Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

The ASM SIPLACE CA2 is a hybrid placement machine that combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing.

Why not use a conventional SMT machine for bare dies?

Direct wafer processing requires wafer-map data, die separation, ejector and flip functions, die buffering, specialized inspection and die-level traceability beyond normal feeder-based placement.

Can the SIPLACE CA2 process SMDs and bare dies on the same substrate?

Yes. The platform is designed to place feeder-supplied SMD components and bare dies taken directly from sawn wafers within one coordinated production flow.

Does direct wafer pickup eliminate die taping?

It can eliminate the need to convert applicable dies into tape before placement, subject to wafer format, die condition, known-good-die data and the installed wafer configuration.

How does the SIPLACE CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation so dies can be detached and prepared while other placement operations continue.

What is the maximum published placement performance of the SIPLACE CA2?

Published platform values reach up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach from wafer and 51,000 dies per hour for flip-chip placement.

Can one SIPLACE CA2 setup use several different wafer types?

With the applicable wafer exchange configuration, the platform can hold up to 50 different wafers for multi-die production.

What does single-die-level traceability mean?

It means an individual die can be linked from its pickup position on the source wafer to its final placement position on the substrate together with relevant production data.

Can the SIPLACE CA2 replace every dedicated die bonder?

No. Processes requiring specialized bonding force, heating, curing, dispensing or unsupported die formats may still require dedicated semiconductor assembly equipment.

Can the SIPLACE CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line to balance feeder placement with direct-wafer and hybrid placement operations.

What information is needed to match a used SIPLACE CA2 machine?

Provide the die and wafer specifications, substrate dimensions, required accuracy, component range, target output, conveyor preference, process options, machine condition and destination.

Direct-Wafer Placement okusobola okupakinga eby’omulembe

ASM SIPLACE CA2Die Attach & Flip-Chip Okukola eddagala

SIPLACE CA2 yakolebwa ku bintu ebitakyayingira bulungi mu layini ya SMT eya bulijjo oba mu nkola ya die-bonding eyeetongodde. Egatta okuteeka SMD okusinziira ku feeder n’okulonda obutereevu semiconductor dies okuva mu sawn wafers, kisobozesa SiP n’abakola ebintu eby’omulembe okuddukanya ebitundu ebitabuddwa, die attach, flip-chip placement, okwekebejja n’okulondoola munda mu nkola emu ey’okufulumya eyungiddwa.

Kebera Enkola Fit Teesa ku Nsengeka ya CA2

Okutuuka ku 76,000 cphOkuteeka SMT Okusinziira ku Feeder

Okutuuka ku 54,000 cphDie Attach okuva mu Wafer

Okutuuka ku 51,000 cphFlip-Chip okuva mu Wafer

Wansi okutuuka ku 10 μmEkibiina ky’obutuufu ku 3 Sigma

Ekizibu ky’okukola ebintu

Lwaki SIPLACE CA2 Eriwo

Module za System-in-Package n’ebintu ebirala eby’amasannyalaze eby’omulembe bitera okugatta amaka g’ebintu abiri ag’enjawulo ennyo ku substrate emu: ebitundu bya SMD ebya bulijjo ebiweebwa mu reels, ne dies za semiconductor ezitapakibwa eziweebwa ku wafers ezisaliddwa. Okufulumya okw’ekinnansi kwawula ebintu bino wakati w’ekyuma ekiteeka SMT ne die bonder.

Okwawula okwo kuyinza okuleeta okukyusa ebintu ebirala, okutereka okw’omu makkati, okutambuza ebintu, embeera za pulogulaamu n’enkolagana z’okulondoola. Bare dies ziyinza okwetaaga okukyusibwa mu tape nga tezinnaba kuyingira mu nkola eyesigamiziddwa ku feeder, ate nga ebintu ebitabuddwa bitambula wakati w’ebyuma ebikoleddwa okwetoloola emisingi egy’enjawulo egy’okufulumya.

ASM SIPLACE CA2 ye nkola ya hybrid placement platform eyatondebwawo okuziba ekituli kino.Ereeta enkwata ya direct-wafer die mu mbeera y’okufulumya etunuulidde SMT, kale ebitundu by’emmere, emirimu gy’okuyunga die ne flip-chip bisobola okukwasaganyizibwa okwetoloola okutambula kw’ebintu kwe kumu.

Kiki ekikyuka nga dies ziyingira mu layini ya SMT?

Dies ezimanyiddwa-obulungi zisobola okulondebwa butereevu okuva mu mawulire aga wafer-map.
SMDs eziweebwa feeder ne dies eziweebwa wafer zisobola okuteekebwa ku substrate emu.
Okuteekateeka n’okuteeka die kuyinza okufaanana nga tuyita mu buffering.
Buli die esobola okuyungibwa okuva mu kifo kyayo ekya wafer okutuuka mu kifo kyayo ekisembayo ekya substrate.
SMT ne semiconductor communication interfaces zisobola okwetaba mu kutambula kw’ekkolero okumu okuyungiddwa.

Okusalawo ku nkola

SIPLACE CA2 Ekola Ddi Amakulu?

Enkola za CA2 ezisinga amaanyi tezitegeezebwa linnya lya package limu. Zitegeezebwa okugatta ensibuko y’ebintu, ensengeka y’enkola, obutuufu, okulondoola n’obunene bw’okufulumya.

✓

Enywevu CA2 Fit

Ekintu kye kimu kikozesa SMD zombi eziweebwa feeder ne bare dies.
Dies zirina okulondebwa butereevu okuva mu wafer emu oba eziwera ezisaliddwa.
Okukola mulimu die attach, flip chip oba enkola zombi.
Ebika bya die ebingi birina okukyusibwa awatali kukwata nnyo mu ngalo.
Okuteeka kyetaagisa ebika by’obutuufu bwa 20 μm, 15 μm oba 10 μm.
Okulondoola die ssekinnoomu kwetaagisa okuva ku wafer okutuuka ku kintu ekiwedde.
Omukozi ayagala okukendeeza ku die taping n’okutambuza ebintu ebikwatagana nabyo.
Layini erina okuyungibwa ku nkola za SMT ne semikondokita ez’amakolero.

Kyetaaga Okwekenenya Enkola Okwongerako

Enkola eno yeetaaga okubugumya okw’enjawulo, okuwonya oba amaanyi ag’okusiba amangi.
Ebipimo bya die oba obuwanvu bugwa ebweru w’ekifo ky’okukwata ekiteekeddwamu.
Ekintu kyetaaga emirimu gy’okugaba oba egy’okusiba egitassiddwa ku kyuma.
Substrate yeetaaga carrier oba transport mode etali mu configuration.
Omuwendo gw’ebintu ebikolebwa mutono nnyo okusobola okulaga obutuufu bw’omukutu ogw’amaanyi ogugatta.
Entambula y’ekkolero eriwo ezimbiddwa okwetoloola obutoffaali obukwatagana obufa (die-bonding cells) obwetongodde.
Okukebera oba okupima okwetaagisa kulina okukolebwa ku byuma eby’enjawulo eby’ekikugu.
Ekyuma ekikozesebwa ekiriwo tekirina wafer, head oba software ezeetaagisa.

Enzimba y’Ekyuma

Enkola Ttaano Ezitegeeza Obusobozi bw’Enkola ya CA2

Erinnya ly’ekyokulabirako liraga ekifo, naye enkola zino eziteekeddwawo ze zisalawo engeri ekyuma kinnoomu gye kiyinza okukolamu ddala wafers, components ne substrates.

01 / OKUTINGA EBINTU

SMT Feeders ne Trays

Feeders ezikwatagana ziwa passives ne semiconductors ezipakiddwa, ate tray ne carrier options ezirondeddwa ziwagira component formats endala.

02 / OKUKWATA KU WAAFER

Enkola y’okuwanyisiganya Wafer

Enkola ya wafer etereka era n’eyanjula ebika bya wafer ebingi, okusobozesa ebintu ebirimu bare dies ez’enjawulo eziwerako.

03 / ENKOZESA YA PARALLEL

Enkola ya Buffering

Okwawula n’okuteekateeka die kuyinza okutambula nga kukwatagana n’okuteekebwa, okukendeeza ku kibonerezo kya sipiidi ekitera okukwatagana n’okukwata wafer obutereevu.

04 / OKUTEEKAWO

CP20 Ensengeka y’omutwe

Emitwe egy’amaanyi gikwata ebitundu ebitonotono n’ebikwata ku nsonga nga girina pickup etakwatako, okugiteeka okufugibwa n’ebibinja by’obutuufu okutuuka ku 10 μm.

05 / OKUFUGA ENKOZESA

Okukebera n’okulondoola

Component sensing, die-condition checks, dipping inspection ne production data biwagira ebiwandiiko by’amakungula ebitebenkedde n’eby’omutindo gw’okufa.

Entambula y’okukuŋŋaanya eby’omugatte

Engeri Ekintu Ekitabuddwamu SMD ne Bare-Die gye Kitambulamu Mu CA2

Omutendera omutuufu gukyuka okusinziira ku kikolebwa, naye enkola mu budde obutuufu egatta okuzuula ebintu, okukwata obutereevu wafer, okuteeka mu butuufu n’ebiwandiiko by’okufulumya.

Tikka Data y'Ebintu

Pulogulaamu za substrate, data y’ebitundu, maapu za wafer, parameters z’enkola n’ebyetaago by’okulondoola bitegekebwa.

Tegeka Ebikozesebwa

SMD reels, trays, wafers, wafer frames, nozzles n’ebikozesebwa mu kunnyika biweebwa enteekateeka y’okufulumya.

Londa Ebifa Ebimanyiddwa-Ebirungi

Enkola ya wafer ezuula wafer eyeetaagisa era ekozesa data ya maapu okulonda dies ezikozesebwa ku kintu.

Buffer ne Orient Ebifa

Dies zikutulwamu, zeekebejjebwa, ziteekebwa mu buffer ne zifuumuulwa nga assembly yeetaaga okuyungibwa face-down.

Teeka Ebitundu Ebitabuddwamu

Ebitundu bya feeder ne wafer dies biteekebwa nga tukozesa SMT etegeerekese, die-attach, flip-chip oba dipping sequence.

Okuwandiika Data y’Enkola

Ensibuko y’okusitula, ebyava mu kukebera n’ekifo ekisembayo okuteekebwa bisobola okuyungibwa ku substrate ne likoda y’okufulumya.

Ebiwandiiko bya Platform Ebifulumiziddwa

ASM SIPLACE CA2 Ebikwata ku by’ekikugu

Emiwendo egyafulumiziddwa ginnyonnyola obusobozi bwa CA2 platform obuliwo. Omulimu gwennyini gusinziira ku head set etekeddwa, accuracy package, wafer modules, conveyor, component mix n’enkola y’okulonda.

Ekintu eky’ekikugu	Obusobozi obufulumiziddwa	Lwaki Kikulu
Sipiidi y’okuteeka SMT	Ebitundu ebituuka ku 76,000 buli ssaawa	Awagira okuteeka mu bungi obw’amaanyi (high-volume placement of feeder-supplied passives) n’ebitundu ebipakiddwa.
Die attach okuva mu wafer	Abantu abawera 54,000 be bafa buli ssaawa	Esobozesa okuteeka direct-wafer face-up die nga tewali nkola ya taping eya wakati.
Okuteeka flip-chip okuva mu wafer	Abantu abawera 51,000 be bafa buli ssaawa	Awagira okuteeka dies ku sipiidi ey’amaanyi ng’oludda oluyungibwa lutunudde mu substrate.
Ebika by’obutuufu	20 μm, 15 μm ne 10 μm ku 3 sigma	Akkiriza okukwatagana kw’enkola ku sayizi za die ez’enjawulo, ebisaawe, dayamita z’omupiira n’okugumiikiriza kwa substrate.
Obusobozi bwa wafer	Wafers ez’enjawulo eziwera 50	Ewa obusobozi bwa multi-die ku bintu ebirimu emirimu gya semiconductor egiwerako.
Okuwanyisiganya wafer	Sikonda ezitakka wansi wa 13	Kikendeeza ku kulwawo kw’okukyusa ebintu mu bintu ebikyukakyuka wakati w’ensibuko za wafer eziwera.
Enkola ya substrate eya layini emu	Okutuuka ku mm 620 × 700, okusinziira ku nsengeka	Awagira panels, embedded PCBs ne substrates ennene ez’enjawulo.
Enkola ya substrate ey’emirongooti ebiri	Okutuuka ku mm 375 × 260 mu mbeera eya mutindo eragiddwa	Awagira entambula ya parallel ku PCBs eza standard ne SiP substrates.
Ebipimo by’ekyuma	Nga 2.56 × 2.50 × 1.85 m	Ewa omusingi gw’okuteekateeka wansi, okuyingira n’okuddamu okwetegereza ensengeka ya layini.
Enkola z’empuliziganya	IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 ne SECS/GEM	Eyunga ekyuma n’enkola za SMT line control ne semiconductor factory systems.
Embeera y’okufulumya ebintu	Class 7 cleanroom ekwatagana n'obuyambi bwa SEMI S2/S8	Awagira okuteeka mu nkola mu bitundu ebifugibwa eby’okupakinga eby’omulembe n’okufulumya semikondokita.

Ekyuma ekiweereddwa kirina okukeberebwa okusinziira ku kipande kyakyo, emitwe egyateekebwamu, kiraasi y’obutuufu, enkola ya wafer, enteekateeka y’okutambuza, layisinsi za pulogulaamu ne modulo z’enkola. Platform maximums tezinnyonnyola buli yuniti ssekinnoomu mu ngeri ya otomatiki.

Obutuufu n’Entambula

Enkyukakyuka mu sayizi ya substrate n’ekikula ky’obutuufu ekyetaagisa

Enkola esinga obunene ewagirwa n’obutuufu obusinga okunywevu tebutera kubeerawo ku kifo kye kimu eky’okukoleramu. Enkolagana eno erina okwekenneenya nga tonnalonda kyuma.

Conveyor / Enkola y'okukola	Ekibiina ky’Obutuufu	Ensengeka ya Substrate efulumiziddwa	Ensonga eya bulijjo ey’okuddamu okwetegereza
Ekyuma ekitambuza ebintu ekya layini emu	20 μm @ 3 sigma nga bwe kiri	Okutuuka ku mm 620 × 700	Ebipande ebinene n’ensengeka za embedded-board.
Ekyuma ekitambuza ebintu ekya layini emu	15 μm @ 3 sigma nga bwe kiri	Okutuuka ku mm 620 × 700	Enkola ennene nga erina ebisaanyizo ebinywevu eby’okuteeka.
Mode ya quadrant eya layini emu	12 μm @ 3 sigma nga bwe kiri	Okutuuka ku mm 620 × 700, nga zikeberebwa n’ekitundu kya mm 300 × 300	Kakasa ensengeka y’ebintu okusinziira ku kifo we bakolera ekirina ebisaanyizo.
Ekyuma ekitambuza ebintu ekya layini emu	10 μm @ 3 sigma nga bwe kiri	Okutuuka ku mm 300 × 300	SiP ey’obutuufu obw’amaanyi n’okukozesa die eziteekeddwa mu bbanga erinywevu.
Ekyuma ekitambuza ebintu nga kiriko emirongooti ebiri	20 μm @ 3 sigma nga bwe kiri	Okutuuka ku mm 375 × 260	Okukola PCB oba SiP ey’omutindo ogukwatagana.
Dual nga mode ya layini emu	20 μm @ 3 sigma nga bwe kiri	Okutuuka ku mm 375 × 430	Enkola egaziyiziddwa nga tukozesa ekifo eky’okutambuza ebintu bibiri.
Ekyuma ekitambuza ebintu nga kiriko emirongooti ebiri	15 μm oba 10 μm @ 3 sigma	Okutuuka ku mm 250 × 100	Substrates entono ezeetaaga kiraasi y’obutuufu obunywevu.

Okugeraageranya Enkola y’Ebifulumya

Engeri ssatu ez’okukuŋŋaanya ekintu ekitabuddwamu SMD ne Bare-Die Product

CA2 y’emu ku nsengeka y’okufulumya esoboka. Ekkubo erisinga obulungi lisinziira ku buzibu bw’ebintu, obungi, ebyuma ebiriwo n’emirimu gy’enkola egyetaagisa.

Oluguudo lwa A

Obutoffaali bwa SMT ne Die-Bonding obw’enjawulo

Ebitundu ebipakiddwa n’ebifa ebitaliiko kintu kyonna bikolebwa ku bifo eby’ebyuma ebyetongodde.

Omugaso nga emirimu egy’ekikugu egy’okusiba (special die-bonding functions) gifuga
Akkiriza okulongoosa ebyuma ebyetongodde
Yeetaaga okukyusa n’okulondoola enkola ezisalako
Ayinza okwetaaga ekifo ekiwera wansi n’okukwata wakati

Oluguudo B

Tape the Dies okusobola okuteeka SMT

Bare dies zikyusibwa ne zifuuka feeder-compatible tape format nga tezinnaba kukuŋŋaanyizibwa.

Akozesa okutambula kw’ebintu ebimanyiddwa nga byesigamiziddwa ku feeder
Ayongerako emirimu gy’okukuba obutambi, okutereka n’okulondoola omutindo
Akola ebintu ebitwala n’ebyetaago by’okusuula
Ayinza okukomya okukyukakyuka nga ebika bya die bingi bye bikwatibwako

Oluguudo lwa C

Okuteeka obutereevu-Wafer Hybrid

CA2 ekola ku SMDs okuva mu feeders era efa butereevu okuva mu wafers mu platform emu eyungiddwa.

Kikendeeza ku kukyusa die n’okukwata wakati
Awagira okukola multi-wafer ne multi-die
Ayunga likodi za die n'ebifo ebisembayo eby'okuteekebwa
Yeetaaga ensengeka entuufu eya wafer, omutwe n’enkola

Enzimba ya Production-Line

CA2 Esobola Okukola nga Hybrid Process Center ya SiP Line

Ku kukola SiP ey’obunene obusingako, CA2 esobola okugattibwa ne SIPLACE TX micron oba ebyuma ebirala ebituufu ebya layini. Okuteeka feeder ku sipiidi ey’amaanyi, okukola direct-wafer n’okukebera olwo bisobola okutebenkeza mu byuma ebiyungiddwa mu kifo ky’okukaka buli mulimu okuyingira mu siteegi emu.

Omutendera 01Okukuba ebitabo oba Okukozesa Ebikozesebwa

Solder paste, adhesive oba flux esiigibwako ne yeekebejjebwa okusinziira ku nkola.

Omutendera 02Okuteeka SMD ku Sipiidi Ennene

Ebitundu ebikozesa emmere nnyingi bisobola okuteekebwa ku pulatifomu ey’embiro empanvu (balanced high-speed platform).

Omutendera 03CA2 Wafer ne Hybrid Okuteekebwa

Direct-wafer dies, flip chips n’emitendera egy’enjawulo egy’okuteeka mu bitabuddwa biwedde.

Okukozesa Fit

Ebintu Ebiganyulwa mu Kuteekebwamu Direct-Wafer ne Mixed-Component

CA2 esinga kuba ya muwendo nga ensengeka z’ebitundu eziwerako zirina okukwasaganyizibwa n’obutuufu obw’amaanyi, ebifulumizibwa ebingi n’ebiwandiiko by’ebintu ebikwata ku nsonga eno mu bujjuvu.

Module z’enkola-mu-Package

Processors, memory, RF dies, packaged ICs ne passives ezikuŋŋaanyiziddwa ku common compact substrate.

Enkuŋŋaana za Semiconductor ez’Amaanyi

Amasannyalaze agafa n’ebitundu bya SMD ebiwagira ebiteekebwa ku substrates ez’enjawulo ez’enkola z’emmotoka n’amasoboza.

Okupakinga ku ddaala lya Wafer

Okuteeka die mu ngeri entuufu n’enkola y’emirimu eya chip-on-wafer ezeetaaga okukwata wafer okufugibwa.

Okupakinga ku mutendera gwa Panel

Ebipande ebinene n’ebizimbe ebiteekeddwamu ebyetaagisa entambula entuufu n’okuteeka ebitundu.

Sensor n’Empuliziganya Modules

Ebintu ebitonotono ebigatta bare sensing oba RF dies ne control ICs ne passive components.

Ebintu bya PCB Ebiteekeddwamu

Bare dies eziyungiddwa mu oba ku bizimbe eby’omulembe ebya printed-circuit nga zirina ebyetaago eby’enjawulo eby’okuzikwata.

Ennyonyola y’okusengeka

Ebitundu bina by’olina okulambika nga tonnakwataganya kyuma kya CA2

Okulonda okwesigika kutandikira ku kintu n’enkola egenderere, so si muze gw’ekyuma gwokka.

Ebikozesebwa

Lambulula ebipimo bya die, obuwanvu, wafer diameter, wafer-map format, SMD package range, obugazi bwa tape n’omuwendo gw’ebika bya die.

Obutuufu n’Ebifulumizibwa

Kakasa okugumiikiriza okuteekebwa, ekisaawe ky’okukuba oba omupiira, ekiruubirirwa ekifulumizibwa buli ssaawa, okutabula ebintu n’emirundi gy’okukyusaamu egisuubirwa.

Entambula ya Substrate

Laga ebipimo bya substrate, obuwanvu, warpage, carrier design, single- oba dual-lane flow n’obulagirizi bw’okutikka.

Okufuga Enkola

Lambulula ebyetaago by’okunnyika, okwekebejja, okulondoola, ekisenge ekiyonjo, empuliziganya mu kkolero n’ebyetaago bya loopu enzigale.

Okukakasa Ebikozesebwa

Biki Ebirina Okukeberebwa ku SIPLACE CA2 Eriwo

Ebyuma bibiri ebitwala erinnya lye limu erya CA2 model bisobola okuwagira enkola ez’enjawulo. Ensengeka enzijuvu etekeddwa erina okwekenneenya nga tonnaba kujuliza, kusengulwa oba kutegeka layini.

Endagamuntu y’ekyumaEnsengeka enzijuvu, ennamba ya serial, omwaka gwe yakola, ekipande ky’erinnya n’ebyafaayo by’emirimu.

Emitwe gy’okuteekaYassibwamu emitwe gya CP20, ebiwandiiko ebiraga emitwe, essaawa z’okukola, enkolagana ya nozzle n’amawulire agakwata ku kalifuuwa agaliwo.

Ekibiina ky’obutuufuensengeka ya 20 μm, 15 μm oba 10 μm n’ekifo ekikwatagana n’okukoleramu ebisaanyizo.

Ebikozesebwa mu kukola waferWafer exchange unit, wafer frames eziwagirwa, ejector, buffer, flip unit n’obusobozi bwa wafer-map.

Enkola ya conveyorEnteekateeka za layini emu, ez’emirongooti ebiri, okuva mu kkono/okufuluma oba ez’enjawulo ez’okusitula n’okussa wansi.

Module z’enkolaLinear dipping unit, component sensing, okukebera die, okukebera ku mmeeri n’okulonda okulondoola.

Sofutiweya ne interfacesEnkyusa ya pulogulaamu essiddwawo, layisinsi, SECS/GEM, CFX, HERMES n’okugatta okufulumya-data.

Obunene bw’okugabira abantu ebintuFeeders, nozzles, wafer accessories, ebiwandiiko, sipeeya, amawulire agakwata ku kugezesa n’okupakinga ebweru w’eggwanga.

Obuwagizi bw'Ebyuma n'Ebitundu

Ebikozesebwa mu byuma ebikwatagana ku Pulojekiti ya CA2

Okulonda ebyuma kulina okukwasaganyizibwa n’emmere ezeetaagisa, ebyuma bya wafer, emitwe gy’okuteeka, entuuyo n’enkola egyetoolodde ey’okupakinga eby’omulembe.

Ekika ky’Ebyuma

Ebikozesebwa mu Die Bonder

Weekenneenye ebyuma ebirala ebya semiconductor die-attach n’eby’omulembe-okupakinga ku byetaago by’enkola eby’enjawulo.

Yeekenneenya Aba Bonders → Okugaba Ebikozesebwa

ASM SIPLACE Ebiweebwayo

Okukwataganya obugazi bwa tape, obungi bw’emmere n’ebyetaago by’okugabira ebitundu ku ludda lwa SMT olw’enkola.

Laba Ebiweebwayo bya ASM → Obuwagizi bw'okusengeka

CA2 Ekyuma n'Ebitundu Ebikwatagana

Waayo enkola, wafer, die, substrate n'obutuufu obwetaagisa ekyuma n'okukyusa-ebitundu okwekenneenya.

Teesa ku Kyetaagisa Kyo →

Ebibuuzo Ebitera Okubuuzibwa

SIPLACE CA2 Ebibuuzo by’enkola n’okusengeka

Eby’okuddamu eri ttiimu ezeekenneenya ekyuma kino okuteekebwa butereevu mu wafer, okukola SiP n’okupakinga okw’omulembe.

ASM SIPLACE CA2 kyuma kya SMT oba die bonder?

Kye kyuma ekiteeka ebintu mu bifo eby’enjawulo (hybrid placement machine). Egatta okuteeka ebitundu bya SMT ebisinziira ku feeder n’okukola direct-from-wafer die attach ne flip-chip processing, kale ekola mu mbeera zombi ez’okukola.

Lwaki tokozesa kyuma kya SMT ekya bulijjo ku bare dies?

Ekyuma kya SMT ekya bulijjo mu budde obutuufu kikola bulungi ku bitundu ebiweebwa mu feeder oba trays. Okukola obutereevu wafer kyetaagisa data wafer-map, okwawula die, emirimu gya ejector ne flip, die buffering, okwekebejja okw’enjawulo n’okulondoola die-level.

CA2 esobola okukola SMDs ne bare dies ku substrate emu?

Yee. Obusobozi buno obw’ebintu ebitabuddwa kye kigendererwa ekikulu eky’omukutu. Omutendera omutuufu gusinziira ku feeder eziteekeddwawo, enkola ya wafer, emitwe gy’okuteeka, modulo z’enkola ne pulogulaamu y’ebintu.

Direct wafer pickup emalawo die taping?

Kiyinza okumalawo obwetaavu bw’okukyusa dies ezikozesebwa okuzifuula tape nga tonnaba kuziteeka. Oba kino kisaanira kisinziira ku nkola ya wafer, embeera ya die, data emanyiddwa-good-die n’ensengeka y’okukwata wafer essiddwawo.

CA2 ekuuma etya sipiidi nga elonda dies okuva mu wafer?

Platform ekozesa die buffering ne parallelized okuteekateeka. Dies zisobola okwawulwa ne zitegekebwa ng’omutwe gw’okuteeka gugenda mu maaso n’okukola ku bitundu ebirala, ekikendeeza ku kulwawo okukwatagana n’okusitula wafer obutereevu.

Omulimu ogusinga obunene ogw’okuteekebwa mu kifo ogufulumiziddwa gwe guliwa?

Emiwendo gya pulatifomu egyafulumiziddwa gituuka ku bitundu 76,000 buli ssaawa okuteeka SMT, 54,000 dies buli ssaawa ku die attach okuva mu wafer ne 51,000 dies buli ssaawa okuteeka flip-chip. Ebifulumizibwa ebituufu bisinziira ku nsengeka y’ekyuma n’ekintu ekikolebwa.

Setup emu eya CA2 esobola okukozesa ebika bya wafer eby’enjawulo ebiwerako?

Nga olina ensengeka y’okuwanyisiganya wafer ekolebwa, omukutu guno gusobola okukwata wafers ez’enjawulo eziwera 50. Kino kiwagira ebintu ebigatta ebika bya die ebiwerako, nga bigoberera enkola ya wafer essiddwawo n’okuteekawo pulogulaamu.

Okulondoola okw’omutendera gw’okufa omulundi gumu kitegeeza ki?

Kitegeeza nti die ssekinnoomu esobola okuyungibwa okuva mu kifo kyayo eky’okusitula ku wafer y’ensibuko okutuuka mu kifo kyayo ekisembayo eky’okuteekebwa ku substrate, awamu n’ebikwata ku kukola n’okukebera.

CA2 esobola okukyusa buli die bonder eyeetongodde?

Nedda.

CA2 esobola okukozesebwa ne SIPLACE TX micron?

Yee. Ebyuma bisobola okutegekebwa mu layini y’emu ey’okufulumya SiP, nga n’okuteeka emmere ey’amaanyi oba ey’obutuufu obw’amaanyi ng’ekwatagana n’emirimu gy’okuteeka obutereevu-wafer ne hybrid.

Mawulire ki ageetaagisa okukwatagana n’ekyuma kya CA2 ekikozesebwa?

Okuwa ebikwata ku die ne wafer, ebipimo bya substrate, obutuufu obwetaagisa, ekitundu ekiwanvu, target output, conveyor preference, enkola options, traceability requirements, preferred ekyuma embeera n'ekifo.

Weekenneenye SIPLACE CA2 ku nkola yo ey’okupakinga ey’omulembe

Sindika ensengeka ya wafer, ebipimo by’okufa, obunene bwa substrate, okutabula ebitundu, ekiruubirirwa ky’obutuufu, ebisuubirwa ebifulumizibwa n’enkola ezeetaagisa okulonda okwekenneenya ensengeka.

Saba Okuddamu Okusengeka