Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

The ASM SIPLACE CA2 is a hybrid placement machine that combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing.

Why not use a conventional SMT machine for bare dies?

Direct wafer processing requires wafer-map data, die separation, ejector and flip functions, die buffering, specialized inspection and die-level traceability beyond normal feeder-based placement.

Can the SIPLACE CA2 process SMDs and bare dies on the same substrate?

Yes. The platform is designed to place feeder-supplied SMD components and bare dies taken directly from sawn wafers within one coordinated production flow.

Does direct wafer pickup eliminate die taping?

It can eliminate the need to convert applicable dies into tape before placement, subject to wafer format, die condition, known-good-die data and the installed wafer configuration.

How does the SIPLACE CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation so dies can be detached and prepared while other placement operations continue.

What is the maximum published placement performance of the SIPLACE CA2?

Published platform values reach up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach from wafer and 51,000 dies per hour for flip-chip placement.

Can one SIPLACE CA2 setup use several different wafer types?

With the applicable wafer exchange configuration, the platform can hold up to 50 different wafers for multi-die production.

What does single-die-level traceability mean?

It means an individual die can be linked from its pickup position on the source wafer to its final placement position on the substrate together with relevant production data.

Can the SIPLACE CA2 replace every dedicated die bonder?

No. Processes requiring specialized bonding force, heating, curing, dispensing or unsupported die formats may still require dedicated semiconductor assembly equipment.

Can the SIPLACE CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line to balance feeder placement with direct-wafer and hybrid placement operations.

What information is needed to match a used SIPLACE CA2 machine?

Provide the die and wafer specifications, substrate dimensions, required accuracy, component range, target output, conveyor preference, process options, machine condition and destination.

Gushyiramo Wafer mu buryo butaziguye kugira ngo upake neza

ASM SIPLACE CA2Umuti wo gukora Die Attach & Flip-Chip

SIPLACE CA2 yakozwe ku bicuruzwa bitagihuye neza n'umurongo usanzwe wa SMT cyangwa inzira yo guhuza ibyuma. Ihuza uburyo bwo gushyira SMD mu buryo bw'ibikoresho byo mu bwoko bwa feeder hamwe no gutoranya ibyuma bya semiconductor biva mu byuma byasazwe, bigatuma SiP n'inganda zikora ibikoresho byo mu bwoko bwa SIPLACE babasha gucunga ibice bivanze, gushyiramo ibyuma, gushyiramo ibyuma bya flip-chip, kugenzura no gukurikirana ibintu mu buryo bumwe buhujwe.

Reba uko ibintu bimeze Ganira ku miterere ya CA2

Kugeza kuri 76.000 cphGushyira SMT mu buryo bukoresha feeder

Kugeza kuri 54.000 cphDie Attach ivuye kuri Wafer

Kugeza kuri 51.000 cphFlip-Chip yo muri Wafer

Kugeza kuri 10 µmIsomo ry'Uburinganire muri 3 Sigma

Ikibazo cy'Inganda

Impamvu SIPLACE CA2 ibaho

Modules za sisitemu ziri mu ipaki n'ibindi bikoresho bya elegitoroniki bigezweho akenshi bihuza ubwoko bubiri butandukanye cyane bw'ibikoresho kuri substrate imwe: ibice bisanzwe bya SMD bitangwa mu mareli, n'ibice bya semiconductor bitapacked bitangwa ku macupa yasizwe. Umusaruro gakondo utandukanya ibi bikoresho hagati y'imashini ishyiramo SMT n'imashini ibohera.

Uko gutandukanya ibintu bishobora kongeramo ihindurwa ry’ibikoresho, ububiko bw’igihe gito, kohereza ibicuruzwa, ahantu ho gukora porogaramu ndetse n’aho gukurikirana ibintu. Ibikoresho by’ubusa bishobora gukenera kwimurirwa muri kaseti mbere yuko byinjira mu buryo bwo kubikoresha, mu gihe ibicuruzwa bivanze bigenda hagati y’ibikoresho byagenewe amahame atandukanye yo kubitunganya.

ASM SIPLACE CA2 ni urubuga rwo gushyiramo ibintu bitandukanye rwashyiriweho kuziba iki cyuho.Izana uburyo bwo gutunganya icyuma gikozwe mu buryo butaziguye mu buryo bwa SMT, bityo ibice bifasha mu gutunganya icyuma, imikorere ya icyuma gikozwe mu buryo bwa "die attach" na "flip-chip" bishobora guhuzwa hakurikijwe urujya n'uruza rw'ibicuruzwa.

Ni izihe mpinduka iyo ibyuma byinjiye ku murongo wa SMT?

Inyama zizwi zishobora gutoranywa mu buryo butaziguye uhereye ku makuru ya wafer-map.
SMD zitangwa n'ibikoresho byo kugaburira hamwe n'ibiryo byatanzwe na wafer bishobora gushyirwa kuri substrate imwe.
Gutegura no gushyiramo icyuma bishobora kugereranywa binyuze mu gufunga.
Buri gacupa gashobora guhuzwa kuva aho gaherereye kugeza aho gaherereye.
Imiyoboro y'itumanaho ya SMT na semiconductor ishobora kugira uruhare mu ruganda rumwe ruhujwe.

Icyemezo cy'Inzira

Ni ryari SIPLACE CA2 isobanura neza?

Porogaramu zikomeye za CA2 ntizigaragazwa n'izina rimwe ry'ipaki. Zigaragazwa n'uruvange rw'isoko ry'ibikoresho, urukurikirane rw'ibikorwa, ubuziranenge, uburyo bwo gukurikirana ibintu n'ingano y'umusaruro.

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Gukwira neza kwa CA2

Icyo gicuruzwa kimwe gikoresha SMD zitangwa n'ibikoresho byo kugaburira ndetse n'ibikoresho byo kuvura bidafite ibara.
Inyama zigomba gutorwa mu buryo butaziguye mu icupa rimwe cyangwa menshi yaciwe.
Umusaruro urimo die attach, flip chip cyangwa inzira zombi.
Ubwoko bwinshi bw'udupira bugomba guhindurwa hatabayeho gukoresha intoki cyane.
Gushyiramo bisaba ibyiciro by'ubuziranenge bwa 20 µm, 15 µm cyangwa 10 µm.
Gukurikirana urushinge rw'amaraso ku giti cyarwo birakenewe kuva kuri wafer kugeza ku gicuruzwa cyarangiye.
Uruganda rukora ibintu rushaka kugabanya uburyo bwo gufunga ibikoresho bifitanye isano n'ibyo rukora.
Uwo murongo ugomba guhuzwa na sisitemu za SMT n'iz'uruganda rwa semiconductor.

Bisaba Isuzuma ryinyongera ry'Inzira

Uburyo busaba ubushyuhe bwihariye, ubushyuhe cyangwa imbaraga nyinshi zo gufatanya.
Ingano cyangwa ubunini bw'icyuma biva hanze y'urwego rwo gufata ibikoresho byashyizweho.
Ibicuruzwa bikenera uburyo bwo kubitanga cyangwa kubihuza bitari byashyizwe kuri mashini.
Iyi substrate isaba uburyo bwo gutwara cyangwa gutwara ibintu butari muri iyo configuration.
Ingano y'umusaruro ni nto cyane ku buryo bitashoboka ko habaho urubuga rworoshye rworoshye.
Urujya n'uruza rw'uruganda rusanzwe rwubakiye ku turemangingo twigenga duhuza uduce.
Igenzura rikenewe cyangwa ubuziranenge bw'ibintu bigomba gukorwa ku bikoresho byihariye bitandukanye.
Imashini ikoreshwa ihari ibura uburyo bwo gukoresha wafer, umutwe cyangwa porogaramu.

Ubwubatsi bw'imashini

Sisitemu eshanu zigaragaza ubushobozi bwa CA2 mu mikorere

Izina ry'icyitegererezo rigaragaza urubuga, ariko izi sisitemu zashyizweho zigena uburyo imashini imwe ishobora gutunganya wafers, ibice byazo n'ibice byazo.

01 / IBIKORESHO BY'INGENZI

Ibikoresho byo kongereraho ibikoresho bya SMT n'amasahani

Ibikoresho bitanga ibikoresho bihoraho (passives) n'ibikoresho bya semiconductor bipakiye, mu gihe amahitamo yatoranijwe yo gushyiramo ibikoresho hamwe n'ibindi bikoresho bitanga imiterere y'ibindi bikoresho.

02 / GUFATA AKABARI

Sisitemu yo Guhinduranya Wafer

Sisitemu ya wafer irabika kandi ikagaragaza ubwoko bwinshi bwa wafer, bigatuma habaho ibicuruzwa birimo ubwoko butandukanye bw'udusimba twambaye ubusa.

03 / UKO BIKORWA MU BURYO BUSANZWE

Uburyo bwo gufunga (Buffering)

Gutandukanya no gutegura icyuma bishobora kugendana n'aho gishyirwa, bigabanye igihano cy'umuvuduko gisanzwe gifitanye isano no gufatira icyuma mu buryo butaziguye.

04 / GUSHYIRA MU BIKORWA

Imiterere y'umutwe wa CP20

Imitwe yihuta cyane ifata ibice bito kandi byoroheje hamwe no gufata ibintu nta gukoraho, gushyira ibintu mu buryo bugenzurwa no gukoresha neza ibintu kugeza kuri µm 10.

05 / IGENZURA RY'IMIKORESHEREZE

Igenzura n'uburyo bwo gukurikirana

Gupima ibice, kugenzura imiterere y'ibice, kugenzura ibiza n'umusaruro bishyigikira umusaruro uhamye n'inyandiko z'ibice.

Urugendo rw'Iteraniro ry'Ihuri ...

Uburyo ibicuruzwa bivanze bya SMD na Bare-Die binyura muri CA2

Urukurikirane nyarwo ruhinduka bitewe n'ibicuruzwa, ariko ubusanzwe inzira ihuza kumenya ibikoresho, uburyo bwo kubikoresha mu buryo butaziguye, uburyo bwo kubishyiraho neza n'inyandiko z'umusaruro.

Kura amakuru y'ibicuruzwa

Porogaramu zo mu gice cy’ingenzi, amakuru y’ibice, amakarita ya wafer, ibipimo by’imikorere n’ibisabwa mu gukurikirana ibintu birategurwa.

Tegura Ibikoresho

Imigozi ya SMD, amasahani, wafers, wafers, nozzles n'ibikoresho byo kwibiramo ni byo bigenerwa imiterere y'umusaruro.

Hitamo abapfuye bazwi neza

Sisitemu ya wafer igaragaza wafer ikenewe kandi igakoresha amakuru y’ikarita kugira ngo ihitemo uduce dushobora gukoreshwa kuri icyo gicuruzwa.

Ipfa rya Buffer na Orient

Imashini zifatwa, zigasuzumwa, zigashyirwamo ibyuma binini kandi bigahindurwa iyo ihuriro risaba ko zihuzwa mu buryo bugaragara.

Shyira ibice bivanze

Ibice by'ibiryo n'ibice bya wafer bishyirwa hakoreshejwe uburyo bwa SMT, die-attach, flip-chip cyangwa dipping sequence.

Amakuru y'Inzira yo Kwandika

Aho ifoto ivanwa, ibyavuye mu igenzura n'aho ishyirwa burundu bishobora guhuzwa n'aho ifoto ivanwa n'inyandiko y'umusaruro.

Amakuru ya Puratifomu yasohotse

Ibisobanuro bya tekiniki bya ASM SIPLACE CA2

Indangagaciro zasohotse zisobanura ubushobozi bwa platform ya CA2 ihari. Imikorere nyayo iterwa n'umutwe washyizweho, paki y'ubuziranenge, module za wafer, conveyor, imvange y'ibice n'amahitamo yo gutunganya.

Ikintu cya tekiniki	Ubushobozi bwasohotse	Impamvu ari ingenzi
Umuvuduko wo gushyira SMT mu mwanya	Ibice bigera ku 76.000 ku isaha	Ishyigikira uburyo bwo gushyiramo ibintu bitanga serivisi zo kugaburira hamwe n'ibice bipakiye mu buryo buhanitse.
Agace gafatana n'agace ka wafer	Abagera ku 54.000 bapfa ku isaha	Ituma icyuma gishyirwa mu mwanya wacyo ugana hejuru nta gufatisha hagati.
Gushyiramo flip-chip uhereye kuri wafer	Abagera ku 51.000 bapfa ku isaha imwe	Ishyigikira gushyiramo imirasire mu buryo bwihuse, uruhande rw'aho ifata rureba substrate.
Amasomo yo kumenya neza	20 µm, 15 µm na 10 µm kuri 3 sigma	Yemerera guhuza uburyo bwo gukora ibintu bitandukanye ku bunini, imipira, uburebure bw'umupira n'ubushobozi bwo kwihanganira ibintu bitandukanye.
Ubushobozi bwo gukaraba	Amafunguro atandukanye agera kuri 50	Itanga ubushobozi bwo gukora ibintu byinshi ku bicuruzwa birimo imikorere myinshi ya semiconductor.
Ihererekanya ry'amafi	Munsi y'amasegonda 13	Bigabanya gutinda kw'impinduka mu bikoresho bisimburana hagati y'ibikomoka ku biti byinshi.
Imiterere y'ubutaka bw'umurongo umwe	Kugeza kuri 620 × 700 mm, bitewe n'imiterere	Ishyigikira paneli, PCB zirimo hamwe n'ibikoresho binini byihariye.
Imiterere y'ubutaka bufite inzira ebyiri	Kugeza kuri 375 × 260 mm mu buryo busanzwe bwavuzwe	Ishyigikira ubwikorezi bujyanye n'igihe kuri PCB zisanzwe na substrates za SiP.
Ibipimo by'imashini	Hafi 2.56 × 2.50 × 1.85 m	Itanga ishingiro ry'igenamigambi ry'ubutaka, aho inzira inyura no gusuzuma imiterere y'umurongo.
Imiyoboro y'itumanaho	IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 na SECS/GEM	Ihuza imashini na sisitemu yo kugenzura umurongo wa SMT na sisitemu y'uruganda rwa semiconductor.
Ibidukikije by'umusaruro	Uburyo bwo gusukura mu cyiciro cya 7 hamwe n'ubufasha bwa SEMI S2/S8	Ishyigikira ishyirwa mu bikorwa ry’ibikoresho bigezweho byo gupakira no gukora ibikoresho bya semiconductor.

Imashini itangwa igomba kugenzurwa hakurikijwe izina ryayo, imitwe yashyizweho, ubwoko bw'ubuziranenge, sisitemu ya wafer, uburyo bwo kohereza ibicuruzwa, impushya za porogaramu na modules zo gutunganya. Amanota ntarengwa ya platform ntabwo agaragaza buri gice ku giti cyacyo.

Ubuziranenge n'Ubwikorezi

Impinduka mu bunini bwa substrate hamwe n'itsinda ry'ubuziranenge bukenewe

Imiterere ikomeye cyane ishyigikiwe n'ubuhanga bukomeye ntabwo buri gihe biboneka ahantu hamwe ho gukorera. Iyi sano igomba gusuzumwa mbere yo guhitamo imashini.

Konveyori / Uburyo bwo gukora	Isomo ry'Uburinganire	Imiterere y'igice cyasohotse	Ingingo isanzwe yo gusuzuma
Umuyoboro w'imodoka ukoresha inzira imwe	20 µm @ 3 sigma	Kugeza kuri 620 × 700 mm	Udupapuro tunini n'imiterere y'urubaho rurimo amashusho.
Umuyoboro w'imodoka ukoresha inzira imwe	15 µm @ 3 sigma	Kugeza kuri 620 × 700 mm	Imiterere minini kandi isaba gushyirwaho neza.
Uburyo bwa "one-line quadrant"	12 µm @ 3 sigma	Kugeza kuri mm 620 × 700, byapimwe na quadrant ya mm 300 × 300	Emeza imiterere y'ibicuruzwa ugereranyije n'aho bikorerwa byujuje ibisabwa.
Umuyoboro w'imodoka ukoresha inzira imwe	10 µm @ 3 sigma	Kugeza kuri 300 × 300 mm	SiP ifite ubunyangamugayo bwinshi kandi ikoreshwa neza cyane.
Umuyoboro w'imodoka ufite inzira ebyiri	20 µm @ 3 sigma	Kugeza kuri 375 × 260 mm	Gukora PCB cyangwa SiP bisanzwe bihurirana.
Uburyo bubiri nk'uburyo bw'umurongo umwe	20 µm @ 3 sigma	Kugeza kuri 375 × 430 mm	Imiterere yagutse hakoreshejwe urubuga rwa "dual-conveyor".
Umuyoboro w'imodoka ufite inzira ebyiri	15 µm cyangwa 10 µm kuri 3 sigma	Kugeza kuri 250 × 100 mm	Uduce duto dukenera icyiciro cyo gukora neza cyane.

Kugereranya inzira y'umusaruro

Uburyo Butatu bwo Guteranya Ibicuruzwa Bivanze bya SMD na Bare-Die

CA2 ni imwe mu miterere ishoboka yo gukora. Inzira nziza iterwa n'uburemere bw'ibicuruzwa, ingano yabyo, ibikoresho bihari ndetse n'imikorere ikenewe mu gutunganya ibicuruzwa.

Inzira A

Utunyangingo twa SMT n'uduhuza dutandukanye

Ibikoresho bipakiye hamwe n'ibikoresho byambaye ubusa bitunganywa ku mbuga zigenga z'ibikoresho.

Ni ingirakamaro iyo imirimo yihariye yo guhuza ibyuma iyobowe
Yemerera gukoresha ibikoresho byigenga mu buryo bwigenga
Bisaba kohereza no gukurikirana ibintu mu buryo butandukanye
Bishobora gukenera umwanya munini wo hasi no gufata neza hagati

Inzira ya B

Kanda kuri kaseti kugira ngo ushyireho SMT

Inyama z'umukara zihinduka imiterere ya kaseti ijyanye n'ibikoresho mbere yo guteranya.

Ikoresha uburyo busanzwe bwo gukoresha ibikoresho bikoreshwa mu kugaburira
Yongeraho ibikorwa byo gukanda, kubika no kugenzura ubuziranenge
Akora ibikoresho byo gutwara ibintu n'ibisabwa mu kujugunya ibintu
Bishobora kugabanya ubworoherane mu gihe hari ubwoko bwinshi bw'urupfu

Umuhanda wa C

Gushyira ahantu hifashishijwe ikoranabuhanga rya "Direct-Wafer Hybrid Placement"

CA2 itunganya SMDs ivuye mu byuma bitanga umusaruro hanyuma igapfa iturutse ku byuma bitanga umusaruro mu buryo butaziguye.

Bigabanya guhindura imiterere y'icyuma no kuyikoresha hagati
Ishyigikira ikorwa ry'ibigega byinshi n'ibigega byinshi
Ihuza inyandiko z'ifi n'imyanya ya nyuma yo gushyirwa mu myanya
Bisaba uburyo bwiza bwo gutunganya wafer, umutwe n'uburyo bwo kuyitunganya

Imiterere y'Umusaruro n'Imirongo

CA2 Ishobora Gukora nk'Ikigo cy'Ibikorwa bya Hybrid bya SiP Line

Kugira ngo hakorwe SiP nyinshi, CA2 ishobora guhuzwa na mikoroni ya SIPLACE TX cyangwa ibindi bikoresho bikwiye. Gushyiramo umuyoboro wihuta, gutunganya no kugenzura imashini zihujwe mu buryo butaziguye bishobora kuringanizwa mu mashini zihujwe aho gushyira buri gikorwa mu mwanya umwe.

Icyiciro cya 01Gukoresha icapiro cyangwa ibikoresho

Gusoda, kole cyangwa flux bishyirwaho kandi bigasuzumwa hakurikijwe uburyo bikorwamo.

Icyiciro cya 02Gushyiramo SMD yihuta cyane

Ibice bikoresha ibikoresho byo kugaburira bishobora gushyirwa ku rubuga rukora neza kandi rwihuta.

Icyiciro cya 03CA2 Wafer na Hybrid Placement

Intambwe zo gushyiramo imashini zikoresha wafer, flip chips n'intambwe zidasanzwe zo gushyiramo imashini zivanze zirarangira.

Uburyo bwo gukoresha porogaramu

Ibicuruzwa Bifite Akamaro mu Gushyiramo Ibice Bivanze n'Ibice Bitandukanye

CA2 ni ingirakamaro cyane aho imiterere myinshi y'ibice igomba guhuzwa neza cyane, umusaruro mwinshi n'inyandiko zirambuye z'ibikoresho.

Moduli za Sisitemu ziri muri Pakeji

Porosesa, memory, RF dies, packaged ICs na passives byakusanyijwe kuri substrate imwe.

Amateraniro ya Semiconductor y'Ingufu

Ingufu zipfa kandi zishyigikira ibice bya SMD bishyirwa ku bikoresho byihariye bya sisitemu z'imodoka n'ingufu.

Udupaki two ku rwego rwa Wafer

Uburyo bwo gushyiramo icyuma gikozwe neza n'uburyo bwo gukora ibyuma bikozwe kuri chip-on-wafer bisaba ko wafer icungwa neza.

Gupakira ku rwego rw'ibice

Udupapuro tunini n'inyubako zirimo ibintu byinshi bisaba gutwara neza no gushyira ibice byabyo mu mwanya wabyo.

Moduli zo Gupima no Gutumanaho

Ibikoresho bito bivanze n'ibikoresho byo kumva bidafite icyuma cyangwa RF hamwe na za IC zo kugenzura n'ibice bidakora.

Ibicuruzwa bya PCB byashyizwemo

Ibikoresho by'icyuma bikozwe mu buryo bwa "barn dishes" byinjijwe mu nyubako zigezweho zacapwe hamwe n'ibisabwa byihariye mu kubitunganya.

Ibisobanuro by'igenamiterere

Ibintu bine ugomba kugena mbere yo guhuza imashini ya CA2

Guhitamo neza bitangirira ku gicuruzwa n'uburyo byakozwe, ntabwo ari imashini gusa.

Ibikoresho

Sobanura ingano z'icyuma, ubunini, umurambararo wa wafer, imiterere ya wafer-map, urwego rwa paki ya SMD, ubugari bwa kaseti n'umubare w'ubwoko bwa icyuma.

Uburinganire n'umusaruro

Emeza ubushobozi bwo gushyiramo, gukubita cyangwa gukubita umupira, umusaruro w'isaha ku isaha, uruvange rw'ibicuruzwa n'inshuro ziteganijwe zo guhindura.

Ubwikorezi bwo munsi y'ubutaka

Garagaza ingano ya substrate, ubunini, warpage, imiterere y'imodoka, urujya n'uruza rw'inzira imwe cyangwa ebyiri hamwe n'icyerekezo cy'umutwaro.

Igenzura ry'Imikorere

Sobanura ibisabwa mu kwibiza, kugenzura, gukurikirana, isuku, itumanaho ry’uruganda n’ibisabwa mu buryo bufunze.

Igenzura ry'ibikoresho

Ibigomba gusuzumwa kuri SIPLACE CA2 ihari

Imashini ebyiri zifite izina rimwe rya CA2 zishobora gushyigikira inzira zitandukanye. Imiterere yuzuye yashyizweho igomba gusuzumwa mbere yo gutanga ibiciro, kwimura cyangwa gutegura umurongo.

Indangamuntu y'imashiniIcyitonderwa cyuzuye, inomero y'uruhererekane, umwaka w'inganda, izina ry'ikigo n'amateka y'imikorere.

Imitwe y'aho abantu bashyira ibintuHashyizweho imitwe ya CP20, ibirango by'imitwe, amasaha yo gukora, aho imiyoboro y'amazi ihurira n'amakuru aboneka yo gupima.

Isomo ry'ubunyangamugayoImiterere ya 20 µm, 15 µm cyangwa 10 µm hamwe n'agace gakwiye ko gukoreramo.

Ibikoresho byo mu ifuIgice cyo guhindurira wafer, inkingi za wafer zishyigikiwe, ejector, buffer, flip unit hamwe n'ubushobozi bwa wafer-map.

Sisitemu yo gutwara ibintuImiterere y'umuhanda umwe, inzira ebyiri, ibumoso bw'imbere/ibumoso bw'inyuma cyangwa uburyo bwihariye bwo gutwara no gupakira ibintu.

Moduli z'imikorereIgice cyo kwibiramo kiri ku murongo, kumenya ibice, kugenzura icyuma, kugenzura mu bwato no gukurikirana ibintu.

Porogaramu n'imiyoboroPorogaramu yashyizweho, impushya, SECS/GEM, CFX, HERMES no guhuza amakuru y'umusaruro.

Uburyo bwo gutanga ibikoreshoIbikoresho byo koherezamo ibiryo, imiyoboro, ibikoresho bya wafer, inyandiko, ibikoresho bisimbura ibindi, amakuru y'ibizamini n'ibyo gupakira byoherezwa mu mahanga.

Inkunga y'Ibikoresho n'Ibice byabyo

Ibikoresho bifitanye isano n'umushinga wa CA2

Guhitamo imashini bigomba guhuzwa n'ibikoresho byo kugaburira imashini bikenewe, ibikoresho bya wafer, imitwe yo gushyiramo imashini, utuzuzi tw'amazi n'uburyo bwo gupakira bugezweho.

Icyiciro cy'ibikoresho

Ibikoresho bya Die Bonder

Suzuma ibindi bikoresho by'inyongera bya semiconductor die-attach n'ibikoresho bigezweho byo gupakira kugira ngo urebe ibisabwa mu buryo butandukanye.

Suzuma Ababondi → Itangwa ry'ibikoresho

ASM SIPLACE Feeders

Huza ubugari bwa tepi, ingano y'ibikoresho byo kugaburira hamwe n'ibisabwa ku gice cy'ibikoresho kugira ngo bigerweho na SMT.

Reba ASM Feeders → Inkunga yo Gushyiraho

Guhuza imashini za CA2 n'ibice byazo

Tanga ibisabwa mu gusuzuma imashini n'ibice byazo, uburyo bwo gukora, uburyo bwo gusimbuza, uburyo bwo gukora, uburyo bwo gukora no gutunganya neza.

Ganira ku byo ukeneye →

Ibibazo Bikunze Kubazwa

Ibibazo by'Imiterere n'Imiterere bya SIPLACE CA2

Ibisubizo ku matsinda asuzuma imashini kugira ngo ishyireho imashini mu buryo butaziguye, ikorwa rya SiP n'ipaki igezweho.

Ese ASM SIPLACE CA2 ni imashini ya SMT cyangwa ni imashini iboha?

Ni imashini ihuza uburyo bwo gushyiramo ibice bya SMT. Ihuza uburyo bwo gushyiramo ibice bya SMT bishingiye ku bikoresho hamwe n'uburyo bwo gutunganya ibikoresho bivuye mu ifuru ndetse n'uburyo bwo gutunganya ibikoresho, bityo ikora mu nganda zombi.

Kuki utakoresha imashini isanzwe ya SMT ku bikoresho byambaye ubusa?

Imashini isanzwe ya SMT isanzwe ikoreshwa neza mu bice bitangwa mu byuma bitanga ibiribwa cyangwa mu masahani. Gutunganya wafer mu buryo butaziguye bisaba amakuru ya wafer-map, gutandukanya die, imikorere ya ejector na flip, die buffering, igenzura ryihariye no gukurikirana die-level.

Ese CA2 ishobora gutunganya SMDs n'udukoko twambaye ubusa ku butaka bumwe?

Yego. Ubu bushobozi bwo kuvanga ibikoresho ni intego nyamukuru y'urubuga. Urukurikirane nyarwo rushingiye ku byuma bitanga umusaruro byashyizweho, sisitemu ya wafer, imitwe yo gushyiramo, modules zo gutunganya ibintu na gahunda y'ibicuruzwa.

Ese gufatira wafer direct bikuraho die taping?

Bishobora gukuraho ikibazo cyo guhindura ibyuma bikoreshwa mu kaseti mbere yo kubishyiraho. Niba ibi bikwiye biterwa n'imiterere ya wafer, imiterere ya wafer, amakuru azwi neza ndetse n'uburyo wafer-handling configuration yashyizweho.

Ni gute CA2 ikomeza umuvuduko iyo gutoragura bipfuye bivuye ku ifu?

Urubuga rukoresha uburyo bwo gufunga no gutegura ibintu mu buryo bunyuranye. Ibikoresho bishobora gukurwaho no gutegurwa mu gihe umutwe w'ibikoresho ukomeza gutunganya ibindi bice, bigabanye gutinda guterwa no gukusanya ibiryo mu buryo butaziguye.

Ni uwuhe musaruro ntarengwa wo gushyira ahagaragara ibikorwa?

Agaciro k'urubuga rwasohotse kagera ku bice 76.000 ku isaha byo gushyiramo SMT, 54.000 ku isaha byo gushyiramo die attach muri wafer na 51.000 ku isaha byo gushyiramo flip-chip. Umusaruro nyakuri uterwa n'imiterere y'imashini n'umusaruro.

Ese uburyo bumwe bwa CA2 bushobora gukoresha ubwoko butandukanye bwa wafer?

Hamwe n'uburyo bwo guhinduranya wafer bukoreshwa, urubuga rushobora kwakira wafer zitandukanye zigera kuri 50. Ibi bishyigikira ibicuruzwa bihuza ubwoko butandukanye bw'udupira, hakurikijwe sisitemu ya wafer yashyizweho na porogaramu.

Gukurikirana ibintu mu buryo bumwe bisobanura iki?

Bivuze ko ikintu kimwe gishobora guhuzwa n’aho gifatiwe ku gikoresho cyo gufatiraho ifu kikagera aho gishyirwa ku gikoresho cya nyuma, hamwe n’amakuru ajyanye n’umusaruro n’igenzura.

Ese CA2 ishobora gusimbura buri mashini yagenewe gutwara abantu?

Oya. Porogaramu zisaba imbaraga zihariye zo guhuza, gushyushya, gukonjesha, gutanga cyangwa gufunga ibintu bitari mu rwego rwashyizweho zishobora gusaba ibikoresho byihariye byo guteranya ibikoresho bya semiconductor.

Ese CA2 ishobora gukoreshwa hamwe na mikoroni ya SIPLACE TX?

Yego. Imashini zishobora gushyirwa mu murongo umwe wo gukora SiP, hamwe n'uburyo bwo gushyiramo ibikoresho byihuta cyane cyangwa neza cyane bingana n'uburyo bwo gushyiramo ibikoresho mu buryo butaziguye n'uburyo bwo gushyiramo ibikoresho mu buryo buvanze.

Ni ayahe makuru akenewe kugira ngo imashini ya CA2 ihuze n'iyakoreshejwe?

Tanga ibisobanuro bya diye na wafer, ingano ya substrate, ukuri gukenewe, urwego rw'ibice, umusaruro w'intego, ibyo kohereza ibicuruzwa bikunda, amahitamo yo gukora, ibisabwa mu gukurikirana, imiterere y'imashini wifuza n'aho ijya.

Suzuma SIPLACE CA2 kugira ngo umenye uburyo bwo gupakira ibintu mu buryo bugezweho

Ohereza imiterere ya wafer, ingano ya die, ingano ya substrate, imvange y'ibice, intego yo gukora neza, umusaruro witezwe hamwe n'amahitamo asabwa yo gusuzuma imiterere.

Saba Isuzuma ry'Igenamiterere