asm siplace sx2 smt ପ୍ଲେସମେଣ୍ଟ ମେସିନ୍

ASM SIPLACE SX2 is an ultra-high-speed modular placement machine launched by ASM Assembly Systems under the ASMPT Group. It is designed for high-volume electronic manufacturing and is suitable for fields that require extremely high production capacity, such as smartphones, automotive electronics, and 5G communication equipment.

Market positioning: between the mid-range (such as the D series) and the flagship (such as the X series), focusing on high-cost high-speed placement, balancing speed, precision and flexibility.

1.2 Technology evolution

SIPLACE technology inheritance: Inheriting Siemens SIPLACE's core technologies such as linear motor drive and flight vision alignment, and optimizing motion control algorithms.

SX series iteration: SX2 is an upgraded version of SX1, with major improvements including:

10%~15% increase in placement speed (theoretical maximum up to 126,000 CPH)

Enhanced feeder compatibility (supports wider material strips)

Optimized line change efficiency (QuickChange function)

2. Core working principle and technological innovation

2.1 Placement process

PCB ଟ୍ରାନ୍ସମିସନ୍ ଏବଂ ପୋଜିସନିଂ

Adopting a dual-track transmission system, it supports PCB sizes of 50mm×50mm ~ 510mm×460mm.

The high-precision Fiducial camera (FCM) automatically identifies PCB reference points and compensates for PCB deformation or position error (accuracy ±10μm).

ଉପାଦାନ ବାଛିବା ଏବଂ କାଲିବ୍ରେସନ୍

The 20-nozzle placement head (MultiStar) picks up components from the electric feeder (eFeeder).

Fly Vision: The ICM camera completes component calibration (detects center offset, rotation angle, etc.) during the movement of the placement head to reduce pause time.

Dynamic placement

Linear motor drive + grating ruler closed-loop control to achieve ±25μm @3σ placement accuracy.

Intelligent pressure control: Automatically adjust the placement force for different components (such as thin MLCC, large BGA).

2.2 Core technology highlights

Technology Description

MultiStar placement head 20 nozzle design, support synchronous pick-up-placement (Pick & Place Parallelism), improve efficiency.

eFeeder electric feeder automatically calibrates the position, and material change does not require manual intervention, reducing downtime.

Intelligent path optimization SIPLACE Pro software dynamically calculates the optimal placement sequence to reduce head and arm empty running.

Dual-track independent control can process two PCBs at the same time, improving overall production capacity.

3. ହାର୍ଡୱେର୍ ଏବଂ ସଫ୍ଟୱେର୍ ବିନ୍ୟାସ

୩.୧ ହାର୍ଡୱେର୍ ସ୍ଥାପତ୍ୟ

Module Specifications

Placement head MultiStar 20 nozzle, supports 0201~45mm×45mm components

ଦୃଷ୍ଟି ପ୍ରଣାଳୀ - ICM (ଉପାଦାନ କାଲିବ୍ରେସନ୍): 50μm@15ms

- FCM (PCB positioning): ±10μm

Feeding system Expandable to up to 320 feeders (8mm~104mm strip)

Motion control Linear motor + grating ruler, maximum acceleration 2.5m/s²

Transmission system Dual-track independent transmission, supports board thickness 0.4~6mm

୩.୨ ସଫ୍ଟୱେର୍ ସିଷ୍ଟମ୍

SIPLACE ସଫ୍ଟୱେର୍ ସୁଟ୍:

Pro: Basic programming and optimization (support CAD import).

Xpert: Advanced data analysis (CPK, placement offset heat map).

Monitor: Real-time monitoring of OEE (overall equipment efficiency), fault alarm.

Intelligent function:

QuickChange: Automatically identify material station changes when changing lines, and complete switching within 5 minutes.

Dynamic Balancing: Dynamic allocation of tasks for multiple placement heads to avoid bottlenecks.

4. ପ୍ରମୁଖ କାର୍ଯ୍ୟଦକ୍ଷତା ପାରାମିଟରଗୁଡ଼ିକ

Indicators SIPLACE SX2 parameters

Maximum placement speed 126,000 CPH (theoretical value)

Placement accuracy ±25μm @3σ (chip components)

ଉପାଦାନ ପରିସର ୦୨୦୧~୪୫ମିମି×୪୫ମିମି, ଘନତା ୦.୨~୧୨ମିମି

Feeder capacity Maximum 320 (8mm tape)

ଲାଇନ ପରିବର୍ତ୍ତନ ସମୟ <5 ମିନିଟ୍ (କ୍ୱିକ୍ ଚେଞ୍ଜ ମୋଡ୍)

Power consumption Average 5.5kW, energy-saving mode can reduce 30%

5. ଶିଳ୍ପ ପ୍ରୟୋଗ ପରିସ୍ଥିତି

Consumer electronics: smartphone motherboard (high-density CSP/BGA placement).

Automotive electronics: ADAS control module (high-temperature resistant components).

Communication equipment: 5G base station RF power amplifier (large size QFN).

Industrial electronics: high-reliability industrial control board (long life cycle support).

୬. ଗଭୀର ସମସ୍ୟା ନିବାରଣ ଏବଂ ରକ୍ଷଣାବେକ୍ଷଣ

୬.୧ ସାଧାରଣ ତ୍ରୁଟି ଏବଂ ସମାଧାନ

Fault 1: Mounting offset (X/Y direction)

ସମ୍ଭାବ୍ୟ କାରଣଗୁଡ଼ିକ:

PCB positioning is inaccurate (Fiducial recognition error).

Nozzle Z-axis height setting deviation.

ସମାଧାନ:

FCM କ୍ୟାମେରାକୁ ସଫା କରନ୍ତୁ ଏବଂ ରେଫରେନ୍ସ ବିନ୍ଦୁକୁ ପୁନଃକାଲିବ୍ରେଟ୍ କରନ୍ତୁ।

Use a laser height gauge to verify the nozzle Z-axis parameters.

ତ୍ରୁଟି ୨: ଭାକ୍ୟୁମ୍ ପିକଅପ୍ ବିଫଳତା

ସମ୍ଭାବ୍ୟ କାରଣଗୁଡ଼ିକ:

Nozzle blockage or vacuum line leakage.

Component thickness/nozzle type mismatch.

ସମାଧାନ:

Clean the nozzle with an ultrasonic cleaner (recommended once a week).

Check the vacuum generator pressure (standard value: -85±5kPa).

Fault 3: Drive alarm (ERR-4102)

Possible causes: Linear motor overload or grating scale contamination.

ସମାଧାନ:

Clean the grating scale with a dust-free cloth.

ଡ୍ରାଇଭ ମଡ୍ୟୁଲ୍ ବଦଳାଇବା ପାଇଁ ASM ବୈଷୟିକ ସହାୟତା ସହିତ ଯୋଗାଯୋଗ କରନ୍ତୁ।

୬.୨ ପ୍ରତିଷେଧକ ରକ୍ଷଣାବେକ୍ଷଣ ଯୋଜନା

ସାଇକେଲ ରକ୍ଷଣାବେକ୍ଷଣ ବିଷୟବସ୍ତୁ

Daily - Clean the nozzles

- ଭାକ୍ୟୁମ୍ ଚାପ ଯାଞ୍ଚ କରନ୍ତୁ

Weekly - Lubricate the linear guides

- Calibrate the ICM/FCM cameras

Monthly - Fully calibrate the motion system

- ବ୍ୟାକଅପ୍ ଉପକରଣ ପାରାମିଟରଗୁଡ଼ିକ

୭. ପ୍ରତିଯୋଗିତାମୂଳକ ଉତ୍ପାଦଗୁଡ଼ିକର ତୁଳନାତ୍ମକ ବିଶ୍ଳେଷଣ।

Model ASM SIPLACE SX2 FUJI NXT III Panasonic NPM-D3

Speed (CPH) 126,000 75,000 110,000

Accuracy (μm) ±25 ±25 ±30

ଲାଇନ ପରିବର୍ତ୍ତନ ସମୟ <5 ମିନିଟ୍ 10 ମିନିଟ୍ 8 ମିନିଟ୍

Core advantages Cost-effective high-speed solution High stability Compatibility with large boards

୮. ସାରାଂଶ

With its 20-nozzle MultiStar placement head, eFeeder intelligent feeding system and ultra-high speed of 126,000 CPH, the ASM SIPLACE SX2 is an ideal choice for high-volume electronics manufacturing, especially for consumer electronics and automotive electronics.

ସୁପାରିଶଗୁଡ଼ିକ:

Maintain linear guides and vacuum systems regularly to maintain accuracy.

Use SIPLACE Xpert software to analyze production data and optimize placement efficiency.