1. Mawonekedwe a Zamalonda ndi Ntchito Yapakati
1.1 Ntchito Yaikulu ya Scraper Blade
DEK printer scraper blade ndiye gawo lalikulu pakusindikiza kwa solder paste, zomwe zimakhudza mwachindunji:
Kufanana kwa phala la solder
Kulondola kwazithunzi zosindikizidwa
Kusakanikirana kwa kuphimba kwa pad
Kukhazikika kwadongosolo
1.2 Zochitika zofananira ndikugwiritsa ntchito
Kusindikiza kwa board kwa High-density interconnect (HDI).
Zigawo zomveka bwino (pansi pa phula 0.3mm)
Njira yophatikizira yophatikizika (phala la solder + guluu wofiira)
Kupaka mwatsatanetsatane (CSP/BGA)
2. Mfundo yogwira ntchito ndi thupi
2.1 Mfundo yogwira ntchito
Kumeta ubweya:
Chofufutiracho chimakhudza mauna achitsulo pamakona a 45-60 °
Amapanga kumeta ubweya wambiri wa 2000-5000s⁻¹
Amapanga solder phala kuyenda thixotropicallyKudzaza siteji:
The scraper amakankhira solder phala kudzaza mauna
Kuthamanga koyenera kodzaza ndi 30-100N
Gawo lomasulidwa:
Mizati ya phala ya micron-size solder imapangidwa pamene mauna achitsulo alekanitsidwa
Ngodya yotulutsa imakhudza mtundu wa demolding
2.2 Zofunikira zakuthupi
Mtengo wa Parameter Kupatuka kovomerezeka
Kulimba (Mphepete mwa nyanja A) 75-90 ±5
Elastic modulus 3-8MPa ± 10%
Kukula kwapamtunda (Ra) ≤0.2μm +0.05μm
Kutentha osiyanasiyana -20 ℃ ~ 120 ℃ Kulekerera kwakanthawi +20 ℃
Valani coefficient yokana ≤0.15 (ASTM D1044) +0.03
III. Gulu lazinthu komanso mawonekedwe aukadaulo
3.1 Kufananiza kwamtundu wazinthu
Mtundu wa Polyurethane (PU) Metal scraper Composite material
Kulimba 75-90A HRC60-65 85A (pamwamba)
Moyo 500,000-1 miliyoni nthawi 5 miliyoni + 2 miliyoni-3 miliyoni nthawi
phala logwiritsira ntchito phala la Conventive SnPb/lead-free High viscosity solder phala Nano silver phala
Mtengo Wotsika Kwambiri
Mawonekedwe Osavuta kusintha, kusinthasintha mwamphamvu Ultra-high mwatsatanetsatane Anti-static design
3.2 mawonekedwe apadera a DEK
Kukhathamiritsa kwa geometry ya Blade:
Mapangidwe a bevel awiri (ngodya yakutsogolo 25 ° + kumbuyo 15 °)
Kuwongoka kwa tsamba ≤0.01mm/300mm
Mapangidwe amalipiro amphamvu:
Kusintha kwamphamvu kwamphamvu
Kuwongolera kutentha kwa deformation
Mawonekedwe apadera:
kagawo koyikira mwachangu
Mapangidwe oyika opusitsa
IV. Chikoka cha ndondomeko ndi ntchito zazikulu
4.1 Zokhudza kusindikiza bwino
Kuwongolera makulidwe:
Tsamba kuvala 0.1mm → Solder phala makulidwe kusintha ± 5μm
Mulingo woyenera kuvala malire: ≤0.3mm
Zithunzi zabwino:
Kuwonongeka kwa masamba kumayambitsa:
Kokani nsonga (> 30° scraper angle)
Kupsinjika maganizo (kupanikizika kosakwanira)
Mchira (liwiro lobwerera ndilothamanga kwambiri)
Zenera la ndondomeko:
nsato
# Mtundu wofananira wa parameter
{
"Kupanikizika": 50-80N, # Kusindikiza kosindikiza
"Liwiro": 20-80mm / s", # Scraper liwiro
"angle": 45-60 °, # Contact angle
"kuphatikizana": 0.5-2mm # Kuphimba zitsulo zachitsulo
}
4.2 Kuzindikira koyambira
Muyezo wolondola:
Kuwongolera kuchuluka kwa phala la solder (60-90% mesh voliyumu)
Kupatuka kwa makulidwe ≤±5μm (CPK≥1.67)
Kuwongolera pamwamba:
Chotsani phala lotsalira la solder pazitsulo zachitsulo
Kusalala kwapamtunda ≤2μm
Kutsegula kwa shear:
Chepetsani kukhuthala kwa solder phala (thixotropy ≥85%)
V. Kusanthula kwabwino ndi luso laukadaulo
5.1 Ubwino wampikisano
Mwatsatanetsatane mwayi
Fikirani ± 15μm kubwereza kusindikiza
Thandizani 01005 chigawo chosindikiza
Phindu la moyo:
Moyo wa polyurethane scraper wokulirapo ndi 50% (poyerekeza ndi miyezo yamakampani)
Metal scraper imatha kutembenuzika kuti mugwiritse ntchito
Ubwino wogwirizana:
Sinthani kumitundu yonse yosindikiza ya DEK
Thandizani mankhwala opaka nano
5.2 Kusintha kwaukadaulo
Tekinoloje yolimba ya gradient:
Kuuma kwa m'mphepete 90A → Kuuma kwa thupi 75A
Chepetsani kupsinjika maganizo
Tekinoloje ya Microtexture:
Laser processing micron-level grooves
Chepetsani mikangano ndi 30%
Kuwunika kwanzeru kuvala:
Chip chophatikizidwa cha RFID
Lembani kuchuluka kwa nthawi zomwe zimagwiritsidwa ntchito munthawi yeniyeni
VI. Kukonza ndi kuthetsa mavuto
6.1 Zosintha zatsiku ndi tsiku
Zinthu Njira Yozungulira
Kuyeretsa m'mphepete mwa nsalu zopanda fumbi + IPA (99.7%) Kusintha kulikonse
Chongani kuvala Optical comparator muyeso Weekly
Mayeso olimba M'mphepete mwa nyanja Choyesa kuuma (njira yoyezera mfundo zitatu) Mwezi uliwonse
Kutulutsa kupsinjika Kuyimirira ndikuyimirira kwa maola 24 Kota
6.2 Kusamalira zolakwika zomwe wamba
Cholakwika Chochitika Choyambitsa Kusanthula Njira
Kuchuluka kwa phala la solder Kudula m'mphepete kuvala/kusintha Bwezerani chopukusira
Mfundo yosindikizira Makona aakulu kwambiri/odula m'mphepete Sinthani ngodya kukhala 50°
Kusindikiza Molakwika Kupanikizika kosakwanira/kuchepa kuuma Kuchulukitsani kupanikizika ndi 10-15N
Scraper kulumpha Kuyika kotayirira / kuvala zonyamula Limbikitsani ndi kuthira mafuta njanji yowongolera
6.3 Njira yoyendetsera moyo
Valani miyezo yowunikira:
Polyurethane: Bwezerani pamene m'mphepete mwavala> 0.3mm
Chitsulo: Bwezerani pamene kuwonongeka kwa m'mphepete kukuwonekera
Kukonzanso ndikugwiritsanso ntchito:
Zitsulo zachitsulo zimatha kugwedezeka ndikukonzedwa (≤ 3 nthawi)
Kukonza m'mphepete mwa polyurethane scraper (zida zapadera)
VII. Malingaliro okhathamiritsa ndondomeko
7.1 Parameter yofananira mfundo
Mgwirizano wothamanga:
mawu
Kuthamanga kochepa (20-40mm / s): kuthamanga kwakukulu (70-100N)
Kuthamanga kwakukulu (60-80mm / s): kutsika kochepa (40-60N)
Chowongolera chosankha ngodya:
Kukula bwino: 60 ° (chepetsani mchira)
Pedi lalikulu: 45 ° (kudzaza kowonjezera)
7.2 Kugwiritsa ntchito njira yapadera
Khwerero chitsulo chophimba kusindikiza:
Gwiritsani ntchito double hardness scraper
Gawo lakutsogolo 75A/gawo lakumbuyo 85A
Kusindikiza kwapamwamba kwambiri:
Gwiritsani ntchito scraper ya diamondi
Kukula kwapamtunda ≤0.05μm
High viscosity solder phala:
Amalangiza zitsulo scraper
Kupanikizika kwawonjezeka ndi 20-30%
VIII. Chitukuko chaukadaulo
8.1 Kupanga zinthu zatsopano
Graphene yowonjezera polyurethane (kuvala kukana + 200%)
Zodzichiritsa zokha za elastomer
8.2 Kukweza kwanzeru
Integrated pressure sensor (ndemanga zenizeni zenizeni)
Kutentha-kukakamiza kogwirizana kuwongolera
8.3 Kupanga zobiriwira
Biodegradable scraper zinthu
Dry Cleaning Technology (chepetsani kugwiritsa ntchito IPA)
IX. Kusankha ndi kugwiritsa ntchito malangizo
9.1 Matrix osankhidwa
Momwe mungagwiritsire ntchito Mtundu wovomerezeka Utali wa moyo
Misa kupanga Metal scraper miyezi 6-12
High mix kupanga Polyurethane scraper 1-3 miyezi
Special aloyi solder phala Ceramic TACHIMATA scraper 3-6 miyezi
Kupanga kuyesa kwa R&D Composite scraper, kusintha kosinthika
9.2 Njira zopewera kugwiritsa ntchito
Mafotokozedwe oyika:
Gwiritsani ntchito wrench ya torque (5-8N·m)
Tsimikizirani kufanana (≤0.02mm)
Zosungirako:
Sungani kutali ndi kuwala (chitetezo cha UV)
Ikani mopingasa (anti-deformation)
Muyeso wa scrap:
Polyurethane: kuuma kusintha ± 10%
Chitsulo: m'mphepete kugwetsa> 0.1mm
Khumi. Chidule
Monga chinsinsi chogwiritsidwa ntchito posindikiza molondola, chitukuko chaukadaulo cha DEK makina osindikizira scraper blade chimapereka:
Kulondola kwambiri: zigawo zothandizira pansipa 01005
Moyo wautali: moyo wachitsulo wopukutira umaposa nthawi 10 miliyoni
Intelligent: Integrated sensing ndi mayankho ntchito
Malangizo ochita bwino kwambiri:
Khazikitsani zolemba zakale za scraper life cycle
Kukhazikitsa njira zodzitetezera
Chitani ndondomeko ya DOE kukhathamiritsa
M'tsogolomu, ndi chitukuko cha 5G / 6G, ma CD apamwamba ndi matekinoloje ena, teknoloji ya scraper idzapitirizabe kusinthika kupita ku ultra-precision, multifunction ndi mayendedwe okhazikika.