asm siplace sx2 smt umatshini wokubeka

I-ASM SIPLACE SX2 ngumatshini wokubeka imodyuli we-ultra-high-speed oqaliswe yi-ASM Assembly Systems phantsi kweQela le-ASMPT. Yenzelwe ukuveliswa kombane okwizinga eliphezulu kwaye ilungele amasimi afuna umthamo ophezulu kakhulu wemveliso, onje ngee-smartphones, ii-elektroniki zemoto, kunye nezixhobo zonxibelelwano ze-5G.

Ukubekwa kwemarike: phakathi koluhlu oluphakathi (njengoluhlu lwe-D) kunye ne-flagship (efana nochungechunge lwe-X), igxininise ekubekweni kwexabiso eliphezulu, ukulinganisa isantya, ukuchaneka kunye nokuguquguquka.

1.2 Ukuzivelela kweteknoloji

I-SIPLACE ifa letekhnoloji yelifa: Ukufumana itekhnoloji engundoqo ye-Siemens SIPLACE efana ne-linear motor drive kunye nokulungelelaniswa kombono wokubhabha, kunye nokuphucula i-algorithms yokulawula intshukumo.

I-SX series iteration: I-SX2 yinguqulelo ephuculweyo ye-SX1, enophuculo olukhulu oluquka:

I-10% ~ 15% yokwanda kwesantya sokubeka (ubuninzi bethiyori ukuya kwi-126,000 CPH)

Ukuhambelana kwe-feeder eyandisiweyo (ixhasa imicu yemathiriyeli ebanzi)

Utshintsho lomgca oluphuculweyo (umsebenzi weQuickChange)

2. Umgaqo ongundoqo wokusebenza kunye nokuveliswa kwezinto ezintsha zobuchwepheshe

2.1 Inkqubo yokubeka

PCB transmission kunye nokubeka

Ukwamkela inkqubo yokuhanjiswa kwetrack ezimbini, ixhasa ubukhulu bePCB ye50mm×50mm ~ 510mm×460mm.

Ikhamera yeFiducial echanekileyo ephezulu (FCM) ichonga ngokuzenzekelayo amanqaku ereferensi ye-PCB kwaye ihlawule i-PCB deformation okanye impazamo yendawo (ukuchaneka ± 10μm).

Ukuchongwa kwecandelo kunye nokulinganisa

Intloko yokubeka imilomo engama-20 (i-MultiStar) ithatha amacandelo kwi-feeder yombane (eFeeder).

I-Fly Vision: Ikhamera ye-ICM igqiba ukulinganiswa kwecandelo (ifumanisa i-center offset, i-rotation angle, njl.) Ngexesha lokuhamba kwentloko yokubeka ukunciphisa ixesha lokumisa.

Ukubekwa okunamandla

Linear motor drive + grating irula evaliweyo-loop ulawulo ukufikelela ±25μm @3σ ukuchaneka kokubekwa.

Ukulawulwa koxinzelelo olukrelekrele: Lungisa ngokuzenzekelayo amandla okubekwa kumacandelo ahlukeneyo (njenge-MLCC ebhityileyo, iBGA enkulu).

2.2 Iimpawu eziphambili zetekhnoloji

Technology Inkcazelo

I-MultiStar yokubekwa kwentloko ye-20 yoyilo lwe-nozzle, inkxaso ye-synchronous pick-up-placement (Pick & Place Parallelism), ukuphucula ukusebenza kakuhle.

I-eFeeder feeder electric feeder ilungelelanisa ngokuzenzekelayo isikhundla, kwaye utshintsho lwempahla alufuni ukungenelela ngesandla, ukunciphisa ixesha lokuphumla.

Indlela ekrelekrele yokwenza i-SIPLACE isoftware ibala ngokuguquguqukayo ulandelelwano lobeko lokunciphisa intloko nengalo engenanto yokubaleka.

Ulawulo oluzimeleyo lwetrack ezimbini lunokuqhuba iiPCB ezimbini ngaxeshanye, luphucula umthamo wemveliso ngokubanzi.

3. I-Hardware kunye noqwalaselo lwesoftware

3.1 Uyilo lwehardware

IiNkcazelo zeModyuli

Intloko yokubeka i-MultiStar 20 nozzle, ixhasa i-0201 ~ 45mm×45mm amacandelo

Inkqubo yombono - ICM (ukulinganisa icandelo): 50μm@15ms

- FCM (PCB indawo): ±10μm

Inkqubo yokutya Enokwandiswa ukuya kuthi ga kwi-320 feeder (8mm~104mm strip)

Ulawulo olushukumayo Injini yomgca + irula yokugawula, isantya esiphezulu 2.5m/s²

Inkqubo yothumelo Uthumelo oluzimeleyo lwe-track-track, ixhasa ubukhulu bebhodi 0.4 ~ 6mm

3.2 Inkqubo yesoftware

SIPLACE Software Suite:

Ipro: Inkqubo esisiseko kunye nokuphucula (inkxaso yokungenisa iCAD).

I-Xpert: Uhlalutyo lwedatha oluphezulu (CPK, ukubeka imephu yobushushu be-offset).

Ukubeka iliso: Ukujongwa kwexesha langempela le-OEE (ukusebenza kakuhle kwezixhobo), i-alarm yempazamo.

Umsebenzi okrelekrele:

Ukutshintsha ngokukhawuleza: Ukuchonga ngokuzenzekelayo utshintsho lwesikhululo sezinto eziphathekayo xa utshintsha imigca, kwaye ugqibe ukutshintsha kwimizuzu emi-5.

Ulungelelwaniso olunamandla: Ukwabiwa okuguquguqukayo kwemisebenzi yeentloko ezininzi zokubeka ukuthintela imiqobo.

4. Iiparamitha zentsebenzo eziphambili

Iimpawu SIPLACE SX2 iiparamitha

Esona santya sibekiweyo sokubekwa yi-126,000 CPH (ixabiso lethiyori)

Ukuchaneka kokubekwa ±25μm @3σ (amalungu etshiphu)

Uluhlu lwecandelo 0201 ~ 45mm×45mm, ubukhulu 0.2 ~ 12mm

Umthamo we-Feeder Ubuninzi 320 (8mm tape)

Ixesha lokutshintsha umgca <5 imizuzu (imowudi ye-QuickChange)

Ukusetyenziswa kwamandla okuphakathi kwe-5.5kW, imowudi yokugcina amandla inokunciphisa i-30%

5. Iimeko zesicelo seshishini

Ii-elektroniki zabathengi: i-motherboard ye-smartphone (i-high-density CSP/BGA yokubekwa).

I-Automotive electronics: Imodyuli yokulawula i-ADAS (izixhobo ezixhathisa ubushushu obuphezulu).

Izixhobo zonxibelelwano: Isiseko se-5G isiseko se-RF amplifier yamandla (ubukhulu obukhulu be-QFN).

I-elektroniki ye-Industrial: ibhodi yokulawula ukuthembeka okuphezulu (inkxaso yomjikelo wobomi obude).

6. Ukucombulula iingxaki kunye nokugcinwa ngokunzulu

6.1 Iimpazamo eziqhelekileyo kunye nezisombululo

Impazamo 1: Ukunyuka kwe-offset (X/Y icala)

Unobangela onokwenzeka:

Ukubekwa kwe-PCB akuchanekanga (Impazamo yokuqaphela iFiducial).

Umbhobho we-Z-axis ukuphakama kwesethingi yokutenxa.

Isisombululo:

Coca ikhamera yeFCM kwaye uhlengahlengise indawo yereferensi.

Sebenzisa igeyiji yobude belaser ukungqinisisa umbhobho we-Z-axis parameters.

Impazamo yesi-2: Ukusilela kwe-vacuum pickup

Unobangela onokwenzeka:

Ukuvaleka kombhobho okanye ukuvuza komgca wevacuum.

Ubukhulu becandelo/udidi lombhobho olungafaniyo.

Isisombululo:

Coca i-nozzle nge-ultrasonic cleaner (icetyiswa kanye ngeveki).

Jonga uxinzelelo lwejenereyitha (ixabiso eliqhelekileyo: -85±5kPa).

Impazamo yesi-3: I-alarm ye-Drive (ERR-4102)

Oonobangela abanokubakho: Umthamo wenjini yomgca okanye ungcoliseko lwesikali segrayiti.

Isisombululo:

Coca isikali se-grating ngelaphu elingenathuli.

Qhagamshelana nenkxaso yobugcisa ye-ASM ukuze ubuyisele imodyuli yokuqhuba.

6.2 Isicwangciso solondolozo esithintelwayo

Umjikelo woLondolozo umxholo

Yonke imihla - Coca imilomo

- Jonga uxinzelelo lwevacuum

Ngeveki - Thambisa izikhokelo ezihambelanayo

- Lungiselela iikhamera ze-ICM/FCM

Ngenyanga - Lungiselela ngokupheleleyo inkqubo yentshukumo

- Iiparamitha zezixhobo zogcino

7. Uhlalutyo oluthelekisayo lweemveliso ezikhuphisanayo

Umzekelo we-ASM SIPLACE SX2 FUJI NXT III Panasonic NPM-D3

Isantya (CPH) 126,000 75,000 110,000

Ukuchaneka (μm) ±25 ±25 ±30

Ixesha lokutshintsha umgca <5 imizuzu 10 imizuzu 8 imizuzu

Iinzuzo ezingundoqo Isisombululo esineendleko eziphezulu zesantya Uzinzo oluphezulu Ukuhambelana neebhodi ezinkulu

8. Isishwankathelo

Ngentloko yayo yokubeka i-MultiStar ye-20-nozzle, inkqubo ye-eFeeder ekrelekrele yokutya kunye nesantya esiphezulu se-126,000 CPH, i-ASM SIPLACE SX2 lukhetho olufanelekileyo lokwenziwa komthamo omkhulu we-elektroniki, ngakumbi kubathengi be-elektroniki kunye ne-automotive electronics.

Izindululo:

Gcina izikhokelo zomgca kunye neenkqubo ze-vacuum rhoqo ukugcina ukuchaneka.

Sebenzisa isoftware ye-SIPLACE Xpert ukuhlalutya idatha yemveliso kunye nokwandisa ukusebenza kakuhle kokubeka.