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xhHigh Component Counts
Large modules and communication, automotive or industrial products may require high placement output even when the assembly contains wafer-supplied dies or specialized components.
HIGH-SPEED LARGE-AREA HYBRID ASSEMBLY
ASM SIPLACE CA4 Large-Area Chip Assembly Platform
The SIPLACE CA4 was developed for production that must combine high placement output, large substrate formats and more than one material route. Its configurable architecture can bring wafer-supplied dies, feeder components and tray materials into a coordinated assembly process for semiconductor modules, hybrid electronics and large-area advanced packaging.
CA4 PLACEMENT ARCHITECTURE
01Placement Position
02Placement Position
03Placement Position
04Placement Position
Material Route ASIPLACE Wafer Systems
Direct die supply, wafer maps and die handling
+
Material Route BFeeders & Component Tables
SMDs, trays and packaged components
The installed combination of wafer systems, component-supply positions, placement heads and software defines the capability of each CA4 machine.
CA4 · CA4-2 · CA4-4Legacy Configuration Family
Four Placement PositionsHigh-Output Platform Architecture
Wafer + Feeder MaterialsMixed Assembly Capability
Large-Area SubstratesConfiguration Dependent
Why the Platform Was Developed
When High-Speed SMT Placement and Wafer-Die Assembly Must Share One Line
The CA4 belongs to an earlier generation of SIPLACE CA equipment created to mix traditional surface-mount components with dies supplied from wafers. Its purpose was not simply to make a standard mounter faster; it was to give high-volume electronics production a practical route for adding semiconductor die handling without separating every product into unrelated SMT and die-bonding lines.
What Is the ASM SIPLACE CA4?
The ASM SIPLACE CA4 is a high-speed, large-area chip assembly platform from the SIPLACE CA family. It uses a four-position placement architecture and can be configured with different combinations of conventional component-supply positions and SIPLACE Wafer Systems.
This configurable material layout is the central difference between the CA4 and a conventional feeder-only SMT mounter. One machine can be arranged for packaged components, direct wafer-die handling or a combination of both, depending on the specific CA4 version and installed modules.
The Manufacturing Gap Addressed by CA4
Advanced modules may contain hundreds or thousands of conventional components together with bare dies, sensors, MEMS devices or flip-chip parts. A feeder-only line handles the SMD portion efficiently, while a dedicated die bonder handles wafer materials but may not match the same placement output or substrate format.
The CA4 platform was designed to reduce that gap by combining high-output SIPLACE placement technology with CA-series wafer handling. This makes it relevant where throughput, substrate area and mixed material supply must be considered together.
Production Drivers
Three Reasons Manufacturers Use a CA4-Type Platform
The value of the CA4 comes from coordinating output, working area and mixed material handling rather than optimizing only one of these factors.
Large Substrates and Panels
Panel-level, embedded and large-format electronics require more than small-package accuracy. Conveyor range, support strategy and stable placement across the working area become equally important.
Mixed Supply Formats
One product can require tape feeders, trays, component tables and direct wafer supply. CA4 configurations allow these material routes to be combined around the required production mix.
Process-Fit Decision
When a SIPLACE CA4 Is the Right Type of Machine
The platform is most useful when a product requires high placement volume or a large working area together with non-standard semiconductor material handling.
Strong CA4 Applications
- Products combining SMDs and wafer-supplied dies
- Large panels, embedded boards or specialized substrates
- High component counts requiring several placement positions
- SiP and hybrid modules using several material formats
- Direct wafer processing with production-scale output
- Lines that need SIPLACE feeder and software compatibility
- Legacy products already qualified on CA4 equipment
Processes Requiring Additional Review
- Very large dies beyond the installed head range
- Thermocompression or heated-bonding processes
- High-force placement or curing within the bonder
- Special dispensing sequences not available on the machine
- Wafer formats unsupported by the installed SWS modules
- Ultra-high-accuracy work beyond the configured CA4 class
- Products requiring dedicated die-bonder process chambers
System Architecture
Five Systems That Define CA4 Production Capability
A CA4 should be evaluated as a complete assembly system. The placement heads are important, but they must be matched with material supply, vision, transport and software.
Placement Positions
Four installed placement positions provide the platform structure for high-output processing. Head type and working condition determine the actual component range and accuracy.
SIPLACE Wafer Systems
SWS modules manage wafer frames, die pickup, wafer data and the transfer of dies into the placement process.
Component Supply
Component tables, X feeders, trays and other supply modules support packaged SMDs and auxiliary materials.
Vision and Alignment
PCB cameras, component cameras and head vision functions identify fiducials, components and dies before controlled placement.
Transport and Software
Conveyor configuration, substrate support, station software and SIPLACE Pro data determine line integration and product programming.
Legacy Configuration Family
Understanding CA4, CA4-2 and CA4-4 Material Layouts
Legacy CA4 naming is associated with different combinations of SIPLACE Wafer Systems and conventional component-supply positions. This distinction is essential when sourcing a used machine because the three layouts are intended for different material mixes.
| Configuration | SIPLACE Wafer Systems | Component-Supply Positions | Placement Positions | Typical Production Focus |
|---|---|---|---|---|
| SIPLACE CA4-4 | Four wafer-system positions | No conventional component-table positions in the documented layout | Four | High-volume processing dominated by wafer-supplied dies and semiconductor components |
| SIPLACE CA4-2 | Two wafer-system positions | Two conventional component-supply positions | Four | Balanced hybrid production combining direct wafer materials with feeder or table-supplied components |
| SIPLACE CA4 | No wafer-system positions in the documented base layout | Four conventional component-supply positions | Four | High-speed large-area placement using packaged components, trays and conventional material routes |
Configuration names alone should not be used as final proof of the installed layout. Confirm the machine nameplate, station records, physical modules, placement heads, wafer systems and software before quotation.
Hybrid Production Workflow
How a CA4 Coordinates Large-Area Mixed Assembly
The exact sequence depends on the product, but a configured CA4 line generally coordinates substrate preparation, multiple material routes, precision placement and process data in six stages.
Product Setup
Programs, wafer maps, feeders, trays, component shapes, nozzles and substrate data are prepared for the required assembly.
Substrate Loading
Large boards, panels or module carriers enter the conveyor and are stabilized by the configured support system.
Material Presentation
Wafer systems, component tables, tape feeders or trays present the required die and packaged component mix.
Vision Alignment
Fiducials, dies and components are inspected and aligned before placement across the working area.
Parallel Placement
Four placement positions distribute the component mix to balance output, accuracy and material travel.
Data and Transfer
Placement results and production records are stored before the substrate moves to reflow, curing, inspection or later packaging processes.
Reference Machine Data
Commonly Documented SIPLACE CA4 Equipment Values
The CA4 was supplied in several configurations and generations. The values below describe a commonly documented high-speed CA4 setup and should be checked against the individual machine.
Do Not Select a Used CA4 from One Number Alone
Nominal speed is useful for initial comparison, but it does not confirm direct-wafer capability, the installed head mix or the usable working area at the required accuracy.
- Head configuration affects speed and component range
- SWS quantity determines direct wafer capacity
- Conveyor mode affects the supported substrate area
- Software and licenses affect usable process functions
- Machine condition affects repeatability and output
| Reference Item | Commonly Documented Value | What Must Be Confirmed |
|---|---|---|
| Placement speed | Up to approximately 126,500 components per hour | Head combination, component mix, process route and software optimization |
| Placement accuracy | Approximately ±15 µm at 3 sigma in a documented C&P20 M2 / CPP M configuration | Installed head labels, calibration class and applicable working area |
| Feeder capacity | Up to 160 tape-feeder modules in a conventional supply configuration | Actual component-table layout and included feeder carts |
| Component range | Small-chip through approximately 15 × 15 mm depending on head | Head-specific minimum, maximum, height and pickup tooling |
| Substrate size | Approximately 50 × 50 mm to 650 × 700 mm in documented configurations | Conveyor type, accuracy requirement, support and transport direction |
| Substrate thickness | Approximately 0.3 to 4.5 mm | Board material, warpage, carrier and clamping requirements |
| Machine dimensions | Approximately 1,950 × 2,740 × 1,572 mm | Exact version, options, service clearance and line layout |
| Machine weight | Approximately 3,674 kg | Shipping configuration, floor loading and included modules |
| Power supply | 3 × 380 to 415 V, 50/60 Hz in documented installations | Machine nameplate and destination-factory utilities |
| Compressed air | Approximately 0.5 to 1.0 MPa | Required pressure, quality, consumption and connection |
Large-Area Process Control
Why a Large Working Area Requires More Than a Wide Conveyor
Large panels and substrates introduce mechanical and optical conditions that can affect placement quality. Stable results depend on support, mapping, fiducials and the relationship between accuracy and working area.
Warpage Management
Large or thin substrates can bow under their own weight. Pins, carriers or dedicated support tooling must stabilize the placement surface.
Fiducial Strategy
Local and global fiducials help compensate for substrate expansion, rotation and dimensional variation across a large working area.
Conveyor and Clamping
Board width, thickness, weight and edge clearance determine whether standard transport or a specialized carrier is required.
Placement Distribution
Programs must divide components among placement positions while limiting travel, avoiding collisions and protecting takt time.
Material Supply Strategy
Three Material Routes Used in CA4 Production
The selected CA4 layout should reflect how most components enter the process. A wafer-dominated product requires a different machine than a feeder-dominated large panel.
Direct Wafer Supply
SIPLACE Wafer Systems present bare dies for pickup according to wafer maps and the installed die-handling configuration.
- Known-good-die data
- Wafer-frame compatibility
- Die ejector and transfer
- Direct die placement
Tape and Feeder Supply
Conventional SIPLACE feeders provide passive components, packaged ICs and other tape-and-reel materials at high output.
- X feeder compatibility
- Multiple tape widths
- Fast replenishment
- High component capacity
Trays and Special Carriers
JEDEC trays, component tables and application-specific carriers handle components that are unsuitable for tape packaging.
- Large packaged devices
- Sensitive components
- Prototype and low-volume materials
- Special substrate or carrier formats
Platform Selection
SIPLACE CA4 or SIPLACE CA2?
Both belong to the CA family, but they should not be treated as interchangeable. The CA4 is a legacy high-volume four-position platform with several material-layout variants, while the CA2 is a newer compact hybrid system developed around integrated SMT, die-attach and flip-chip production.
SIPLACE CA4
Best evaluated where an existing product, line or process was qualified around CA4, or where four placement positions, large-area handling and legacy SWS configurations are required.
- Four-position machine architecture
- CA4, CA4-2 and CA4-4 layouts
- Large-area and high-volume assembly focus
- Strong relevance for legacy qualified production
- Machine capability varies sharply by installed layout
SIPLACE CA2
Better suited to teams evaluating a newer CA platform with defined direct-wafer die attach, flip-chip, SMT placement, multi-wafer exchange and modern traceability functions.
- Integrated hybrid placement concept
- Direct-wafer die attach and flip chip
- Modern wafer exchange architecture
- Defined 10, 15 and 20 µm accuracy classes
- Designed for connected advanced-packaging lines
Line Integration
Four Checks Before Adding a CA4 to an Existing Line
A used CA4 may be mechanically sound but still unsuitable for a factory if transport, software, material logistics or takt time are not aligned.
Substrate Flow
Confirm conveyor height, direction, board handoff, width adjustment and compatibility with upstream and downstream equipment.
Line Balance
Calculate placement time by component family and material route rather than comparing only nominal CPH.
Software Environment
Review SIPLACE Pro version, station software, licenses, component libraries and interface compatibility.
Material Logistics
Plan wafer frames, feeder carts, trays, changeovers, storage and replenishment around the selected CA4 configuration.
Application Areas
Products That Benefit from CA4 Large-Area Hybrid Assembly
The platform is relevant where product size, component quantity and material diversity make a simple feeder-only production route inefficient.
System-in-Package Modules
Multi-component modules combining passives, packaged ICs and one or more wafer-supplied dies.
Large-Area Hybrid Electronics
Panels and large substrates requiring high component counts, stable board support and accurate placement across the working area.
Communication Equipment
RF, network and infrastructure modules using dense component populations and specialized semiconductor devices.
Automotive Electronics
Control, sensing and power modules requiring repeatable placement, traceable material handling and robust substrate support.
Power and Sensor Modules
Assemblies that combine sensitive dies, packaged drivers, passives and application-specific carriers.
Legacy Qualified Products
Production transfers, capacity expansion and replacement-machine projects built around existing CA4 programs and process approvals.
Used-Machine Verification
What Must Be Confirmed on an Available SIPLACE CA4
CA4 machines can differ in generation, material layout, heads, camera type, conveyor and software. A correct equipment match requires physical and software evidence from the individual unit.
Configuration Evidence to Request
Clear documentation reduces the risk of receiving a machine that has the correct model name but the wrong material or process layout.
- Machine nameplate and complete serial number
- CA4, CA4 V2 or other generation information
- Photographs of all four placement positions
- Head model labels and camera configuration
- SWS quantity and wafer-system details
- Component-table, feeder-cart and tray layout
- Conveyor, support tooling and board range
- Station software and SIPLACE Pro information
- Running test, calibration and maintenance records
Machine generationConfirm whether the equipment is CA4, CA4 V2 or another documented variation.
Placement headsVerify exact head names, head quantity, operating hours, calibration and component range.
Wafer systemsConfirm SWS quantity, wafer size, transfer units, cameras and included wafer accessories.
Supply positionsIdentify component tables, feeder modules, tray units and included carts.
Vision hardwareCheck PCB camera type, component cameras, lighting and software compatibility.
Transport systemConfirm substrate range, direction, support, clamps and available carriers.
SoftwareReview station version, licenses, line programs, component libraries and communication interfaces.
Supply scopeList feeders, nozzles, spare parts, manuals, tooling, export packing and installation support.
Equipment and Parts Support
Support for SIPLACE CA4 Machines and Production Modules
Machine and replacement-part matching should use the installed module label, original part number, serial information and application rather than the CA4 model name alone.
Equipment Category
Die Bonder Equipment
Compare CA4 with dedicated die-attach and semiconductor assembly platforms for specialized processes.
View Die Bonder Equipment → Material SupplyASM SIPLACE Feeders
Support for compatible feeder units, tape widths, feeder parts and production material setups.
View ASM Feeders → Configuration SupportCA4 Machine and Parts Matching
Send machine labels, module photographs, part numbers and production requirements for review.
Discuss Your Requirement →Frequently Asked Questions
ASM SIPLACE CA4 Process and Configuration Questions
Answers for teams reviewing CA4 large-area assembly, wafer-system layouts, legacy production and used equipment.
What type of machine is the ASM SIPLACE CA4?
It is a high-speed, large-area chip assembly platform from the SIPLACE CA family. It uses four placement positions and can be configured with conventional component supply, SIPLACE Wafer Systems or a combination of both.
Why was the SIPLACE CA4 developed?
It was developed for products that required high-output SMD placement together with wafer-supplied semiconductor dies. The platform allowed these material routes to be combined more closely within one production environment.
What is the difference between CA4, CA4-2 and CA4-4?
The legacy names are associated with different combinations of SIPLACE Wafer Systems and conventional component-supply positions. CA4-4 is wafer-system dominated, CA4-2 combines two wafer and two conventional supply positions, and the documented CA4 base layout uses conventional supply positions.
Can every CA4 pick dies directly from a wafer?
No. Direct wafer capability depends on whether SIPLACE Wafer Systems and the required die-handling hardware and software are physically installed on the individual machine.
Is the CA4 only a flip-chip machine?
No. Depending on configuration, it can be used for conventional SMT placement, wafer-die handling, die attach, flip-chip or mixed assembly. The actual process scope must be confirmed from the installed modules.
What placement speed can a SIPLACE CA4 reach?
A commonly documented high-speed configuration is rated at approximately 126,500 components per hour. Actual output depends on heads, component mix, wafer operations, substrate size, travel distances and line balance.
Can the CA4 process large panels?
Documented configurations support large substrate formats, but the usable size depends on conveyor arrangement, placement accuracy, support tooling, substrate thickness and machine version.
What is the difference between SIPLACE CA4 and CA2?
The CA4 is an older four-position platform with several wafer and conventional material layouts. The CA2 is a newer integrated hybrid platform with published direct-wafer die-attach, flip-chip, SMT and multi-wafer exchange capabilities.
Can a used CA4 be integrated into a current SIPLACE line?
Integration is possible when conveyor flow, station software, SIPLACE Pro compatibility, component libraries, factory interfaces, utilities and line takt requirements are aligned.
What should be checked before purchasing a used CA4?
Confirm the generation, serial number, all four placement positions, head labels, wafer systems, component tables, feeder layout, cameras, conveyor, software, licenses, machine condition and included accessories.
Are feeders, wafer systems and nozzles included with the machine?
The supply scope varies by unit and quotation. Each feeder cart, wafer module, nozzle set, tray system, carrier and spare part should be listed individually before purchase.
Review a SIPLACE CA4 for Your Large-Area Assembly Process
Send the required material routes, wafer format, component range, substrate dimensions, target output, preferred CA4 configuration and destination for equipment matching.
