Ebitundu Ebisinga Obunene
Module ennene n’ebintu eby’empuliziganya, eby’emmotoka oba eby’amakolero biyinza okwetaaga okufulumya okuteekebwa okw’amaanyi ne bwe kiba nti ekibiina kirimu dies eziweebwa wafer oba ebitundu eby’enjawulo.
ave okutuuka ku 70% ku SMT Parts – Mu Stock & Ready to Ship
Funa Quote →SIPLACE CA4 yakolebwa okukola ebirina okugatta ebifulumizibwa mu kuteeka waggulu, ensengeka ennene eza substrate n’amakubo g’ebintu agasukka mu limu. Enzimba yaayo esobola okuleeta dies eziweebwa wafer, ebitundu by’emmere n’ebikozesebwa mu tray mu nkola ekwatagana ey’okukuŋŋaanya modulo za semiconductor, ebyuma eby’amasannyalaze eby’omugatte n’okupakinga okw’omulembe mu kitundu ekinene.
Okugaba die obutereevu, maapu za wafer n’okukwata die
SMDs, trays n’ebitundu ebipakiddwa
Okugatta okuteekeddwawo kw’enkola za wafer, ebifo ebiweebwa ebitundu, emitwe gy’okuteeka ne pulogulaamu zitegeeza obusobozi bwa buli kyuma kya CA4.
CA4 ya mulembe ogwasooka ogw’ebyuma bya SIPLACE CA ebyatondebwa okutabula ebitundu eby’ennono ebiteekebwa ku ngulu n’ebifa ebiweebwa okuva mu wafers. Ekigendererwa kyayo tekyali kya kukola mangu mounter eya standard yokka; yali ya kuwa okufulumya ebyuma eby’amasannyalaze eby’obuzito obw’amaanyi ekkubo ery’omugaso ery’okugattako enkwata ya semiconductor die awatali kwawula buli kintu mu layini za SMT ne die-bonding ezitaliiko kakwate.
OmuASM SIPLACE CA4ye nkola ya sipiidi ey’amaanyi, ey’okukuŋŋaanya chip mu kitundu ekinene okuva mu famire ya SIPLACE CA. Ekozesa enzimba y’okuteeka ebifo bina era esobola okutegekebwa n’okugatta okw’enjawulo okw’ebifo ebya bulijjo eby’okugabira ebitundu ne SIPLACE Wafer Systems.
Ensengeka eno ey’ebintu esobola okuteekebwateekebwa y’enjawulo wakati wakati wa CA4 ne SMT mounter eya bulijjo eriko feeder yokka. Ekyuma kimu kiyinza okutegekebwa ebitundu ebipakiddwa, okukwata obutereevu wafer-die oba okugatta byombi, okusinziira ku nkyusa ya CA4 entongole ne modulo eziteekeddwamu.
Module ez’omulembe ziyinza okubaamu ebikumi oba enkumi n’ebikumi by’ebitundu ebya bulijjo awamu ne bare dies, sensors, MEMS devices oba flip-chip parts. Layini ya feeder yokka ekwata bulungi ekitundu kya SMD, ate die bonder eyetongodde ekwata ebintu bya wafer naye eyinza obutakwatagana na output y’okuteeka oba substrate format y’emu.
Omukutu gwa CA4 gwakolebwa okukendeeza ku bbanga eryo nga gugatta tekinologiya w’okuteeka SIPLACE ow’amaanyi amangi n’okukwata wafer za CA-series. Kino kigifuula ekwatagana nga throughput, substrate area n’okugabibwa kw’ebintu ebitabuddwa birina okulowoozebwako wamu.
Omuwendo gwa CA4 guva mu kukwasaganya ebifulumizibwa, ekifo we bakolera n’okukwata ebintu ebitabuddwa okusinga okulongoosa emu yokka ku nsonga zino.
Module ennene n’ebintu eby’empuliziganya, eby’emmotoka oba eby’amakolero biyinza okwetaaga okufulumya okuteekebwa okw’amaanyi ne bwe kiba nti ekibiina kirimu dies eziweebwa wafer oba ebitundu eby’enjawulo.
Ebyuma ebikozesebwa mu byuma bikalimagezi ebiri ku ddaala lya panel, embedded ne large-format byetaaga ebisinga ku bituufu ebitonotono. Conveyor range, support strategy n’okuteekebwa mu ngeri ennywevu mu kifo kyonna we bakolera bifuuka bikulu kyenkanyi.
Ekintu ekimu kiyinza okwetaagisa emmere y’obutambi, ttaayi, emmeeza z’ebitundu n’okugabira wafer obutereevu. Ensengekera za CA4 zisobozesa amakubo gano ag’ebintu okugattibwa okwetoloola omutabula gw’okufulumya ogwetaagisa.
Omukutu gusinga kuba gwa mugaso nga ekintu kyetaaga obuzito bw’okuteekebwa waggulu oba ekifo ekinene we bakolera awamu n’okukwata ebintu ebitali bya mutindo gwa semikondokita.
CA4 erina okwekenneenya ng’enkola y’okukuŋŋaanya enzijuvu. Emitwe gy’okuteeka gikulu, naye girina okukwatagana n’okugaba ebintu, okulaba, entambula ne pulogulaamu.
Ebifo bina ebiteekeddwawo eby’okuteeka biwa ensengeka ya pulatifomu okukola ku bifulumizibwa ebingi. Ekika ky’omutwe n’embeera y’okukola bye bisalawo ekitundu kyennyini ekiwanvu n’obutuufu.
Module za SWS ziddukanya wafer frames, die pickup, wafer data n’okukyusa dies mu nkola y’okuteeka.
Emmeeza z’ebitundu, X feeders, trays ne modules endala ezigaba ziwagira SMD ezipakiddwa n’ebintu ebiyamba.
Kkamera za PCB, kkamera z’ebitundu n’emirimu gy’okulaba omutwe bizuula fiducials, ebitundu n’ebifa nga tebinnaba kuteekebwa mu ngeri efugibwa.
Ensengeka ya conveyor, obuyambi bwa substrate, software ya siteegi ne SIPLACE Pro data bye bisalawo okugatta layini n’okukola pulogulaamu y’ebintu.
Okutuuma amannya ga CA4 ag’omulembe kukwatagana n’okugatta okw’enjawulo okwa SIPLACE Wafer Systems n’ebifo ebya bulijjo eby’okugaba ebitundu. Enjawulo eno yeetaagibwa nnyo ng’onoonya ekyuma ekikozesebwa kubanga ensengeka essatu zigendereddwamu okutabula ebintu eby’enjawulo.
| Okusengeka | SIPLACE Enkola za Wafer | Ebifo by’Okugaba Ebitundu | Ebifo eby’okuteekebwamu | Essira ly’okufulumya erya bulijjo |
|---|---|---|---|---|
| SIPLACE CA4-4 | Ebifo bina eby’enkola ya wafer | Tewali bifo bya bulijjo eby'emmeeza-emmeeza mu nsengeka ewandiikiddwa | Bana | Okulongoosa okw’obunene obufugibwa die eziweebwa wafer n’ebitundu bya semikondokita |
| SIPLACE CA4-2 | Ebifo bibiri eby’enkola ya wafer | Ebifo bibiri ebya bulijjo eby’okugaba ebitundu | Bana | Okukola eby’omugatte mu ngeri ey’enjawulo nga kugatta ebintu bya wafer obutereevu n’ebitundu ebiweebwa emmere oba emmeeza |
| SIPLACE CA4 | Tewali bifo bya wafer-system mu nsengeka ya base ewandiikiddwa | Ebifo bina ebya bulijjo eby’okugaba ebitundu | Bana | Okuteeka mu kifo ekinene ku sipiidi ey’amaanyi nga tukozesa ebitundu ebipakiddwa, ttaayi n’amakubo g’ebintu ebya bulijjo |
Omutendera omutuufu gusinziira ku kivaamu, naye layini ya CA4 etegekeddwa okutwalira awamu ekwasaganya okuteekateeka substrate, amakubo g’ebintu amangi, okuteeka mu butuufu n’enkola ya data mu mitendera mukaaga.
Programs, wafer maps, feeders, trays, component shapes, nozzles ne substrate data zitegekebwa okukuŋŋaanyizibwa okwetaagisa.
Ebipande ebinene, ebipande oba ebitwala modulo biyingira mu conveyor era ne bitebenkeza enkola y’obuyambi etegekeddwa.
Enkola za wafer, emmeeza z’ebitundu, ebigabula obutambi oba tray ziraga die eyeetaagisa n’okutabula ebitundu ebipakiddwa.
Fiducials, dies ne components zeekebejjebwa ne zikwatagana nga tezinnaba kuteekebwa mu kifo kyonna we bakolera.
Ebifo bina eby’okuteeka bigabanya omutabula gw’ebitundu okusobola okutebenkeza ebifulumizibwa, obutuufu n’okutambula kw’ebintu.
Ebivudde mu kuteeka n’ebiwandiiko by’okufulumya biterekebwa nga substrate tennagenda mu kuddamu okukulukuta, okuwonya, okwekebejja oba oluvannyuma enkola z’okupakinga.
CA4 yaweebwa mu nsengeka n’emilembe egiwerako. Emiwendo wansi ginnyonnyola enteekateeka ya CA4 ey’amaanyi ewandiikiddwa ennyo era girina okukeberebwa okusinziira ku kyuma kinnoomu.
Sipiidi ey’erinnya ya mugaso mu kugeraageranya okusooka, naye tekakasa busobozi bwa wafer obutereevu, okutabula kw’omutwe okuteekeddwa oba ekifo eky’okukoleramu ekiyinza okukozesebwa ku butuufu obwetaagisa.
| Ekintu ekijuliziddwa | Omuwendo ogutera okuwandiikibwa | Biki Ebirina Okukakasibwa |
|---|---|---|
| Sipiidi y’okuteeka | Ebitundu ebituuka ku nga 126,500 buli ssaawa | Okugatta emitwe, okutabula ebitundu, ekkubo ly’enkola n’okulongoosa pulogulaamu |
| Obutuufu bw’okuteeka | Nga ±15 μm ku 3 sigma mu nsengekera ya C&P20 M2 / CPP M ewandiikiddwa | Ebiwandiiko by’omutwe ebiteekeddwamu, kiraasi y’okupima n’ekifo we bakolera ekikozesebwa |
| Obusobozi bw’omugabi w’emmere | Module ezituuka ku 160 eza tape-feeder mu nsengeka y’okugabira eya bulijjo | Ensengeka entuufu ey’emmeeza y’ebitundu era nga mulimu n’ebigaali ebigabula |
| Ensengekera y’ebitundu | Small-chip okuyita mu nga 15 × 15 mm okusinziira ku mutwe | Ebintu ebikwata ku mutwe ebitono, ebisinga obunene, obuwanvu n’ebikozesebwa mu kusitula |
| Enkula ya substrate | Nga mm 50 × 50 okutuuka ku mm 650 × 700 mu nsengeka eziwandiikiddwa | Ekika kya conveyor, obutuufu obwetaagisa, obuwagizi n’obulagirizi bw’entambula |
| Obugumu bwa substrate | Nga mm 0.3 ku 4.5 | Ebintu bya board, warpage, carrier ne clamping ebyetaago |
| Ebipimo by’ekyuma | Nga mm 1,950 × 2,740 × 1,572 | Enkyusa entuufu, eby’okulonda, okugogola empeereza n’ensengeka ya layini |
| Obuzito bw’ekyuma | Kiro nga 3,674 | Ensengeka y’okusindika, okutikka wansi ne modulo ezirimu |
| Amasannyalaze agaweebwa | 3 × 380 okutuuka ku 415 V, 50/60 Hz mu bifo ebiwandiikiddwa | Ekipande ky’erinnya ly’ekyuma n’ebikozesebwa mu kkolero ly’ekifo w’ogenda |
| Empewo enyigirizibwa | Nga 0.5 ku 1.0 MPa | Puleesa eyeetaagisa, omutindo, enkozesa n’okuyungibwa |
Ebipande ebinene ne substrates bireeta embeera z’ebyuma n’ez’amaaso eziyinza okukosa omutindo gw’okuteeka. Ebivaamu ebitebenkevu bisinziira ku buwagizi, okukola maapu, fiducials n’enkolagana wakati w’obutuufu n’ekifo we bakolera.
Substrates ennene oba ennyimpi zisobola okufukamira wansi w’obuzito bwazo. Ppini, ebisitula oba ebikozesebwa ebiwanirira ebiweereddwayo birina okutebenkeza ekifo we bateeka.
Fiducials ez’omu kitundu n’ez’ensi yonna ziyamba okusasula okugaziwa kwa substrate, okukyusakyusa n’enjawulo mu bipimo mu kitundu ekinene eky’okukoleramu.
Obugazi bwa bboodi, obuwanvu, obuzito n’obuwanvu bw’empenda bye bisalawo oba entambula eya mutindo oba eky’okutwala eky’enjawulo kyetaagisa.
Enteekateeka zirina okugabanya ebitundu mu bifo eby’okuteeka ate nga zikoma ku ntambula, okwewala okutomeragana n’okukuuma obudde bwa takt.
Ensengeka ya CA4 erongooseddwa erina okulaga engeri ebitundu ebisinga gye biyingira mu nkola. Ekintu ekisingamu wafer kyetaagisa ekyuma eky’enjawulo okusinga ekipande ekinene ekifugibwa feeder.
SIPLACE Wafer Systems eyanjula dies ezitaliiko kintu kyonna okusobola okuzitwala okusinziira ku maapu za wafer n’ensengeka y’okukwata die essiddwawo.
Feeders eza SIPLACE eza bulijjo ziwa ebitundu ebitaliiko kye bikola, IC ezipakiddwa n’ebintu ebirala ebikozesebwa mu tape-and-reel ku output enkulu.
JEDEC trays, component tables ne application-specific carriers zikwata ebitundu ebitasaana kupakinga tape.
Bombi ba famire ya CA, naye tebalina kutwalibwa ng’abakyusibwakyusibwa. CA4 ye legacy high-volume four-position platform nga erina enkyukakyuka eziwerako ez’ensengeka y’ebintu, ate CA2 nkola mpya compact hybrid eyakolebwa okwetoloola integrated SMT, die-attach ne flip-chip production.
Ekisinga okwekenneenyezebwa ekintu, layini oba enkola eyaliwo we yalina ebisaanyizo okwetoloola CA4, oba ebifo bina eby’okuteeka, okukwata ekitundu ekinene n’ensengeka za SWS ez’edda byetaagibwa.
Esinga okutuukagana ne ttiimu ezeekenneenya omukutu gwa CA omupya nga gulina okuteekebwako obutereevu-wafer die attach, flip-chip, SMT placement, multi-wafer exchange n’emirimu egy’omulembe egy’okulondoola.
CA4 ekozesebwa eyinza okuba nga nnungi mu byuma naye nga ekyatasaana ku kkolero singa entambula, software, material logistics oba takt time tezikwatagana.
Kakasa obuwanvu bwa conveyor, direction, board handoff, okutereeza obugazi n’okukwatagana n’ebyuma ebiri waggulu ne wansi.
Bala obudde bw’okuteeka okusinziira ku famire y’ebitundu n’ekkubo ly’ebintu okusinga okugeraageranya CPH ey’erinnya yokka.
Weekenneenye enkyusa ya SIPLACE Pro, pulogulaamu ya siteegi, layisinsi, amaterekero g’ebitundu n’okukwatagana kw’enkolagana.
Tegeka wafer frames, feeder carts, trays, changeovers, okutereka n’okujjuza okwetoloola ensengeka ya CA4 erongooseddwa.
Omukutu guno gukwatagana nga obunene bw’ebintu, obungi bw’ebitundu n’enjawulo y’ebintu bifuula ekkubo eryangu ery’okufulumya ery’emmere yokka obutakola bulungi.
Module ezirina ebitundu ebingi nga zigatta passives, packaged ICs ne dies emu oba eziwera eziweebwa wafer.
Paneli ne substrates ennene ezeetaaga okubala ebitundu ebingi, okuwanirira bboodi okunywevu n’okuteekebwa mu butuufu mu kifo kyonna we bakolera.
RF, modulo z’omukutu n’ebizimbe nga tukozesa omuwendo gw’ebitundu ebinene n’ebyuma eby’enjawulo ebya semikondokita.
Module z’okufuga, okutegeera n’amaanyi ezeetaaga okuteekebwawo okuddiŋŋana, okukwata ebintu okulondoolebwa n’okuwagira substrate ennywevu.
Assemblies ezigatta sensitive dies, packaged drivers, passives ne application-specific carriers.
Okukyusa okufulumya, okugaziya obusobozi n’okukyusa-ebyuma pulojekiti ezizimbibwa okwetoloola pulogulaamu za CA4 eziriwo n’okukkiriza enkola.
Ebyuma bya CA4 bisobola okwawukana mu mulembe, ensengeka y’ebintu, emitwe, ekika kya kkamera, conveyor ne software. Okukwatagana okutuufu kw’ebyuma kwetaaga obujulizi obw’omubiri ne pulogulaamu okuva mu yuniti ssekinnoomu.
Ebiwandiiko ebitegeerekeka obulungi bikendeeza ku bulabe bw’okufuna ekyuma ekirina erinnya ly’ekyokulabirako ekituufu naye nga kirimu ebintu oba ensengeka y’enkola enkyamu.
Okukwatagana kw’ekyuma n’ekitundu ekikyusiddwa kulina okukozesa akabonero ka modulo akassiddwawo, ennamba y’ekitundu eyasooka, amawulire agakwata ku mutendera n’okukozesa okusinga erinnya ly’ekyokulabirako kya CA4 lyokka.
Geraageranya CA4 n’emikutu egy’enjawulo egy’okukuŋŋaanya die-attach ne semiconductor ku nkola ez’enjawulo.
Laba Ebikozesebwa mu Die Bonder → Okugaba EbikozesebwaObuwagizi bwa feeder units ezikwatagana, obugazi bwa tape, ebitundu bya feeder n’ensengeka z’ebintu ebifulumya.
Laba Ebiweebwayo bya ASM → Obuwagizi bw'okusengekaWeereza ebiwandiiko by’ebyuma, ebifaananyi bya modulo, ennamba z’ebitundu n’ebyetaago by’okufulumya okwekenneenya.
Teesa ku Kyetaagisa Kyo →Eby’okuddamu eri ttiimu ezeekenneenya okukuŋŋaanya kwa CA4 mu kitundu ekinene, ensengeka z’enkola ya wafer, okufulumya eby’edda n’ebyuma ebikozesebwa.
Ye nkola ya sipiidi ey’amaanyi, ey’okukuŋŋaanya chip mu kitundu ekinene okuva mu famire ya SIPLACE CA. Ekozesa ebifo bina eby’okuteeka era esobola okutegekebwa n’okugabira ebitundu ebya bulijjo, SIPLACE Wafer Systems oba byombi nga bigattiddwa.
Yakolebwa ku bintu ebyetaagisa okuteekebwa kwa SMD ezifulumya amaanyi amangi wamu ne wafer-supplied semiconductor dies. Omukutu gwasobozesa amakubo gano ag’ebintu okugattibwa obulungi mu mbeera emu ey’okufulumya.
Amannya ag’edda gakwatagana n’okugatta okw’enjawulo okwa SIPLACE Wafer Systems n’ebifo ebya bulijjo eby’okugaba ebitundu. CA4-4 efugibwa enkola ya wafer, CA4-2 egatta ebifo bibiri eby’okugabira wafer n’ebibiri ebya bulijjo, era ensengeka y’omusingi gwa CA4 ewandiikiddwa ekozesa ebifo eby’okugabira ebya bulijjo.
Nedda.Obusobozi bwa wafer obutereevu businziira ku oba SIPLACE Wafer Systems ne hardware ne software ebyetaagisa okukwata die-handling biteekeddwa mu mubiri ku kyuma kinnoomu.
Nedda Okusinziira ku nsengeka, esobola okukozesebwa mu kuteeka SMT okwa bulijjo, okukwata wafer-die, okuyunga ku die, flip-chip oba okukuŋŋaanya okutabuliddwa. Obunene bw'enkola obwennyini bulina okukakasibwa okuva mu modulo eziteekeddwawo.
Ensengeka ya sipiidi eya waggulu etera okuwandiikibwa ebalirirwamu ebitundu nga 126,500 buli ssaawa. Ebifulumizibwa ebituufu bisinziira ku mitwe, okutabula ebitundu, emirimu gya wafer, obunene bwa substrate, amabanga g’okutambula ne bbalansi ya layini.
Ensengeka eziwandiikiddwa ziwagira ensengeka za substrate ennene, naye obunene obukozesebwa businziira ku nteekateeka ya conveyor, obutuufu bw’okuteeka, ebikozesebwa ebiwagira, obuwanvu bwa substrate n’enkyusa y’ekyuma.
CA4 ye pulatifomu enkadde ey’ebifo bina ng’erina wafer eziwerako n’ensengeka z’ebintu eza bulijjo. CA2 ye nkola empya ey’omugatte (integrated hybrid platform) ng’erina obusobozi obufulumiziddwa obwa direct-wafer die-attach, flip-chip, SMT ne multi-wafer exchange.
Okugatta kisoboka nga conveyor flow, station software, SIPLACE Pro compatibility, component libraries, factory interfaces, utilities ne line takt ebyetaago bikwatagana.
Kakasa omulembe, ennamba y’omuddiring’anwa, ebifo byonna ebina we biteekebwa, ebiwandiiko by’omutwe, enkola za wafer, emmeeza z’ebitundu, ensengeka y’emmere, kkamera, conveyor, software, layisinsi, embeera y’ekyuma n’ebikozesebwa ebirimu.
Obunene bw’okugaba bwawukana okusinziira ku yuniti ne quotation. Buli feeder cart, wafer module, nozzle set, tray system, carrier ne spare part zirina okuwandiikibwa kinnoomu nga tonnagula.
Sindika amakubo g’ebintu ageetaagisa, enkola ya wafer, ekitundu ekinene, ebipimo bya substrate, ekifulumizibwa ekigendererwa, ensengeka ya CA4 gy’oyagala n’ekifo w’ogenda okukwatagana n’ebyuma.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.