I-splicer ye-SMT ezenzekelayo: intshayelelo ebanzi kwimigaqo kunye nezibonelelo
I. Umgaqo ongundoqo
Umgaqo ongundoqo we-SMT ozenzekelayo i-splicer (i-Auto Splicer) kukuphumeza ukudibanisa ngokungenamthungo kweeteyipu ezintsha kunye ezindala ngokusebenzisa iteknoloji ye-automation, ukuqinisekisa ukuba umatshini wokubeka i-SMT awudingi ukuyeka ngexesha lenkqubo yokutshintsha izinto, ngaloo ndlela uqinisekisa ukuqhubeka kwemveliso. Umgaqo wayo wokusebenza ubandakanya ikakhulu ezi khonkco zilandelayo:
Ukufunyanwa kweteyiphu kunye nokubeka
Isixa esiseleyo setape yangoku sijongwa ngexesha langempela ngokusebenzisa inzwa ye-photoelectric okanye inkqubo ebonakalayo, kwaye inkqubo yokudibanisa iqhutywe xa i-tape sele iza kuphelelwa.
Ukuchonga ngokuchanekileyo i-pitch (i-pitch) kunye nobubanzi be-tape ukuqinisekisa ukulungelelaniswa kweeteyiphu ezintsha kunye nezidala.
Itekhnoloji yokudibanisa iteyiphu
I-Mechanical splicing: Sebenzisa izikhokelo ezichanekileyo kunye ne-clamps ukulungisa iiteyiphu ezintsha kunye nezidala ukuqinisekisa ukulungelelaniswa kwendawo.
Indlela yokudibanisa:
Ukudityaniswa kweteyiphu: Sebenzisa iteyiphu ekhethekileyo yokudibanisa ukudibanisa iiteyiphu ezintsha nezindala (zisebenza kuninzi lwamacandelo).
I-Hot press splicing: Bond iiteyipu ngokufudumeza kunye noxinzelelo (olusebenzayo kwizinto ezichasene nobushushu obuphezulu).
I-Ultrasonic welding: Sebenzisa i-vibration ye-high-frequency vibration ukudibanisa iiteyipu (ezisebenzayo kwizinto ezikhethekileyo).
Ukuhluthwa kwenkunkuma: Khupha ngokuzenzekelayo ifilimu ekhuselayo okanye inkunkuma yoluhlu lwezinto eziphathekayo ukuphepha ukuchaphazela umlomo womatshini wokubeka.
Inkqubo yokulawula
Yamkela i-PLC okanye ulawulo lwePC yoshishino, kwaye usebenzisane ne-servo motor ukufezekisa ulawulo lwentshukumo oluchanekileyo.
Inkxaso yonxibelelwano kunye nemishini yokubeka i-SMT (efana ne-Fuji, i-Panasonic, i-Siemens kunye nezinye iimpawu) ukufezekisa ukuvumelanisa idatha.
Ukuqinisekiswa komgangatho
Sebenzisa abenzi boluvo okanye uphononongo olubonakalayo ukufumanisa ukuba imicu yempahla edityanisiweyo ilungelelaniswe kwaye idityaniswe ngokuqinileyo ukuqinisekisa ukuba akukho ntlukwano ekubekweni okulandelayo.
2. Iinzuzo eziphambili
Oomatshini bokuphatha imathiriyeli ye-SMT ngokuzenzekelayo banenzuzo ebalulekileyo ngaphezu kweendlela zokubuyisela imathiriyeli yezandla, ezibonakaliswa ikakhulu kule miba ilandelayo:
Ukuphucula ukusebenza kakuhle kwemveliso
Ukutshintshwa kwezinto zokunciphisa i-Zero: Akukho mfuneko yokumisa umgca wemveliso, imveliso eqhubekayo yeeyure ezingama-24 iphunyeziwe, kunye nokusebenza kakuhle kwezixhobo (OEE) kwanda nge-10% ~ 30%.
Ukunciphisa ixesha lokutshintshwa kwezinto: Ukutshintshwa kwezinto eziphathekayo zemveli kuthatha imizuzwana engama-30 ukuya kwimizuzu emi-2, kunye nokuphathwa kwezinto ezizenzekelayo kuthatha imizuzwana eyi-3 ~ 10 kuphela, enciphisa kakhulu umjikelo wemveliso.
Ukunciphisa iindleko zemveliso
Ukunciphisa inkunkuma yezinto eziphathekayo: Lawula ngokuchanekileyo ubude bomcu wezinto eziphathekayo ukuphepha ilahleko engeyomfuneko ngexesha lokutshintshwa kwezinto eziphathekayo.
Gcina iindleko zabasebenzi: nciphisa ukungenelela kwabaqhubi rhoqo, ngokukodwa ezifanelekileyo kwiishifti zasebusuku okanye iindibano zocweyo ezingenamntu.
Ukuphucula ukuchaneka kokubekwa
± 0.1mm ukuchaneka kokuchaneka okuphezulu, kunqande i-patch offset ebangelwa ukungahambi kakuhle komcu wezinto, kunye nokuphucula izinga lesivuno.
Ifanelekile ukondla okuzinzileyo kwamacandelo amancinci afana ne-0201, i-0402 kunye ne-ICs echanekileyo efana ne-QFN kunye ne-BGA.
Ukuphucula ukuguquguquka kwemveliso
Iyahambelana neentlobo ezahlukeneyo zokuchazwa komcu wezinto (8mm, 12mm, 16mm, njl.), Ukuxhasa iindidi zamacandelo ahlukeneyo.
Ukulungelelaniswa kwizixhobo eziqhelekileyo ze-SMT (ezifana ne-Fuji NXT, i-Panasonic CM, i-ASM SIPLACE, njl.).
Ubukrelekrele kunye nokulandeleka
Inkxaso ye-MES/ERP yokudotshwa kwenkqubo, ukurekhoda ixesha lokufumana izinto, ibhetshi kunye nolunye ulwazi, kwaye uqaphele ukulandelwa kwedatha yemveliso.
Ngomsebenzi ongaqhelekanga we-alarm (njengokuqhekeka kwezinto eziphathekayo, ukungaphumeleli kwe-splicing), ukunciphisa umngcipheko weemveliso ezineziphene.
III. Iimeko zosetyenziso oluqhelekileyo
I-elektroniki yabathengi: ukubekwa kwePCB enkulu yeefowuni eziphathwayo, iitafile, njl.
I-Automotive electronics: ukuveliswa kwezixhobo zebakala lemoto ezineemfuno eziphezulu zokuthembeka.
Izixhobo zonyango / zonxibelelwano: iimfuno eziphakamileyo zokuzinza kumacandelo achanekileyo.
4. Iindlela zophuhliso lwexesha elizayo
Ukuhlolwa okubonakalayo kwe-AI: Idityaniswe nokufunda komatshini ukuze kuphuculwe umgwebo womgangatho we-splicing.
Ukudityaniswa kwe-Intanethi yezinto (IoT): Ukubekwa esweni okude kwesimo sesixhobo ukufezekisa ukugcinwa kwangaphambili.
Uyilo oluguquguqukayo ngakumbi: Ukulungelelanisa iimfuno zeebhetshi ezincinci kunye neendidi ezininzi zokutshintsha komgca okhawulezayo.
Isishwankathelo
I-SMT feeder ezenzekelayo ifezekisa uqhagamshelo olungenamthungo lwemveliso ye-SMT ngokusebenzisa i-high-chane sensing, ulawulo oluhlakaniphile kunye nobuchwepheshe obuphezulu bokudibanisa, kwaye ineenzuzo ezingenakubuyiselwa ekuphuculeni ukusebenza kakuhle, ukunciphisa iindleko kunye nokuqinisekisa umgangatho. Njengoko imveliso ye-elektroniki iphuhlisa ukuya kubukrelekrele, i-fidter ezenzekelayo iya kuba sisixhobo esiqhelekileyo sokuxuba okuphezulu, imigca yemveliso ye-SMT ephezulu.