Ukwandisa ngokuqhubekayo i-algorithms yokufumanisa ngokusebenzisa idatha yembali.

Ukuxilongwa okude: Ixhasa uthungelwano lwe-IoT ukufezekisa ukugcinwa kude kunye nesilumkiso sesiphoso.

Amanqaku

Inkxaso yomvelisi: I-SAKI Corporation (eJapan) ibonelela ngezisombululo ezilungelelanisiweyo, kwaye owona msebenzi ufuneka uqwalaselwe ngokweemfuno zomgca wemveliso.

Iingcebiso zokuqinisekisa: Kucetyiswa ukuba uqinisekise idigri ehambelanayo phakathi kwesixhobo kunye nemveliso ethile ngovavanyo lweDemo.

Ukuba ufuna iiparameters ezineenkcukacha ezininzi (ezifana nesantya sobhaqo, ubuncinci bobungakanani bokubona, njl.njl.), kuyacetyiswa ukuba uqhagamshelane negosa le-SAKI okanye iqela lezobugcisa le-Xinling ngqo ukunika amaxwebhu obugcisa.