DEK ebitundu bya printer smt Scraper Blade

1. Okulambika kw’ebintu n’omulimu omukulu

1.1 Omulimu Omukulu ogwa Scraper Blade

DEK printer scraper blade ye kitundu ekikulu executive mu solder paste okukuba ebitabo enkola, butereevu okukosa:

Uniformity y’okuteekebwa kw’ekikuta kya solder

Obutuufu bw’ebifaananyi ebikubiddwa

Okukwatagana kw’okubikka kwa paadi

Okutebenkera kw’enkola

1.2 Ensonga eza bulijjo ez’okukozesa

Okukuba ebitabo ku bboodi ey’okuyunga ebiyungo ebinene (HDI).

Ebitundu ebirina eddoboozi eddungi (wansi wa mmita 0.3) .

Enkola y’okupakinga okutabuliddwa (solder paste + red glue) .

Okupakinga mu ngeri entuufu ennyo (CSP/BGA) .

2. Enkola y’emirimu n’ebintu ebirabika

2.1 Enkola y’emirimu

Ekikolwa ky’okusala:

Ekisekula kikwatagana n’akatimba k’ekyuma ku nkoona ya 45-60°

Efulumya omutindo gw’okusala ogw’amaanyi ogwa 2000-5000s−1

Kifuula ekikuta kya solder okutambula thixotropicallyOmutendera gw’okujjuza:

Ekisekula kinsika ekikuta kya solder okujjuza akatimba

Puleesa y’okujjuza esinga obulungi eri 30-100N

Omutendera gw'okufulumya:

Empagi za solder paste eza sayizi ya micron zikolebwa nga akatimba k’ekyuma kaawuddwamu

Enkoona y’okufulumya ekosa omutindo gwa demolding

2.2 Ebikulu ebipimo by’omubiri

Parameter Omuwendo gwa mutindo Okukyama okukkirizibwa

Obukaluba (Olubalama A) 75-90 ±5

Modulu ya laasitiki 3-8MPa ±10% .

Obukaluba ku ngulu (Ra) ≤0.2μm +0.05μm

Ebbugumu range -20°C ~ 120°C Okugumiikiriza okw’ekiseera ekitono +20°C

Omugerageranyo gw’okuziyiza okwambala ≤0.15 (ASTM D1044) +0.03

III. Ensengeka y’ebintu n’ebintu eby’ekikugu

3.1 Okugeraageranya ekika ky’ebintu

Ekika kya Polyurethane (PU) Ekyuma ekisekula Ekintu ekigatta

Obukaluba 75-90A HRC60-65 85A (okungulu) .

Obulamu 500,000-1 million emirundi obukadde 5 emirundi + obukadde 2-3 million emirundi

Solder paste ekozesebwa SnPb/lead-free eya bulijjo Paste ya solder eya viscosity enkulu Nano silver paste

Ebisale Wansi Waggulu Wakati

Ebirimu Ebyangu okukyusa, ebikola emirimu egy’amaanyi Ultra-high precision Anti-static design

3.2 Ebintu ebikwata ku dizayini ya DEK

Okulongoosa geometry ya blade:

Dizayini ya double bevel (enkoona y’omu maaso 25° + enkoona y’emabega 15°)

Obugolokofu bw’ekyuma ≤0.01mm/300mm

Ensengeka y’okuliyirira ey’amaanyi:

Okutereeza okukyusakyusa puleesa

Okuliyirira okukyukakyuka kw’ebbugumu

Enkolagana ey’enjawulo:

Ekifo eky’okussaako ekisumululwa amangu

Dizayini y’okuteeka ekifo mu kifo ekitali kya busirusiru

IV. Enkola y’okufuga n’emirimu emikulu

4.1 Enkosa ku mutindo gw’okukuba ebitabo

Okufuga obuwanvu:

Blade okwambala 0.1mm → Solder paste obuwanvu enkyukakyuka ±5μm

Ekkomo ku kwambala erisinga obulungi: ≤0.3mm

Omutindo gw’ebifaananyi:

Obulema mu blade buvaako:

Ensonga y’okusika (>30° enkoona y’okusenya) .

Okwennyamira (obutabeera na puleesa) .

Omukira (sipiidi y’okudda ya mangu nnyo) .

Eddirisa ly'enkola:

python (python) ekika kya python

# Enkola eya bulijjo parameter range

{

"puleesa": 50-80N, # Puleesa y'okukuba ebitabo

"sipiidi": 20-80mm/s", # Sipiidi y'okusenya

"enkoona": 45-60°, # Enkoona y'okukwatagana

"overlap": 0.5-2mm # Ekyuma ekibikka akatimba

}

4.2 Okutegeera emirimu emikulu

Okupima obulungi:

Okufuga solder paste okutambuza omuwendo (60-90% mesh volume)

Okukyama mu buwanvu ≤±5μm (CPK≥1.67)

Okutereeza kungulu:

Ggyawo ekikuta kya solder ekisigadde ku mesh y’ekyuma

Obupapajjo ku ngulu ≤2μm

Okukola kw’okusala:

Okukendeeza ku buzito bw’ekikuta kya solder (thixotropy ≥85%) .

V. Okwekenenya enkizo n’okuyiiya mu tekinologiya

5.1 Enkizo mu kuvuganya

Enkizo ey’obutuufu

Tuuka ku ±15μm okukuba ebitabo okuddiŋŋana

Okuwagira okukuba ebitabo ebitundu 01005

Enkizo mu bulamu:

Obulamu bwa Polyurethane scraper bwayongezeddwayo ebitundu 50% (bw’ogeraageranya n’omutindo gw’amakolero)

Ekyuma ekisekula osobola okukifuumuulwa okusobola okukozesebwa

Enkizo mu kukwatagana:

Okutuukagana n’ebika byonna eby’okukuba ebitabo ebya DEK

Okuwagira obujjanjabi bw’okusiiga nano

5.2 Obuyiiya mu tekinologiya

Tekinologiya w’obukaluba bwa gradient:

Obukaluba bw’empenda 90A → Obukaluba bw’omubiri 75A

Kendeeza ku situleesi

Tekinologiya wa microtexture:

Okukola layisi mu bifo ebiyitibwa micron-level grooves

Okukendeeza ku mugerageranyo gw’okusikagana ebitundu 30% .

Okulondoola okwambala mu ngeri ey’amagezi:

Chip ya RFID eyingiziddwamu

Wandiika emirundi gy’okozesezza mu kiseera ekituufu

VI. Okuddaabiriza n’okugonjoola ebizibu

6.1 Ebikwata ku ndabirira ya buli lunaku

Ekintu Enkola Enzirukanya

Okwoza ekifo ekisala Olugoye olutaliimu nfuufu + IPA (99.7%) Buli ssifiiti

Kebera okwambala Okupima okugeraageranya okw’amaaso Buli wiiki

Okugezesa obugumu Shore Ekigezesa obugumu (enkola y’okupima ensonga ssatu) Buli mwezi

Stress release Wanika era oyimirire okumala essaawa 24 Buli myezi esatu

6.2 Enkwata y’ensobi eya bulijjo

Ekintu ekirabika ensobi Okwekenenya ekivaako Ekigonjoola

Obugumu bwa solder paste obutali bwenkanya Okusala/okukyukakyuka kw’okusala Kukyusa scraper

Ensonga y’okukuba ebitabo Enkoona ennene nnyo/Ekibumba ekisala Teekateeka enkoona okutuuka ku 50°

Okukuba obubi Puleesa etamala/obukaluba obutono Yongera puleesa 10-15N

Scraper jump Loose installation/bearing wear Ssiba era osiige eggaali y’omukka eraga

6.3 Enkola y’okuddukanya obulamu

Omutindo gw’okulondoola okwambala:

Polyurethane: Kikyuseemu nga ku mabbali gambala > 0.3mm

Ekyuma: Kikyuse nga okwonooneka kw’empenda kulabika

Okuddaabiriza n’okuddamu okukozesa:

Ebisenya ebyuma bisobola okusiigibwa n’okuddaabirizibwa (≤ emirundi 3) .

Okusala ku mbiriizi za Polyurethane scraper (ebyuma eby’enjawulo) .

VII. Ebiteeso by’okulongoosa enkola

7.1 Enkola y’okukwatagana kwa parameter

Enkolagana ya sipiidi ne puleesa:

okuwandiika obubaka

Sipiidi entono (20-40mm/s): puleesa ya waggulu (70-100N)

Sipiidi ya waggulu (60-80mm/s): puleesa entono (40-60N)

Ekitabo ekikwata ku kulonda enkoona:

Eddoboozi eddungi: 60° (okukendeeza ku mukira)

Paadi ennene: 45° (okujjuza okunywezeddwa)

7.2 Okukozesa enkola ey’enjawulo

Omutendera ekyuma okukuba ebitabo ku screen:

Kozesa ekyuma ekisekula obukaluba obw’emirundi ebiri

Ekitundu eky’omu maaso 75A/ekitundu eky’emabega 85A

Okukuba ebitabo mu ddoboozi ery’omwanguka ennyo:

Kozesa ekyuma ekisekula ekisiigiddwa dayimanda

Obukaluba ku ngulu ≤0.05μm

Ekikuta kya solder ekirimu obuzito obw’amaanyi:

Teesa ekyuma ekisekula ebyuma

Puleesa yeeyongedde ebitundu 20-30% .

VIII. Omuze gw’okukulaakulanya tekinologiya

8.1 Okuyiiya ebintu

Graphene enhanced polyurethane (okuziyiza okwambala +200%) .

Ekintu kya elastomer ekyewonya

8.2 Okulongoosa mu ngeri ey’amagezi

Sensulo ya puleesa ekwataganye (okuddamu mu kiseera ekituufu) .

Okufuga okukwasaganyizibwa kwa puleesa y’ebbugumu

8.3 Okukola ebintu ebirabika obulungi

Ebintu ebisekula ebisobola okuvunda mu biramu

Tekinologiya w’okwoza mu ngeri enkalu (okukendeeza ku nkozesa ya IPA) .

IX. Ebiteeso by’okulonda n’okukozesa

9.1 Matrix y’okulonda

Enkola y‟okukozesa Ekika ekisemba Obulamu obusuubirwa

Okufulumya mu bungi Ekyuma ekisekula emyezi 6-12

Okufulumya okutabula kwa waggulu Polyurethane scraper emyezi 1-3

Special alloy solder paste Ekyuma ekisekula ekisiigiddwako ceramic emyezi 3-6

R&D okugezesa okufulumya Composite scraper, okukyusakyusa okukyukakyuka

9.2 Okwegendereza ku nkozesa

Ebikwata ku kussaako:

Kozesa ekisumuluzo kya torque (5-8N·m) .

Kakasa okufaanagana (≤0.02mm)

Embeera y’okutereka:

Teeka wala okuva ku kitangaala (okukuuma UV) .

Teeka mu bbanga (anti-deformation) .

Omutindo gw’ebisasiro:

Polyurethane: enkyukakyuka mu bugumu ±10% .

Ekyuma: okukutula ku mbiriizi>0.1mm

Kkumi. Okubumbako

Nga ekisumuluzo ekikozesebwa okukuba ebitabo mu ngeri entuufu, enkulaakulana mu tekinologiya w’ekyuma ekikuba ebitabo ekya DEK scraper blade eraga:

Obutuufu obw’amaanyi: ebitundu ebiwagira wansi wa 01005

Obulamu obuwanvu: obulamu bw’ekyuma ekisekula ebyuma busukka emirundi obukadde 10

Intelligent: emirimu egy’okutegeera n’okuddamu egy’okugatta

Ebiteeso by’enkola ennungi:

Teekawo ebyafaayo by’obulamu bwa scraper

Teeka mu nkola enkola y’okukyusaamu mu ngeri y’okuziyiza

Kola enkola parameter DOE okulongoosa

Mu biseera eby’omu maaso, olw’okukulaakulanya 5G/6G, okupakinga okw’omulembe ne tekinologiya omulala, tekinologiya wa scraper ajja kwongera okukulaakulana okutuuka ku ndagiriro ezituufu ennyo, ezikola emirimu mingi era eziwangaala.