asm siplace sx2 smt placement machine

ASM SIPLACE SX2 is an ultra-high-speed modular placement machine launched by ASM Assembly Systems under the ASMPT Group. It is designed for high-volume electronic manufacturing and is suitable for fields that require extremely high production capacity, such as smartphones, automotive electronics, and 5G communication equipment.

Market positioning: between the mid-range (such as the D series) and the flagship (such as the X series), focusing on high-cost high-speed placement, balancing speed, precision and flexibility.

1.2 Technology evolution

SIPLACE technology inheritance: Inheriting Siemens SIPLACE's core technologies such as linear motor drive and flight vision alignment, and optimizing motion control algorithms.

SX series iteration: SX2 is an upgraded version of SX1, with major improvements including:

10%~15% increase in placement speed (theoretical maximum up to 126,000 CPH)

Enhanced feeder compatibility (supports wider material strips)

Optimized line change efficiency (QuickChange function)

2. Core working principle and technological innovation

2.1 Placement process

PCB transmission and positioning

Adopting a dual-track transmission system, it supports PCB sizes of 50mm×50mm ~ 510mm×460mm.

The high-precision Fiducial camera (FCM) automatically identifies PCB reference points and compensates for PCB deformation or position error (accuracy ±10μm).

Component picking and calibration

The 20-nozzle placement head (MultiStar) picks up components from the electric feeder (eFeeder).

Fly Vision: The ICM camera completes component calibration (detects center offset, rotation angle, etc.) during the movement of the placement head to reduce pause time.

Dynamic placement

Linear motor drive + grating ruler closed-loop control to achieve ±25μm @3σ placement accuracy.

Intelligent pressure control: Automatically adjust the placement force for different components (such as thin MLCC, large BGA).

2.2 Core technology highlights

Technology Description

MultiStar placement head 20 nozzle design, support synchronous pick-up-placement (Pick & Place Parallelism), improve efficiency.

eFeeder electric feeder automatically calibrates the position, and material change does not require manual intervention, reducing downtime.

Intelligent path optimization SIPLACE Pro software dynamically calculates the optimal placement sequence to reduce head and arm empty running.

Dual-track independent control can process two PCBs at the same time, improving overall production capacity.

3. Hardware and software configuration

3.1 Hardware architecture

Module Specifications

Placement head MultiStar 20 nozzle, supports 0201~45mm×45mm components

Vision system - ICM (component calibration): 50μm@15ms

- FCM (PCB positioning): ±10μm

Feeding system Expandable to up to 320 feeders (8mm~104mm strip)

Motion control Linear motor + grating ruler, maximum acceleration 2.5m/s²

Transmission system Dual-track independent transmission, supports board thickness 0.4~6mm

3.2 Software system

SIPLACE Software Suite:

Pro: Basic programming and optimization (support CAD import).

Xpert: Advanced data analysis (CPK, placement offset heat map).

Monitor: Real-time monitoring of OEE (overall equipment efficiency), fault alarm.

Intelligent function:

QuickChange: Automatically identify material station changes when changing lines, and complete switching within 5 minutes.

Dynamic Balancing: Dynamic allocation of tasks for multiple placement heads to avoid bottlenecks.

4. Key performance parameters

Indicators SIPLACE SX2 parameters

Maximum placement speed 126,000 CPH (theoretical value)

Placement accuracy ±25μm @3σ (chip components)

Component range 0201~45mm×45mm, thickness 0.2~12mm

Feeder capacity Maximum 320 (8mm tape)

Line change time <5 minutes (QuickChange mode)

Power consumption Average 5.5kW, energy-saving mode can reduce 30%

5. Industry application scenarios

Consumer electronics: smartphone motherboard (high-density CSP/BGA placement).

Automotive electronics: ADAS control module (high-temperature resistant components).

Communication equipment: 5G base station RF power amplifier (large size QFN).

Industrial electronics: high-reliability industrial control board (long life cycle support).

6. In-depth troubleshooting and maintenance

6.1 Common faults and solutions

Fault 1: Mounting offset (X/Y direction)

Possible causes:

PCB positioning is inaccurate (Fiducial recognition error).

Nozzle Z-axis height setting deviation.

Solution:

Clean the FCM camera and recalibrate the reference point.

Use a laser height gauge to verify the nozzle Z-axis parameters.

Fault 2: Vacuum pickup failure

Possible causes:

Nozzle blockage or vacuum line leakage.

Component thickness/nozzle type mismatch.

Solution:

Clean the nozzle with an ultrasonic cleaner (recommended once a week).

Check the vacuum generator pressure (standard value: -85±5kPa).

Fault 3: Drive alarm (ERR-4102)

Possible causes: Linear motor overload or grating scale contamination.

Solution:

Clean the grating scale with a dust-free cloth.

Contact ASM technical support to replace the drive module.

6.2 Preventive maintenance plan

Cycle Maintenance content

Daily - Clean the nozzles

- Check the vacuum pressure

Weekly - Lubricate the linear guides

- Calibrate the ICM/FCM cameras

Monthly - Fully calibrate the motion system

- Backup equipment parameters

7. Comparative analysis of competitive products

Model ASM SIPLACE SX2 FUJI NXT III Panasonic NPM-D3

Speed (CPH) 126,000 75,000 110,000

Accuracy (μm) ±25 ±25 ±30

Line change time <5 minutes 10 minutes 8 minutes

Core advantages Cost-effective high-speed solution High stability Compatibility with large boards

8. Summary

With its 20-nozzle MultiStar placement head, eFeeder intelligent feeding system and ultra-high speed of 126,000 CPH, the ASM SIPLACE SX2 is an ideal choice for high-volume electronics manufacturing, especially for consumer electronics and automotive electronics.

Recommendations:

Maintain linear guides and vacuum systems regularly to maintain accuracy.

Use SIPLACE Xpert software to analyze production data and optimize placement efficiency.