I-splicer ye-SMT ezenzekelayo sisixhobo esizenzekelayo esisetyenziswa kwimigca yokuvelisa i-surface Mount technology (SMT). Isetyenziselwa ikakhulu ukudibanisa ngokuzenzekelayo i-tape ye-reel (efana ne-carrier tape yamacandelo afana ne-resistors, i-capacitors, i-ICs, njl.) ngaphandle kokumisa umatshini, ngaloo ndlela iqinisekisa ukuqhubeka kwemveliso kunye nokusebenza kakuhle. Oku kulandelayo yintshayelelo eneenkcukacha:
1. Imisebenzi engundoqo
I-automatic splicing: Khangela ngokuzenzekelayo kwaye udibanise iteyiphu entsha ngaphambi kokuba i-reel tape yangaphambili isetyenziswe ukunqanda ukuphazamiseka komgca wemveliso.
Ukuchongwa kweTape: Chonga uhlobo, isandi kunye nobubanzi betape ngokusebenzisa abenzi boluvo okanye iinkqubo ezibonakalayo.
Ukubekwa ngokuchanekileyo: Qinisekisa ulungelelwaniso lweeteyiphu ezintsha nezindala ukunqanda ukutenxa ekubekweni kwecandelo.
Ukuphatha inkunkuma: Susa ngokuzenzekelayo ifilimu yokukhusela okanye inkunkuma yeteyipu.
2. Amacandelo aphambili
Indlela yokuqinisa iteyiphu: Lungisa iiteyiphu ezintsha nezindala ukuqinisekisa uthutho oluzinzileyo.
Iyunithi yokusika / yokudibanisa: Hlukanisa iteyiphu ngokucinezela okutshisayo, i-ultrasound okanye i-tape.
Isixokelelwano soluvo: Khangela isiphelo seteyiphu, ukucinezeleka kunye nendawo yokudibanisa.
Imodyuli yokulawula: I-PLC okanye ulawulo lwekhompyutheni yezoshishino, ixhasa ujongano lomatshini woluntu (HMI).
Isixokelelwano se-alam: iimeko ezingaqhelekanga (ezifana nokusilela kokudibanisa, i-tape offset) zixhokonxa ii-alam.
3. Ukuhamba komsebenzi
Khangela isiphelo se tape: Uluvo lubhaqa ukuba i tape yangoku sele iza kuphelelwa.
Ukulungisa iteyiphu entsha: yondla ngokuzenzekelayo iteyiphu entsha kwaye uyilungelelanise ukulungelelanisa nendala.
Ukuqhawula: ukusika umsila we-tape endala, ulungelelanise nentloko ye-tape entsha kwaye uyibophe (i-tape okanye i-hot press).
Ukuqinisekiswa: khangela ukuqina kwe-splicing kunye nokuchaneka kwendawo.
Qhubeka nemveliso: uqhagamshelwano olungenamthungo ngaphandle kokungenelela ngesandla.
4. Iinzuzo zobugcisa
Ukuphucula ukusebenza kakuhle: ukunciphisa ixesha lokunciphisa izinto eziphathekayo kunye nokuphucula ukusetyenziswa kwezixhobo (OEE).
Ukunciphisa iindleko: kuphephe inkcitho yezinto eziphathekayo kunye neendleko zabasebenzi.
Ukuchaneka okuphezulu: ± 0.1mm ukuchaneka kwe-splicing ukuqinisekisa ukuchaneka komatshini wokubeka.
Ukuhambelana: qhelanisa nobubanzi betape (ezifana ne-8mm, 12mm, 16mm, njl.) kunye neentlobo zecandelo.
5. Iimeko zesicelo
Ukuveliswa kobuninzi: njengemigca yemveliso efuna ukubekwa ngokuqhubekayo kwezinto zombane zabathengi kunye ne-automotive electronics.
Iimfuno ezichanekileyo eziphezulu: ii-PCB ezineemfuno ezingqongqo kwizikhundla zamacandelo (ezifana neemodyuli zonxibelelwano oluqhelekileyo).
Iifektri ezingasetyenziswanga: Idityaniswe ne-AGV kunye neenkqubo ze-MES ukuphumeza imveliso ezenzekelayo ngokupheleleyo.
6. Iimpawu eziphambili kunye nokukhetha
Iimpawu: ASM, Panasonic, Universal Instruments, Juki yasekhaya, YAMAHA, njl.
Amanqaku okukhetha:
Ukuhambelana kwetape yezinto eziphathekayo (ububanzi, izithuba).
Indlela yokudibanisa (i-tape / i-hot pressing / ultrasonic).
Unxibelelwano lonxibelelwano (luxhasa unxibelelwano kunye noomatshini bokubeka).
7. Indlela yophuhliso
Ubukrelekrele: Ukuhlolwa okubonakalayo kwe-AI komgangatho wokudibanisa kunye nokugcinwa kwangaphambili.
Ukuguquguquka: Ukulungelelanisa kwiimfuno zokutshintsha komgca okhawulezayo kwiibhetshi ezincinci kunye neentlobo ezininzi.
Ukonga amandla ohlaza: Nciphisa inkunkuma yezinto kwaye wandise ukusetyenziswa kwamandla.
Isishwankathelo
Umatshini wokufumana izinto ezizenzekelayo ze-SMT sisixhobo esiphambili sokuphucula ukusebenza kakuhle kunye nenqanaba lokuzenzekelayo kwimigca yokuvelisa i-SMT, ilungele ngokukodwa ukuveliswa kwe-elektroniki yanamhlanje kunye nokuxuba okuphezulu kunye neemfuno eziphezulu zemveliso. Ngokunciphisa ukungenelela kwabantu, kunciphisa kakhulu izinga lokungaphumeleli kwemveliso kwaye liyinxalenye ebalulekileyo yeefektri ezihlakaniphile.