EN
id
sk
sr
sv
it
pt
bn
ms
be
nl
fr
th
vi
ru
ja
ko
de
hy
az
bs
bg
my
cs
da
dv
el
et
fil
fi
ga
gl
gn
he
hi
km
hr
hu
is
kn
rw
lo
lv
lt
lb
lg
mi
mt
ne
no
ny
or
om
per
pl
ro
sa
so
es
sw
ta
tr
uk
ur
cy
xh
Turret Test and Vision Handler
ASM Pacific Technology Turret Wafer Level Test System SUNBIRD
SUNBIRD provides an efficient, reliable and flexible wafer testing solution for the semiconductor industry through innov...
Electrical Test and Optical Inspection
Turret Test and Vision Handler Systems
A turret test and vision handler combines semiconductor electrical test, optical inspection, defect classification and production sorting on one configurable platform. The correct system depends on the package surfaces that must be inspected, the electrical test requirement, the input and output media and the camera, lighting, software and test stations installed on the machine.
Defect-First Selection
Start With the Defects You Must Detect
Vision capability should be selected from the package, defect type and quality gate, not from the number of cameras alone. Leaded devices, WLCSP, sensors and power packages may require different optics, lighting, image angles and measurement algorithms.
Marking
Characters, logo and code quality
Confirm OCR or code reading, contrast, missing marks, position and verification after laser marking.
Package
Surface and molding defects
Evaluate scratches, contamination, flash, chipping, cosmetic limits and visible evidence of molding defects.
Leads / Pads
Electrical contact surfaces
Inspect lead damage, pad contamination, bent terminals, pitch, coplanarity and dimensional tolerance.
Hidden Risk
Microcrack or subsurface inspection
Some applications require infrared or other specialized methods rather than standard visible-light imaging.
Inspection Coverage
Define Which Surfaces and Features Must Be Verified
Inspection scope is not a fixed machine sequence. Select the required surfaces, measurements and packing checks first, then verify that the supplied handler includes the necessary camera positions, optics, lighting and software licenses.
Identity
Mark and Code
Characters, 1D or 2D code, orientation and traceability.
Top Surface
Package Surface
Contamination, molding defects, damage and cosmetic anomalies.
Bottom Surface
Pad and Lead
Pad quality, lead condition, deformation and contamination.
Side Surface
Sidewall
Chipping, cracks, flash and package-edge defects.
Geometry
2D and 3D Shape
Coplanarity, height, warpage and dimensional measurements.
Packing Check
In-Pocket Check
Orientation, pocket presence and post-seal verification.
Current Equipment
Available Turret Test and Vision Handlers
Browse the current equipment collection. Machines from the same platform may include different test stations, cameras, optics, lighting modules, inspection licenses and conversion tooling. Confirm the configuration of the individual machine before arranging an inspection trial.
Turret Test and Vision Handler
ASM MS100 Plus test handler
As an upgraded version of the MS100, the ASM MS100 Plus is also a device for chip sorting and arrangement based on wafer...
Turret Test and Vision Handler
ISMECA test handler NY20
The ISMECA NY20 (now owned by Cohu) is a 20-station rotary ultra-high-speed semiconductor testing and sorting machine
Turret Test and Vision Handler
ASMPT sorting machine MS90
ASM sorting machine MS90 is a device designed for lamp bead sorting, with efficient and accurate sorting functions. This...
Two Quality Layers
Electrical Test and Vision Inspection Answer Different Questions
A passing electrical test does not prove that the package surface, leads, marks or packing condition meet the outgoing quality requirement. The handler must coordinate both result streams without mixing their responsibilities.
Electrical Test
Does the device meet the programmed electrical or functional limits?
The answer depends on the tester, interface, contactor, test program, stable contact and the actual test stations installed on the handler.
Vision Inspection
Does the package meet the visible and measured quality criteria?
The answer depends on camera position, lens, lighting, resolution, calibration, image algorithm and inspection recipe.
Result Logic
How are electrical and optical results combined?
Sorting rules may separate electrical failure, visual failure, recheck, grade and accepted output into different bins or packaging routes.
A machine described as test-and-vision capable should still be checked for the exact tester interface, camera modules, inspection licenses, calibrated optics and result-mapping logic included with the supplied system.
Inspection Technology
Match the Inspection Stack to the Package
Vision inspection can mean a basic top-camera check or a multi-station system that measures several package surfaces and dimensions. Select the required inspection stack before comparing handler throughput.
2D
Presence, position, mark and surface inspection
Useful for orientation, printed codes, visible damage, contamination and basic dimensional checks.
3D
Height, coplanarity and topography
Used when package geometry, bump or lead height and dimensional variation influence acceptance.
Multi-Side
Top, bottom and sidewall coverage
Supports broader defect screening for leaded, leadless, WLCSP, discrete and sensor packages.
Specialized
Infrared, UV or application-specific optics
May be required for microcracks, hidden features, material contrast or package-specific inspection tasks.
Inspection Yield
Reduce False Rejects Without Hiding Real Defects
Strong inspection performance is not only a question of finding defects. It also requires stable presentation, repeatable lighting, correct calibration and a recipe that separates true failures from harmless variation.
Device presentation
Orientation, pocket position, suction stability and motion repeatability affect image consistency.
Optics and lighting
Lens, angle, intensity and wavelength must match the surface finish and defect type.
Recipe limits
Thresholds, measurement windows and classification rules should reflect the actual package standard.
Recipe change control
Record recipe versions, calibration status and approved parameter changes so results remain comparable after maintenance or product conversion.
Inspection Recipe Acceptance
Validate the Vision Recipe With Known-Good and Known-Defect Samples
Camera count and nominal resolution do not prove inspection capability. Before accepting a machine, run representative good devices, known defect samples and boundary-condition parts through the actual optics, lighting and inspection recipe.
Build a representative inspection sample set
Include normal good devices, confirmed defects, boundary-condition parts and expected variation from different lots. Cover every surface, orientation and defect family included in the acceptance standard.
Repeat the samples through the real handling cycle
Run the same samples through repeated pickup, orientation, indexing and imaging cycles. Check whether position changes, motion variation or prolonged operation alter the inspection result.
Review detection, false rejects and result routing
Compare expected and actual decisions, inspect stored images and measurements and confirm that pass, visual fail, recheck and uncertain results reach the correct output route.
The required defects are found repeatedly
- Known defects are detected across repeated machine cycles
- Required surfaces and defect limits are clearly documented
- Boundary-condition samples follow an approved decision rule
- Missed defects and uncertain results receive defined handling
Normal variation does not create excessive false rejects
- Good devices remain accepted after repeated handling
- Orientation and position changes do not distort the result
- Images, measurements and recipe versions remain traceable
- Electrical and optical results map to the correct outputs
Record the inspection conditions
Keep the camera, lens, lighting type, intensity, inspection region, threshold, measurement window, recipe version and calibration status with the acceptance record. This allows the result to be reproduced after maintenance, software changes or package conversion.
Frequently Asked Questions
Turret Test and Vision Handler FAQ
These answers define the main inspection and test boundaries. Final capability still depends on the actual machine and the approved inspection trial.
What does a turret test and vision handler do?
It moves semiconductor devices through configurable stations that may include electrical test, optical inspection, marking, sorting and final packaging. The installed stations vary by machine.
Is vision inspection the same as electrical test?
No. Electrical test checks the device against electrical or functional limits. Vision inspection checks package appearance, geometry, marks, leads, pads, surfaces or packing condition.
What is the difference between 2D and 3D inspection?
2D inspection analyzes image position, contrast and visible features. 3D inspection measures height, coplanarity, shape or topography. The required method depends on the package and defect standard.
Can one machine perform six-side inspection?
Only when the machine has the required camera positions, optics, lighting, handling presentation and software. Six-side inspection should not be assumed from the model family alone.
How should a vision inspection recipe be validated?
Run representative good devices, known defect samples and boundary-condition parts through repeated machine cycles. Compare expected results, false rejects, missed defects, stored images and output routing.
What information is needed for a quotation?
Provide the package drawing, required electrical tests, inspection surfaces, defect types, acceptance limits, target UPH, input and output media, preferred equipment condition and destination.
Start With the Defect Standard and Test Requirement
Send the package, required electrical test, inspection surfaces, known defect samples, acceptance criteria, target output and preferred equipment condition so the available systems can be reviewed against the real application.
