Can the SIPLACE CA2 process SMDs and bare dies on the same substrate?

Yes. The platform is designed to place feeder-supplied SMD components and bare dies taken directly from sawn wafers within one coordinated production flow.

How does the SIPLACE CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation so dies can be detached and prepared while other placement operations continue.

Can the SIPLACE CA2 replace every dedicated die bonder?

No. Processes requiring specialized bonding force, heating, curing, dispensing or unsupported die formats may still require dedicated semiconductor assembly equipment.

Can the SIPLACE CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line to balance feeder placement with direct-wafer and hybrid placement operations.

Direct-Wafer Placement for Advanced Packaging

ASM SIPLACE CA2 Die Attach & Flip-Chip Production Solution

Q: Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

The ASM SIPLACE CA2 is a hybrid placement machine that combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing.

The SIPLACE CA2 was developed for products that no longer fit cleanly into either a conventional SMT line or a stand-alone die-bonding process. It combines feeder-based SMD placement with direct pickup of semiconductor dies from sawn wafers, allowing SiP and advanced-packaging manufacturers to manage mixed components, die attach, flip-chip placement, inspection and traceability within one connected production platform.

Check Process Fit Discuss a CA2 Configuration

Up to 76,000 cphFeeder-Based SMT Placement

Up to 54,000 cphDie Attach from Wafer

Up to 51,000 cphFlip-Chip from Wafer

Down to 10 µmAccuracy Class at 3 Sigma

The Manufacturing Problem

Why the SIPLACE CA2 Exists

System-in-Package modules and other advanced electronic products often combine two very different material families on one substrate: conventional SMD components supplied in reels, and unpackaged semiconductor dies supplied on sawn wafers. Traditional production separates these materials between an SMT placement machine and a die bonder.

That separation can introduce additional material conversion, intermediate storage, product transfers, programming environments and traceability interfaces. Bare dies may need to be transferred into tape before they can enter a feeder-based process, while mixed products move between equipment designed around different production principles.

The ASM SIPLACE CA2 is a hybrid placement platform created to close this gap. It brings direct-wafer die handling into an SMT-oriented production environment, so feeder components, die attach and flip-chip operations can be coordinated around the same product flow.

What changes when dies enter the SMT line?

Known-good dies can be selected directly from wafer-map information.
Feeder-supplied SMDs and wafer-supplied dies can be placed on the same substrate.
Die preparation and placement can be parallelized through buffering.
Each die can be linked from its wafer position to its final substrate position.
SMT and semiconductor communication interfaces can participate in one connected factory flow.

Process Decision

When Does the SIPLACE CA2 Make Sense?

The strongest CA2 applications are not defined by a single package name. They are defined by the combination of material source, process sequence, accuracy, traceability and production volume.

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Strong CA2 Fit

The same product uses both feeder-supplied SMDs and bare dies.
Dies must be picked directly from one or several sawn wafers.
Production includes die attach, flip chip or both processes.
Multiple die types must be changed without extensive manual handling.
Placement requires 20 µm, 15 µm or 10 µm accuracy classes.
Individual die traceability is required from wafer to finished product.
The manufacturer wants to reduce die taping and related material logistics.
The line must connect with SMT and semiconductor factory systems.

Requires Additional Process Review

The process requires specialized heating, curing or high bonding force.
Die dimensions or thickness fall outside the installed handling range.
The product needs dispensing or bonding functions not installed on the machine.
The substrate requires a carrier or transport mode not included in the configuration.
Production volume is too low to justify an integrated high-speed platform.
The existing factory flow is built around independent die-bonding cells.
Required inspection or metrology must be performed on separate specialist equipment.
The available used machine lacks the necessary wafer, head or software options.

Machine Architecture

Five Systems That Define CA2 Process Capability

The model name identifies the platform, but these installed systems determine how an individual machine can actually process wafers, components and substrates.

01 / MATERIAL INPUT

SMT Feeders and Trays

Compatible feeders supply passives and packaged semiconductors, while selected tray and carrier options support additional component formats.

02 / WAFER HANDLING

Wafer Exchange System

The wafer system stores and presents multiple wafer types, enabling products that contain several different bare dies.

03 / PARALLEL PROCESS

Die Buffering

Die separation and preparation can run in parallel with placement, reducing the speed penalty normally associated with direct wafer pickup.

04 / PLACEMENT

CP20 Head Configuration

High-speed heads handle small and sensitive components with touchless pickup, controlled placement and accuracy classes down to 10 µm.

05 / PROCESS CONTROL

Inspection and Traceability

Component sensing, die-condition checks, dipping inspection and production data support stable yield and die-level records.

Hybrid Assembly Flow

How a Mixed SMD and Bare-Die Product Moves Through the CA2

The exact sequence changes by product, but the process normally connects material identification, direct wafer handling, precision placement and production records.

Load Product Data

Substrate programs, component data, wafer maps, process parameters and traceability requirements are prepared.

Prepare Materials

SMD reels, trays, wafers, wafer frames, nozzles and dipping materials are assigned to the production setup.

Select Known-Good Dies

The wafer system identifies the required wafer and uses map data to select usable dies for the product.

Buffer and Orient Dies

Dies are detached, inspected, buffered and flipped when the assembly requires face-down interconnection.

Place Mixed Components

Feeder components and wafer dies are placed using the defined SMT, die-attach, flip-chip or dipping sequence.

Record Process Data

Pickup source, inspection result and final placement position can be linked to the substrate and production record.

Published Platform Data

ASM SIPLACE CA2 Technical Specifications

Published values describe the available CA2 platform capability. Actual performance depends on the installed head set, accuracy package, wafer modules, conveyor, component mix and process options.

Technical Item	Published Capability	Why It Matters
SMT placement speed	Up to 76,000 components per hour	Supports high-volume placement of feeder-supplied passives and packaged components.
Die attach from wafer	Up to 54,000 dies per hour	Enables direct-wafer face-up die placement without an intermediate taping process.
Flip-chip placement from wafer	Up to 51,000 dies per hour	Supports high-speed placement of dies with the interconnection side facing the substrate.
Accuracy classes	20 µm, 15 µm and 10 µm at 3 sigma	Allows process matching for different die sizes, pitches, ball diameters and substrate tolerances.
Wafer capacity	Up to 50 different wafers	Provides multi-die capability for products containing several semiconductor functions.
Wafer exchange	Less than 13 seconds	Reduces material-change delay in products that alternate between multiple wafer sources.
Single-lane substrate format	Up to 620 × 700 mm, configuration dependent	Supports panels, embedded PCBs and large specialized substrates.
Dual-lane substrate format	Up to 375 × 260 mm in the stated standard mode	Supports parallel transport for standard PCBs and SiP substrates.
Machine dimensions	Approximately 2.56 × 2.50 × 1.85 m	Provides a basis for floor planning, access clearance and line-layout review.
Communication interfaces	IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 and SECS/GEM	Connects the machine with SMT line control and semiconductor factory systems.
Production environment	Class 7 cleanroom compatibility and SEMI S2/S8 support	Supports deployment in controlled advanced-packaging and semiconductor production areas.

The offered machine must be checked against its nameplate, installed heads, accuracy class, wafer system, conveyor arrangement, software licenses and process modules. Platform maximums do not automatically describe every individual unit.

Accuracy and Transport

Substrate Size Changes with the Required Accuracy Class

The largest supported format and the tightest accuracy are not always available over the same working area. This relationship must be reviewed before selecting a machine.

Conveyor / Working Mode	Accuracy Class	Published Substrate Format	Typical Review Point
Single-lane conveyor	20 µm @ 3 sigma	Up to 620 × 700 mm	Large panels and embedded-board formats.
Single-lane conveyor	15 µm @ 3 sigma	Up to 620 × 700 mm	Large format with tighter placement requirements.
Single-lane quadrant mode	12 µm @ 3 sigma	Up to 620 × 700 mm, assessed by 300 × 300 mm quadrant	Confirm product layout relative to the qualified working area.
Single-lane conveyor	10 µm @ 3 sigma	Up to 300 × 300 mm	High-accuracy SiP and tightly spaced die applications.
Dual-lane conveyor	20 µm @ 3 sigma	Up to 375 × 260 mm	Parallel standard PCB or SiP production.
Dual as single-lane mode	20 µm @ 3 sigma	Up to 375 × 430 mm	Extended format using the dual-conveyor platform.
Dual-lane conveyor	15 µm or 10 µm @ 3 sigma	Up to 250 × 100 mm	Small substrates requiring the tighter accuracy class.

Production Route Comparison

Three Ways to Assemble a Mixed SMD and Bare-Die Product

The CA2 is one possible production architecture. The best route depends on product complexity, volume, existing equipment and required process functions.

Route A

Separate SMT and Die-Bonding Cells

Packaged components and bare dies are processed on independent equipment platforms.

Useful when specialist die-bonding functions dominate
Allows independent equipment optimization
Requires transfers and cross-system traceability
May need more floor space and intermediate handling

Route B

Tape the Dies for SMT Placement

Bare dies are converted into a feeder-compatible tape format before assembly.

Uses familiar feeder-based material flow
Adds taping, storage and quality-control operations
Creates carrier material and disposal requirements
May limit flexibility when many die types are involved

Route C

Direct-Wafer Hybrid Placement

The CA2 processes SMDs from feeders and dies directly from wafers in one connected platform.

Reduces die conversion and intermediate handling
Supports multi-wafer and multi-die production
Connects die records with final placement positions
Requires the correct wafer, head and process configuration

Production-Line Architecture

CA2 Can Work as the Hybrid Process Center of a SiP Line

For higher-volume SiP production, the CA2 can be combined with a SIPLACE TX micron or other suitable line equipment. High-speed feeder placement, direct-wafer processing and inspection can then be balanced across connected machines instead of forcing every operation into one station.

Stage 01Printing or Material Application

Solder paste, adhesive or flux is applied and inspected according to the process.

Stage 02High-Speed SMD Placement

Feeder-intensive components can be placed on a balanced high-speed platform.

Stage 03CA2 Wafer and Hybrid Placement

Direct-wafer dies, flip chips and specialized mixed-placement steps are completed.

Application Fit

Products That Benefit from Direct-Wafer and Mixed-Component Placement

The CA2 is most valuable where several component formats must be coordinated with high accuracy, high output and detailed material records.

System-in-Package Modules

Processors, memory, RF dies, packaged ICs and passives assembled on a common compact substrate.

Power Semiconductor Assemblies

Power dies and supporting SMD components placed on specialized substrates for automotive and energy systems.

Wafer-Level Packaging

Precision die placement and chip-on-wafer workflows that require controlled wafer handling.

Panel-Level Packaging

Large-format panels and embedded structures requiring accurate transport and component placement.

Sensor and Communication Modules

Compact products combining bare sensing or RF dies with control ICs and passive components.

Embedded PCB Products

Bare dies integrated into or onto advanced printed-circuit constructions with specialized handling requirements.

Configuration Definition

Four Areas to Specify Before Matching a CA2 Machine

A reliable selection starts with the intended product and process, not only the machine model.

Materials

Define die dimensions, thickness, wafer diameter, wafer-map format, SMD package range, tape widths and number of die types.

Accuracy and Output

Confirm placement tolerance, bump or ball pitch, target hourly output, product mix and expected changeover frequency.

Substrate Transport

Specify substrate dimensions, thickness, warpage, carrier design, single- or dual-lane flow and loading direction.

Process Control

Define dipping, inspection, traceability, cleanroom, factory communication and closed-loop requirements.

Equipment Verification

What Must Be Checked on an Available SIPLACE CA2

Two machines carrying the same CA2 model name can support different processes. The complete installed configuration should be reviewed before quotation, relocation or line planning.

Machine identityFull designation, serial number, manufacturing year, nameplate and operating history.

Placement headsInstalled CP20 heads, head labels, operating hours, nozzle interfaces and available calibration information.

Accuracy class20 µm, 15 µm or 10 µm configuration and the corresponding qualified working area.

Wafer equipmentWafer exchange unit, supported wafer frames, ejector, buffer, flip unit and wafer-map capability.

Conveyor systemSingle-lane, dual-lane, left-in/left-out or specialized carrier and substrate arrangements.

Process modulesLinear dipping unit, component sensing, die inspection, on-board inspection and traceability options.

Software and interfacesInstalled software version, licenses, SECS/GEM, CFX, HERMES and production-data integration.

Supply scopeFeeders, nozzles, wafer accessories, documentation, spare parts, test information and export packing.

Equipment and Parts Support

Related Equipment Resources for a CA2 Project

Machine selection should be coordinated with the required feeders, wafer equipment, placement heads, nozzles and the surrounding advanced-packaging process.

Equipment Category

Die Bonder Equipment

Review additional semiconductor die-attach and advanced-packaging equipment for different process requirements.

Explore Die Bonders → Material Supply

ASM SIPLACE Feeders

Match tape widths, feeder quantities and component supply requirements for the SMT side of the process.

View ASM Feeders → Configuration Support

CA2 Machine and Parts Matching

Submit the process, wafer, die, substrate and accuracy requirements for machine and replacement-parts review.

Discuss Your Requirement →

Frequently Asked Questions

SIPLACE CA2 Process and Configuration Questions

Answers for teams evaluating the machine for direct-wafer placement, SiP production and advanced packaging.

Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

It is a hybrid placement machine. It combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing, so it operates across both manufacturing environments.

Why not use a conventional SMT machine for bare dies?

A conventional SMT machine is normally optimized for components supplied in feeders or trays. Direct wafer processing requires wafer-map data, die separation, ejector and flip functions, die buffering, specialized inspection and die-level traceability.

Can the CA2 process SMDs and bare dies on the same substrate?

Yes. This mixed-material capability is a central purpose of the platform. The exact sequence depends on the installed feeders, wafer system, placement heads, process modules and product program.

Does direct wafer pickup eliminate die taping?

It can eliminate the need to convert applicable dies into tape before placement. Whether this is suitable depends on wafer format, die condition, known-good-die data and the installed wafer-handling configuration.

How does the CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation. Dies can be detached and prepared while the placement head continues processing other components, reducing the delay associated with direct wafer pickup.

What is the maximum published placement performance?

Published platform values reach up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach from wafer and 51,000 dies per hour for flip-chip placement. Actual output depends on the machine configuration and product.

Can one CA2 setup use several different wafer types?

With the applicable wafer exchange configuration, the platform can hold up to 50 different wafers. This supports products that combine several die types, subject to the installed wafer system and program setup.

What does single-die-level traceability mean?

It means an individual die can be linked from its pickup position on the source wafer to its final placement position on the substrate, together with relevant production and inspection data.

Can the CA2 replace every dedicated die bonder?

No. Applications requiring specialized bonding force, heating, curing, dispensing or die formats outside the installed range may still require dedicated semiconductor assembly equipment.

Can the CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line, with high-speed or high-accuracy feeder placement balanced against direct-wafer and hybrid placement operations.

What information is needed to match a used CA2 machine?

Provide the die and wafer specifications, substrate dimensions, required accuracy, component range, target output, conveyor preference, process options, traceability requirements, preferred machine condition and destination.

Evaluate a SIPLACE CA2 for Your Advanced-Packaging Process

Send the wafer format, die dimensions, substrate size, component mix, accuracy target, expected output and required process options for configuration review.

Request Configuration Review